New Publications

Market research can provide your organization with a thorough understanding of its market, customers, and competitors, and can help your company establish a dominant position in its industry. Through market research, you can increase your market share, boosting revenues by millions and market valuations by billions. You can also reduce your costs and time to market.  Electronics.ca Publication offers company information and comprehensive and intelligent market data information on industry trends, technologies, product, and buyer behavior. This research category provides the list of latest market reports. Subscribe to our RSS feeds to receive excerpts of the latest research reports daily!

US$4,500.00
Date of Publication: May 16, 2018

The networking equipment market in Canada is forecast to reach $2.8 billion in revenue in 2022, resulting in a five-year CAGR of 1.8%. The network equipment market is in a state of transition as traditional deployment models are challenged by cloud, software-defined solutions, and SaaS.


US$4,500.00
Date of Publication: May 16, 2018
This study presents IDC Canada's five-year forecasts for communications services spending by customer segment, company size, industry sector, and region for 2018–2022 based on the annual update of IDC Canada's custom Communications Market Model.

US$1,360.00
Date of Publication: May 11, 2018

The Graphene Report is a comprehensive analysis of the market and commercial opportunities for these remarkable materials. This new edition has greatly expanded the sections covering flexible electronics, wearables and energy and details on industry demand in tons (current and projected) has been added for key markets.


US$4,000.00
Date of Publication: May 9, 2018
The Global Market for Nanotechnology and Nanomaterials 2010-2028, 5th edition is the most comprehensive assessment of the opportunities afforded by these remarkable materials and technologies. The report offers full market forecasts for nanomaterials and industrial sectors impacted by nanotechnology.

US$1,995.00
Date of Publication: May 7, 2018

This report evaluates the current state of the market and outlook for the future including analysis and forecasts for the Telecom API market segmented many ways including:

  • Globally, Regionally, and Countries
  • Stakeholder Type (Carriers and Vendors)
  • Network Technology (2G, 3G, LTE, and 5G)
  • API Category (Presence, Location, SCM, etc.)
  • App Developer (Carrier, Enterprise, Long Tail, and Partner)
  • Deployment Type (Enterprise Hosted, Private Cloud, and Public Cloud)
  • Implementation (Development and Set-up) and by Ongoing Operations
  • Solution (AI, Analytics, Blockchain, Edge Computing, Robotics, WebRTC, etc.)

US$3,995.00
Date of Publication: May 7, 2018
If you are involved in forecasting, manufacturing, purchasing, or utilizing DWDM, ROADMs, network Routers and network Switches, this report will become your major tool. It offers forecasts for not only units (US and World-wide, 2018-2023) and market forecasts, but also breaks down those forecasts by a number of useful subdivisions.

US$2,500.00
Date of Publication: May 2, 2018
The distributed fiber optic sensor market report has been expanded to cover single point sensors and extended to 2022. The distributed fiber optic sensor market stood at $651 million in 2014 with 49% associated the oil and gas market segment. The overall market contacted through 2016 due to the fall in oil prices. A modest recovery is projected in 2018. By 2022, the forecast shows the oil and gas market segment will increase in value, but due to growth in other segments, it will decrease to 19% of the distributed fiber optic sensor market.

US$1,200.00
Date of Publication: May 2, 2018

The Packaging Cost and Price Model is designed to calculate the manufacturing cost and selling price of most semiconductor packages. The model forward forecasts out to 2025. 75mm to 300mm wafer sizes are supported. Packaging cost, packaging step costs and material usage are calculated.


US$2,300.00
Date of Publication: May 2, 2018

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.


US$1,995.00
Date of Publication: May 2, 2018
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.

US$1,995.00
Date of Publication: Apr 24, 2018
This research assesses core public safety technology and solutions as well as emerging key areas for critical communications including 5G, AI, and IoT.  The report identifies market opportunities and the market outlook for critical communications with forecasts for 2018 to 2023.  This report purchase includes time with an expert analyst who will help you link key findings in the report to the business issues you're addressing.

US$1,885.00
Date of Publication: Apr 24, 2018
Electronics and power sources electronics which are not only flexible but also conformable and deformable offer the advantages of conventional devices while ideally maintaining excellent electrical properties under strain. They can stretched like a rubber band and twisted like a rope without any significant reduction in performance.

