IPC-TR-482 New Developments in Thin Copper Foils

IPC-TR-482 New Developments in Thin Copper Foils

Date of Publication: Jan 1, 1976, 104 Pages
US$136.00
IPC-TR-482

This test report is a compendium of technical methods and techniques used for evaluating the quality aspects of present and future interconnection products and electronic assemblies. The report addresses base materials, conductor physical requirements, internal planes, construction, registration, plated through-holes, component mounting areas, cleaning evaluation, solder mask, and printed board electrical requirements. Not available in electronics format. 104 pages. Released January 1976.

Date of Publication:
Jan 1, 1976
File Format:
Print Copy
Number of Pages:
104 Pages
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