New Publications

Market research can provide your organization with a thorough understanding of its market, customers, and competitors, and can help your company establish a dominant position in its industry. Through market research, you can increase your market share, boosting revenues by millions and market valuations by billions. You can also reduce your costs and time to market.  Electronics.ca Publication offers company information and comprehensive and intelligent market data information on industry trends, technologies, product, and buyer behavior. This research category provides the list of latest market reports. Subscribe to our RSS feeds to receive excerpts of the latest research reports daily!

US$850.00
Date of Publication: May 21, 2019
Metal-organic frameworks (MOFs) and related materials are a class of crystalline nanoporous molecular scaffolds MOFs possess excellent chemical and physical properties and can be assembled from a variety of metals and a large number of organic linkers to produce highly ordered, 3D structures.

US$525.00
Date of Publication: May 21, 2019
Carbon quantum dots (CDs, CQDs or C-dots) and graphene quantum dots (GQDs) have recently emerged as a new class of QD materials. GQDs possess unique optical and electrical properties.

US$5,500.00
Date of Publication: Apr 23, 2019
The global market for semiconductor devices for high-temperature applications should grow from $3.9 billion in 2018 to $9.4 billion by 2023 with a compound annual growth rate (CAGR) of 19.2% for the period of 2018-2023. The market for semiconductor devices used in high-temperature applications is segmented into categories by type: GaN, SiC, GaAs, and diamond semiconductor substrate.

US$200.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.

US$200.00
Date of Publication: Mar 15, 2018
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

US$347.00
Date of Publication: Nov 22, 2017
IPC 7711/21C has been completely updated to meet the best industry practices, common procedures and general information on rework, modification and repair of electronic assemblies. New procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.

US$200.00
Date of Publication: Oct 19, 2017
中文描述 IPC-A-610是一份使用非常广泛的电子组件验收文件。标准委员会的成员来自17个国家,他们提供数据和专业知识来完成升版工作,这份文件带来了最新的标准,以及许多新的修订的行业图片。 这是一份检查员、操作者和其他感兴趣人员必须具备的电子组件接收标准的文件。IPC-A-610是和J-STD-001协同开发的,并在本修订版中首次使用了IPC/WHMA-A-620。2017年11月翻译。

US$294.00
Date of Publication: Jan 22, 2018
IPC-A-610G ist die weltweit am meisten verwendete Abnahme-Richtlinie zur Elektronik-Montage. Aktualisiert durch das Fachwissen von Experten aus 17 Ländern, bietet dieses Dokument der Branche aktuellste Kriterien und neue bzw. aktualisierte Illustrationen.

US$2,500.00
Date of Publication: Apr 23, 2019
The distributed fiber optic sensor market report has been expanded to cover single point sensors and extended to 2023. The total distributed fiber optic sensor market that was projected (January 2017) to be $1,008 million in 2021 is now projected to be $821 million in 2021 reaching $1,033 in 2023.

US$168.00
Date of Publication: Apr 22, 2019
PC-2591 standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.

US$4,400.00
Date of Publication: Apr 15, 2019
The vendors in the Mid-Infrared Sensors industry have invested in high-quality technology and processes to develop leading edge Internet of Things capability. The worldwide mid-IR sensor market at $9.7 billion in 2018 is projected to reach $109.9 billion by 2025. Units sales at 611 million sensors in 2018 are anticipated to reach 10.7 billion sensors worldwide by 2025.

US$675.00
Date of Publication: Apr 9, 2019
Nanodiamonds (NDs), also called detonation diamonds (DND) or ultradispersed diamonds (UDD) are fine particles of diamond with a particle diameter of 4 to 6 nanometers, and are composite composed of diamond core, amorphous carbon layer, sp2 carbon layer (graphene and graphite), and oxygen functional group. Due to each component and their interaction, they exhibit completely different properties from general diamond. NDs are one of the most thermally conductive and hardest materials known.

US$2,300.00
Date of Publication: Apr 9, 2019
The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices.

US$2,400.00
Date of Publication: Apr 9, 2019

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.


US$1,995.00
Date of Publication: Apr 9, 2019
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.

US$800.00
Date of Publication: Apr 9, 2019
Graphene Investment and Pricing Report is the most comprehensive guide to graphene production, commercial opportunities and current pricing.