IPC Standards

Whether you need a complete collection of IPC documents, a custom collection of standards that you choose, or the entire set of training videos covering electronics assembly, IPC A-610 training, ESD Control, lead-free manufacturing, soldering, wire harness, rework, SMT, through hole, component identification, quality and safety, Electronics.ca Publications has a solution to meet your needs.
 
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US$160.00
Date of Publication: Nov 2, 2012
¡NUEVO! Incluye criterios ampliados para el moldeado, encapsulado, empalmes, contactos de compresión sin soporte de aislamiento, conectores en línea con desplazamiento del aislamiento, conectorización, cables rígidos y flexibles, fundas flexibles, atados múltiples estilo retama, pruebas y mucho más.

US$160.00
Date of Publication: Dec 22, 2014
This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision F, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space.

US$85.00
Date of Publication: Jul 22, 2015
This publication is intended to characterize the fracture strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. Includes the amendment to Section 8.7-Test Board Daisy-Chain Links. 

US$85.00
Date of Publication: Sep 28, 2015
This standard establishes a Market Classification System and Level Classification System for printed electronics assemblies and provides a list of performance criteria and testing methods. It provides a standardized product category structure for designing and manufacturing printed electronics and assemblies which conform to industry-established performance metrics as determined by accepted testing methods.

US$160.00
Date of Publication: Feb 19, 2015
IPC J-STD-001F是全球公认的唯一一份达成行业共识的涵盖焊接材料和工艺的标准。F版本既支持传统焊料合金制造,也支持无铅制造。显著变化的例子如新版本修订了镀覆孔(PTH)的最小填充的要求、两种新型SMT焊端的要求以及敷形涂覆的要求。

US$234.00
Date of Publication: Jul 30, 2015
IPC J-STD-001F ist weltweit anerkannt als einzige, im Industrie-Konsens entwickelte Richtlinie für Lötmaterialien und -prozesse. Diese Ausgabe umfasst die Unterstützung für herkömmliche Lotlegierungen und für bleifreie Produktion. Beispiele für einige der wichtigsten Änderungen sind die Überarbeitung der Verfüllanforderungen für durchmetallisierte Löcher (PTH): Kriterien für zwei neue SMT-Anschlusstypen und erweiterte Konformitäts-Kriterien für die Schutzbeschichtung. Wenn möglich wurden die Beschreibungen der Kriterien überarbeitet, um die Anforderungen an Materialien, Methoden und Überprüfungen zur Produktion hochwertiger Lötverbindungen und Baugruppen leichter verstehen zu können.

US$160.00
Date of Publication: Jul 30, 2015
IPC-A-610 là bộ tiêu chuẩn cho các lắp ráp điện tử được sử dụng rộng rãi nhất trên thế giới. Là một bắt buộc cho các bộ phận đảm bảo chất lượng sản phẩm và lắp ráp sản phẩm, IPC-A-610E minh họa các tiêu chuẩn công nghiệp chấp nhận sản phẩm cho các lắp ráp điện tử bằng các hình ảnh minh họa màu sắc. Phiên bản này bao gồm hai kiểu bản cực SMT, cũng như những thay đổi ở các tiêu chuẩn chấp nhận cho yêu cầu điền chất hàn vào lỗ đâm xuyên có mạ và yêu cầu về lỗ rỗng cho các banh hàn của BGA. Thêm vào đó, các sửa đổi về cách thức diễn đạt các chi tiết nhằm làm việc đọc hiểu bộ tài liệu được dễ dàng và dễ hiểu hơn – tất cả những điểm này không loại bỏ đi những yêu cầu.

US$45.00
Date of Publication: Jun 8, 2015
Now updated to Revision F  of the latest IPC-A-610  and J-STD-001  this  Training & Reference Guide  illustrates critical...

US$304.00
Date of Publication: Feb 18, 2015
IPC 7711/21B-CN...

US$85.00
Date of Publication: Oct 20, 2014
IPC-J-STD-006C-CN 本标准规定了应用于电子焊接领域的电子级焊料合金、含助焊剂与不含助焊剂的棒状、带状、丝状、粉末状焊料及“专用”电子级焊料的命名原则、要求及测试方法。本标准是一个质量控制标准,无意直接关联制造工艺中材料的性能。对于应用于非电子领域的焊料,应该按照ASTM...

US$85.00
Date of Publication: Mar 12, 2008
J-STD-020D.1新增了无铅组装所用元器件的相关内容!本标准的目的是确定对湿气诱发应力敏感的非气密固态表面贴装器件(SMD)的潮湿敏感等 级。它可用于确定SMD封装的初始可靠性认证应该采用的分级等级。从而能够对这些器件进行正确地包装、存储和操作,以避免其在随后的再流焊接操作时受到热...

US$85.00
Date of Publication: Feb 12, 2013
IPC J-STD-033C-CN 本文件的目的是,针对潮湿/再流焊敏感表面贴装器件,向生产商和用户提供标准的操作、包装、运输及使用方法。所提供的这些方法可避免由于吸收湿气和暴露在...

US$152.00
Date of Publication: Jul 4, 2008
IPC-T-50H-CN 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂,可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语,新术语...

US$119.00
Date of Publication: Nov 4, 2008
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component...

US$119.00
Date of Publication: Mar 7, 2007
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment...

US$152.00
Date of Publication: Dec 12, 2012
本标准规定了高质量焊接互连用助焊剂的分类和特性描述的通用要求。本标准可用于助焊剂的质量控制和采购用途。本标准的目的是对印制电路板组件中电子装联所 用的锡/铅和无铅焊接助焊剂材料进行分类和描述。这些焊接助焊剂材料包括:液态助焊剂、膏状助焊剂、焊膏、外涂助焊剂以及含助焊剂芯的焊丝和预成形焊料。...