Microelectronics and Microsystems

Date of Publication: Sep 29, 2015
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

Date of Publication: Feb 3, 2015
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.

Date of Publication: Sep 18, 2015
This report analyzes the worldwide markets for MEMS Inertial Sensors in US$ Million and Million Units. The Global market is further analyzed in US$ Million by the following End-Use Applications: Automotive, Mobile Devices, Camcorders & Cameras, Gaming Consoles, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2014 through 2020. The consumer electronics market is witnessing a strong demand for 6-axis and 9-axis inertial measurement units (IMUs). While 6-axis IMUs are single chips containing a 3-axis gyroscope and 3-axis accelerometer, the 9-axis IMUs represent a combination of a 3-axis gyroscope, 3-axis accelerometer, and 3-axis magnetometer in a single chip. 

Date of Publication: Apr 21, 2015

This study provides coverage of the world market for classic ASICs, 32/64-bit MPU core-based ASICs, classic ASSPs, 32/64-bit MPU core-based ASSPs and PLDs/FPGAs. It is an update of the study last published by Semicast on this market in 2013 and provides analysis segmented into 25 application areas.

Date of Publication: Aug 11, 2015
This vision of MEMS whereby microsensors, microactuators and microelectronics and other technologies, can be integrated onto a single microchip is expected to be one of the most important technological breakthroughs of the future. A significant portion of MEMS manufacturing technology has come from the IC industry. MEMS devices can be made using silicon wafers and the manufacturing process can incorporates semiconductor manufacturing processes such as sputtering, deposition, etching and lithography.
This report analyzes the market for MEMS by devices and systems. The equipment and materials to make them are analyzed and forecast.

Date of Publication: Aug 11, 2015
Microphones continue to be one of the best success stories in MEMS, with mobile device manufacturers adding increasing numbers of these devices to their phones to support advanced features, such as voice command and noise suppression. Silicon microphones have the potential to be the next high-volume MEMS application. With their compact and lightweight structure as well as high integration capability, these products are already in vogue in high-end markets, especially for hearing aid use. Hoping to tap the huge potential of MEMS (Micro Electro Mechanical Systems microphones), companies are gearing up to master the technology. The report examines the market for microphones, speakers, and end-applications.

Date of Publication: Aug 10, 2015
Asia’s going to be a very big part of driving the global recovery from the current financial crisis. With the emergence of a “billion new middle class consumers in India, in China, in Indonesia, and other parts of Asia,” the spending versus savings patterns of these new consumers will define the direction of the global economy in years to come. This report describes the technology infrastructure of nine Asian countries, detailing each countries’ developments in microelectronics, telecommunications, and computing.  Market forecasts are also presented in these sectors for associated countries.