Microelectronics and Microsystems

US$2,495.00
Date of Publication: Jul 18, 2017
Asia’s going to be a very big part of driving the global recovery from the current financial crisis. With the emergence of a “billion new middle class consumers in India, in China, in Indonesia, and other parts of Asia,” the spending versus savings patterns of these new consumers will define the direction of the global economy in years to come. This report describes the technology infrastructure of nine Asian countries, detailing each countries’ developments in microelectronics, telecommunications, and computing.  Market forecasts are also presented in these sectors for associated countries.

US$4,950.00
Date of Publication: Jun 5, 2017
This report analyzes the worldwide markets for System-in-Package (SiP) Technology in US$ Million. The Global market is further analyzed by: Interconnection Technology - Wire Bonding, and Flip-Chip; and End-Use Sector - Consumer Electronics, Communications, Aerospace & Defense, Automotive, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

US$1,995.00
Date of Publication: May 10, 2017

MEMS are key components in a wide variety of systems, solutions and applications across virtually every industry vertical. Leading micro-electronics suppliers, such as STMicroelectronics, provide various MEMS solutions such as smart sensors and sensor hubs, UV index sensors, temperature sensors and touch sensors. High growth areas for MEMS include a few emerging high-tech segments such as Virtual Reality and many Internet of Things (IoT) related areas such as Connected Vehicles, UAVs, and more. This research evaluates the MEMS marketplace including ecosystem, players, products, and services. The report provides detailed forecasts of MEMS by function, device, application, and industry vertical. These forecasts are global, regional, and by country for the period 2017 to 2022.


US$2,495.00
Date of Publication: Jul 18, 2017
This report analyzes the market for MEMS by devices and systems. The equipment and materials to make them are analyzed and forecast.

US$2,495.00
Date of Publication: Jul 18, 2017
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

US$2,495.00
Date of Publication: Jul 18, 2017
Microphones continue to be one of the best success stories in MEMS, with mobile device manufacturers adding increasing numbers of these devices to their phones to support advanced features, such as voice command and noise suppression. Silicon microphones have the potential to be the next high-volume MEMS application. With their compact and lightweight structure as well as high integration capability, these products are already in vogue in high-end markets, especially for hearing aid use. Hoping to tap the huge potential of MEMS (Micro Electro Mechanical Systems microphones), companies are gearing up to master the technology. The report examines the market for microphones, speakers, and end-applications.

US$5,650.00
Date of Publication: Mar 15, 2017
The overall MEMS oscillator market was valued at USD 79.2 Million in 2016 and is expected to reach USD 802.8 Million by 2022, at a CAGR of 46.08% between 2017 and 2022. This report provides the size and future growth potential of the MEMS oscillator market across different segments such as packaging type, band, general circuitry, application, and geography.