New Publications

Market research can provide your organization with a thorough understanding of its market, customers, and competitors, and can help your company establish a dominant position in its industry. Through market research, you can increase your market share, boosting revenues by millions and market valuations by billions. You can also reduce your costs and time to market.  Electronics.ca Publication offers company information and comprehensive and intelligent market data information on industry trends, technologies, product, and buyer behavior. This research category provides the list of latest market reports. Subscribe to our RSS feeds to receive excerpts of the latest research reports daily!

US$5,500.00
Date of Publication: Jun 20, 2019
The global 5G chipset market should grow from $870.0 million in 2019 to reach $10.9 billion by 2024 at a compound annual growth rate (CAGR) of 65.7% for the period of 2019-2024.

US$5,500.00
Date of Publication: Apr 3, 2019

The Strategic Cost and Price Model - 2019 is now available with eight new fabs, expanded logic and DRAM process coverage, updated data and many other enhancements. Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron.


US$4,400.00
Date of Publication: Jul 30, 2019
The 2019 study has 376 pages, 159 tables and figures. Worldwide markets are poised to achieve explosive growth generating several new trillion-dollar markets as the digital economy takes hold. Across the industrial spectrum smart devices and robots provetheirvalue by managing digital informationin real time across enterprise boundaries, encouraging collaborative business efforts. Lowering the costs of manufacturing and logistics management is a key benefit.

US$200.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.

US$200.00
Date of Publication: Jun 18, 2019
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

US$3,720.00
Date of Publication: Jul 5, 2019
Analysis Of The Following Nanomaterials: Aluminium Oxide Nanoparticles, Antimony Tin Oxide Nanoparticles, Bismuth Oxide Nanoparticles, Carbon Nanotubes, Cerium Oxide Nanoparticles, Cobalt Oxide Nanoparticles, Copper Oxide Nanoparticles, Dendrimers, Fullerenes, Gold Nanoparticles, Graphene, Iron Oxide Nanoparticles, Magnesium Oxide Nanoparticles, Manganese Oxide Nanoparticles, Nanocellulose, Nanoclays, Nanodiamonds, Nanofibers, Nanosilver, Nanowires, Nickel Nanoparticles, Quantum Dots, Silicon Oxide Nanoparticles, Titanium Dioxide Nanoparticles, Zinc Oxide Nanoparticles, Zirconium Oxide Nanoparticles, Nanoprecipitated Calcium Carbonate, Graphene And Carbon Quantum Dots, Hydroxyapatite Nanoparticles, Palladium Nanoparticles, Yttrium Oxide Nanoparticles, Other 2D Materials.

US$2,495.00
Date of Publication: Jul 5, 2019

This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.


US$2,495.00
Date of Publication: Jul 5, 2019
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.

US$2,495.00
Date of Publication: Jul 5, 2019
The high price of oil in the past few years has been a catalyst for development in other alternative energy sources. Semiconductor technology surrounding the alternative energy markets includes advanced IGBT design, optoelectronics, advanced power conversion ICs, digital signal processing, MCUs, and advanced mixed signal and analog circuits. This report discussed the potential for these products to be the next killer green application.

US$2,495.00
Date of Publication: Jul 5, 2019

This report describes the technology infrastructure of nine Asian countries, detailing each countries' developments in microelectronics, telecommunications, and computing. Market forecasts are also presented in these sectors for associated countries.


US$2,495.00
Date of Publication: Jul 5, 2019
This report presents a market and technical forecast for ITO and replacements for LCD panels, plasma display panels (PDP), touch panels, e-paper, solar cells and organic electroluminescent (EL) panels.

US$2,495.00
Date of Publication: Jul 5, 2019

Mainland China represents a huge opportunity for semiconductor manufacturers and equipment and materials suppliers. Massive investments in China’s semiconductor industry is paying off as internal production is making inroads on demand. The emerging semiconductor market will exhibit growth far in excess of any other country. This report analyzes Mainland China’s semiconductor and equipment industries, examining the technical, economic, and political issues that are shaping this nascent industry.


