IPC-J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Date of Publication: Feb 13, 2003, 13 Pages
US$52.00
IPC-J-027(E)1

IPC-J-STD-027 standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls-bumps-lands to the next level. 13 Pages. Released February 2003. Preview the table of contents .pdf file. Included in the E-500 Collection

Date of Publication:
Feb 13, 2003
File Format:
Non-Printable CD-ROM
Number of Pages:
13 Pages
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