This document provides tests that record changes in surface insulation resistance (SIR) on a representative sample of a printed circuit assembly. It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electrochemical reactions that grossly affect reliability. It uses test vehicles that are intended to be representative of the electronic circuits that are in production and is a test yielding both quantitative and qualitative data. This test may be used for process qualification, demonstrating that a proposed manufacturing process or process change can produce hardware with acceptable end-item performance related to cleanliness. This test may also be used for process characterizations, including development of new processes or improvements to an existing process. 11 pages.