IPC-TP-1115 Selection and Implementation Strategy for A Low Residue No Clean Process

IPC-TP-1115 Selection and Implementation Strategy for A Low Residue No Clean Process

Date of Publication: Dec 1, 1998, 120 Pages
US$136.00
IPC-TP-1115

IPC-TP-1115 provides direction to electronics manufacturers interested in adopting low residue (LR) no-clean assembly technology. It addresses the concerns of transitioning from operations with post solder cleaning and no-clean using standard residue-level (SR) materials. Includes 13 technical papers and presentation materials from the IPC No-Clean Conference. 120 pages.

Date of Publication:
Dec 1, 1998
File Format:
Print Copy
Number of Pages:
120 Pages
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