New Publications

Market research can provide your organization with a thorough understanding of its market, customers, and competitors, and can help your company establish a dominant position in its industry. Through market research, you can increase your market share, boosting revenues by millions and market valuations by billions. You can also reduce your costs and time to market.  Electronics.ca Publication offers company information and comprehensive and intelligent market data information on industry trends, technologies, product, and buyer behavior. This research category provides the list of latest market reports. Subscribe to our RSS feeds to receive excerpts of the latest research reports daily!

US$5,500.00
Date of Publication: Jun 20, 2019
The global 5G chipset market should grow from $870.0 million in 2019 to reach $10.9 billion by 2024 at a compound annual growth rate (CAGR) of 65.7% for the period of 2019-2024.

US$5,500.00
Date of Publication: Apr 3, 2019

The Strategic Cost and Price Model - 2019 is now available with eight new fabs, expanded logic and DRAM process coverage, updated data and many other enhancements. Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron.


US$4,400.00
Date of Publication: Jul 30, 2019
The 2019 study has 376 pages, 159 tables and figures. Worldwide markets are poised to achieve explosive growth generating several new trillion-dollar markets as the digital economy takes hold. Across the industrial spectrum smart devices and robots provetheirvalue by managing digital informationin real time across enterprise boundaries, encouraging collaborative business efforts. Lowering the costs of manufacturing and logistics management is a key benefit.

US$200.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.

US$200.00
Date of Publication: Jun 18, 2019
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

US$3,720.00
Date of Publication: Jul 5, 2019
Analysis Of The Following Nanomaterials: Aluminium Oxide Nanoparticles, Antimony Tin Oxide Nanoparticles, Bismuth Oxide Nanoparticles, Carbon Nanotubes, Cerium Oxide Nanoparticles, Cobalt Oxide Nanoparticles, Copper Oxide Nanoparticles, Dendrimers, Fullerenes, Gold Nanoparticles, Graphene, Iron Oxide Nanoparticles, Magnesium Oxide Nanoparticles, Manganese Oxide Nanoparticles, Nanocellulose, Nanoclays, Nanodiamonds, Nanofibers, Nanosilver, Nanowires, Nickel Nanoparticles, Quantum Dots, Silicon Oxide Nanoparticles, Titanium Dioxide Nanoparticles, Zinc Oxide Nanoparticles, Zirconium Oxide Nanoparticles, Nanoprecipitated Calcium Carbonate, Graphene And Carbon Quantum Dots, Hydroxyapatite Nanoparticles, Palladium Nanoparticles, Yttrium Oxide Nanoparticles, Other 2D Materials.

US$2,495.00
Date of Publication: Jul 5, 2019

This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.


US$2,495.00
Date of Publication: Jul 5, 2019
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.