US$775.00
Date of Publication: Apr 24, 2018
There is great interest in developing 2-D electronic devices to overcome the performance limitations of currently used materials. Graphene and other 2-D materials are key candidates for new and future electronics, including flexible and stretchable electronics, wearables, sensors and photonics. These materials possess a combination of high electron mobility, high thermal conductivity, high specific surface area, high optical transparency, excellent mechanical flexibility, and environmental stability.

US$2,150.00
Date of Publication: Jan 26, 2018
Based on a new generation of advanced materials, printed, flexible and stretchable sensors and electronics will enable new possibilities in a diverse range of industries from healthcare to automotive to buildings These technologies will drive innovation in smart medical technology, automotive, smart manufacturing, Internet of Things (IoT) and consumer electronics.

US$700.00
Date of Publication: Apr 24, 2018
Graphene exhibits a unique combination of mechanical, thermal, electronic and optical properties that provide opportunities for new innovation in flexible displays, transistors, photosensors, RFID tags, solar cells, secondary batteries, fuel cells, supercapacitors, conductive inks, EMI shielding, heat insulation, anti-oxidation and LEDs across multiple industries including consumer electronics, automotive, aerospace, medicine, energy, 3D printing, polymer composites, wireless technology, filtration and coatings.

US$4,950.00
Date of Publication: Apr 17, 2018
This report analyzes the worldwide markets for Intelligent Transportation Systems (ITS) in US$ Million by the following Product Segments: Advanced Traffic Management Systems (ATMS), Electronic Toll Collection (ETC) Systems, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, China, South Korea, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$4,950.00
Date of Publication: Apr 17, 2018
This report analyzes the worldwide markets for Carbon Nanotubes in US$ Thousand by the following Product Segments: Single-Walled Carbon Nanotubes, and Multi-Walled Carbon Nanotubes. The Global market is also analyzed by the following End-Use Sectors: Construction, Aerospace & Defense, Automotive, Sports Equipment, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2024.

US$4,950.00
Date of Publication: Apr 17, 2018
This report analyzes the worldwide markets for Fuel Cells in US$ Thousand by the following Product Segments: Phosphoric Acid Fuel Cells, Molten Carbonate Fuel Cells, Alkaline Fuel Cells, Solid Oxide Fuel Cells, Proton Exchange Membrane Fuel Cells, and Other Fuel Cells. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$4,950.00
Date of Publication: Apr 17, 2018
This report analyzes the worldwide markets for Flexible Printed Circuit Boards in US$. The Global market is further analyzed by the following End-Use Segments: Automotive, Consumer Electronics, Industrial, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$4,500.00
Date of Publication: Apr 17, 2018
This report analyzes the worldwide markets for e-Paper Display in US$ Thousand by the following End-Use Applications: e-Readers, Signage/Poster Devices, Mobile Phones, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$4,950.00
Date of Publication: Apr 17, 2018
This report analyzes the worldwide markets for Flat Panel Displays (FPDs) in US$ Million by the following Display Technologies: Organic Light Emitting Diode Displays (OLEDs), Plasma Display (PDPs), TFT LCD Displays, and Others. Further the market is analyzed by the following Applications: Automotive, Mobile Phones/Tablets, Personal Computers/Notebooks, Television, and Others. The report provides separate comprehensive analytics for US, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$2,999.00
Date of Publication: Jan 18, 2017
Adoption of wireless sensor network (WSN) technologies is driving growth for the industrial Internet of Things. Today’s WSN and associated cloud...

US$1,550.00
Date of Publication: Apr 3, 2018
Conductive inks represents a multi-billion dollar market opportunity over the next decade in markets ranging from flexible electronics to automotive. Not only will demand across all current markets grow but the development of new materials and processes is leading to the creation of new market opportunities for conductive ink producers and suppliers in flexible, customized and 3D printed electronics.

US$4,500.00
Date of Publication: Mar 16, 2018
This report analyzes the Global market for Haptics in US$ Million by the following End-Use Applications and Components: End-Use Applications - Consumers Electronics (Smartphones, & Other Consumer Electronics) and Others; Components - Actuators, and Others.