US$2,495.00
Date of Publication: Jul 5, 2019

The growth of the FPD market with the diffusion of digital home appliances is driving the large-format photomask market and prompting some companies to enter.  In order to remain competitive in such circumstances, companies have been strengthening their technological capabilities and creating higher value-added products, as well as provide products at reasonable cost and with a delivery time that satisfies customer demands. Driving the TFT-LCD photomask market are a generation-shift to bigger glass plates and a design-rule cycle of panel technology that changes every 12 months. In this report, the worldwide markets are analyzed and projected, and market shares of vendors presented.


US$2,495.00
Date of Publication: Jul 5, 2019
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.

US$2,495.00
Date of Publication: Jul 5, 2019
This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.

US$2,495.00
Date of Publication: Jul 5, 2019
The primary objective of this report is to review the current issues dealing with lithography as applied to the manufacture of VLSI devices.

US$2,495.00
Date of Publication: Jul 5, 2019
This report addresses the strategic issues impacting the mask making, inspection, and repair sectors of the semiconductor industry in the U.S. and the world. The mask market is segmented by geographic region. The mask equipment markets are analyzed and projected and market shares presented.

US$2,495.00
Date of Publication: Jul 5, 2019
This report analyzes the market for MEMS by devices and systems. The equipment and materials to make them are analyzed and forecast.

US$2,495.00
Date of Publication: Jul 5, 2019

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.


US$2,495.00
Date of Publication: Jul 5, 2019
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

US$2,495.00
Date of Publication: Jul 5, 2019
This report addresses these technical issues, presenting an analysis of the semiconductor factory automation industry, the key players, and the driving forces directing semiconductor factory automation. Markets are segmented as: 1. Automated transfer tools (robots, elevators, platforms, etc.), 2. Carrier transport (monorail, AGV, AS/RS, etc.), 3. Manufacturing execution systems (MES) software.

US$2,495.00
Date of Publication: Jul 5, 2019
This report analyzes the market for both crystalline and thin film solar cells, equipment to make them, and polysilicon as a starting point. Marker shares of vendors in all these sectors are presented.

US$2,495.00
Date of Publication: Jul 5, 2019
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

US$2,495.00
Date of Publication: Jul 5, 2019
This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.

US$2,495.00
Date of Publication: Jul 5, 2019
In this report we identify and forecast areas of semiconductor-related technologies where a small or mid-sized company can compete. These high-tech applications segmented as those are fabricated on 300mm wafers and those built on non-300mm wafers. The small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.

US$2,495.00
Date of Publication: Jul 5, 2019

In this report we identify and forecast areas of related technologies where a small or mid-sized chemical and material companies can compete: Solar, MEMS, LEDs, HDD, and WLP. As a result, the small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.


US$2,495.00
Date of Publication: Jul 5, 2019
The future needs in plasma etching will be for ever tighter control of process variability, higher selectivity and less damage. This report addresses the strategic issues impacting both the user and supplier of plasma etching equipment to the semiconductor industry. Markets for dry etching and stripping are analyzed and projected. Dry etching systems are further segmented by application. Market shares of vendors in each sector are presented.

US$2,495.00
Date of Publication: Jul 5, 2019
This report analyzes and forecasts the traditional power semiconductor market as well as next generation devices. Market shares of vendors by type are presented.

US$2,495.00
Date of Publication: Jul 5, 2019
This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for LCDs, equipment and materials is presented along with market share of vendors.

US$4,995.00
Date of Publication: Jul 5, 2019
This report examines and projects the technology of equipment and materials involved in the fabrication of VLSI semiconductor devices, their likely developments, why and when their introduction or demise will take place, what problems and choices are facing users, and where the opportunities and pitfalls are.

US$2,495.00
Date of Publication: Jul 5, 2019
This report compares some of the issues impacting users of different deposition tools, including: APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD, ALD. Market forecasts and market shares of vendors is presented.

US$2,495.00
Date of Publication: Jul 5, 2019
Eventually, nanomaterials are likely to affect nearly every industry in every region in the world, including the least developed regions. In fact, there is considerable optimism that nanomaterials will be instrumental in addressing some of the developing world’s most pressing concerns. Forecasts are presented for nanomaterials for solar cells, displays, lighting, and RFIDs devices.