Microelectronics and Microsystems

US$1,995.00
Date of Publication: May 2, 2018
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.

US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for MEMS InkJet Heads in US$ Thousand by the following End-Use Categories: Consumer Applications, Commercial & Industrial Applications, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East & Africa, and Latin America. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$2,495.00
Date of Publication: Feb 7, 2018

This report describes the technology infrastructure of nine Asian countries, detailing each countries' developments in microelectronics, telecommunications, and computing. Market forecasts are also presented in these sectors for associated countries.


US$2,495.00
Date of Publication: Jul 18, 2017
This report analyzes the market for MEMS by devices and systems. The equipment and materials to make them are analyzed and forecast.

US$2,495.00
Date of Publication: Feb 7, 2018
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

US$2,495.00
Date of Publication: Feb 7, 2018
The report examines the market for microphones, speakers, and end-applications.

US$4,300.00
Date of Publication: Dec 12, 2017
The study is designed to give a comprehensive overview of the Micro-Electro-Mechanical Systems MEMs Sensors market segment. Research represents a selection from the mountains of data available of the most relevant and cogent market materials, with selections made by the most senior analysts. Commentary on every aspect of the market from independent analysts creates an independent perspective in the evaluation of the market. In this manner the study presents a comprehensive overview of what is going on in this market, assisting managers with designing market strategies likely to succeed.