IPC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology

IPC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology

Date of Publication: Jan 30, 1989
US$77.00
IPC-TR-001

IPC-TR-001 document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989. Included in the IPC-C-103 and the IPC-C-1000 Collections.

Date of Publication:
Jan 30, 1989
File Format:
Non-Printable CD-ROM
Type the characters you see in the picture above.