US$4,950.00
Date of Publication: Mar 16, 2018
This report analyzes the worldwide markets for Military Radars in US$ Million by the following Platforms: Land, Air, Naval, and Space. The report provides separate comprehensive analytics for the US, Canada, Europe, Asia-Pacific, Middle East & Africa, and Latin America. Annual estimates and forecasts are provided for the period 2016 through 2024

US$190.00
Date of Publication: Nov 28, 2017
本文件是唯一的、行业一致认可的线缆和线束组件的要求和验收标准的最新版本,增加了锁线、保险索、索环和线槽的新章节,并更新了许多章节的信息。该标准包含了700多张照片和插图,描述了压接、机械固定和焊接互连所用的材料、方法、测试和验收标准以及与电缆和线束组件相关组装活动。 IPC/WHMA-A-620C 由IPC和线束制造商协会(WHMA)开发。2017年5月翻译

US$190.00
Date of Publication: Nov 18, 2016
印制板可接受性的权威指南!...

US$608.00
Date of Publication: Jul 17, 2017

This is a family of specification for board design. Put IPC's design library at your fingertips! The IPC-2220-FAM series is built around the IPC-2221, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer chooses the appropriate sectional standard for a specific technology.


US$160.00
Date of Publication: Feb 19, 2018
The intent of IPC/PERM-2901 design guide is to assist design engineers in developing electronics that are completely Pb-free and meet the demanding requirements of ADHP systems and products. Coverage is given to Pb-free solders and solder joints, tin whiskers, printed board defects, product qualification, supply chain management, obsolescence mangement, and COTS assembly, selection and use

US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for Nanotechnology in US$ Million. The Global market is analyzed by the following Product Segments: NanoDevices, NanoMaterials, and NanoTools. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for Distribution Transformers in US$ by the following Equipment Class: Oil Filled Distribution Transformers, and Dry Type Distribution Transformers. The End-Use Sectors also analyzed in the report include Utility, and Non-Utility. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the Global market for Submarine Optical Fiber Cables in Kilometers. Annual estimates and forecasts are provided for the period 2013 through 2022.

US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for Semiconductor Automated Test Equipment (ATE) in US$ by the following Application Areas: Consumer Electronics, Telecom & IT, and Others. The Global market is further analyzed by the following Product Types and Components - Product Type:   Memory, Non-Memory, and Others; Components:  Contactors, Testers, and Others. The report provides separate comprehensive analytics for the US, Japan, Europe, China, South Korea, Taiwan, and Rest of World.

US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for Automotive Infotainment Systems for Passenger Cars in US$.  The Global market is further analyzed by the following Product Segments: Telematics Unit, Connectivity Unit, Display Unit, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rst of world. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$4,950.00
Date of Publication: Feb 16, 2018

This report analyzes the worldwide markets for Network Cameras and Video Analytics in US$ Million by the following Product Segments, Applications, and End-Use Sectors: Product Segments - Network Cameras, and Video Analytics Software; Applications - Security/Surveillance, and Other Applications; End-Use Sectors - Banking & Financial, Government, Retail, Transportation, and Others. 


US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for Electronic Access Control Systems (EACS) in US$ by the following Types: Card-Based EACS, Biometrics-Based EACS, Audio and Video-Based EACS, and Keypad-Based EACS.  The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World.

US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for Satellite Remote Sensing in US$ Million. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$4,500.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for Selective Soldering in US$ Thousand. The report provides separate comprehensive analytics for the US, Japan, Europe, China, South Korea, Taiwan, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for MEMS InkJet Heads in US$ Thousand by the following End-Use Categories: Consumer Applications, Commercial & Industrial Applications, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East & Africa, and Latin America. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for Nanocomposites in Million Pounds. The Global and the US markets are further analyzed by the following End-Use Segments: Construction, Electronics, Automotive, Aviation, Consumer Goods, Healthcare, and Others. The report provides separate comprehensive analytics for the US, Europe, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

US$4,950.00
Date of Publication: Feb 15, 2018
The global market for perovskite and other thin-film solar modules should reach $5.2 billion by 2022 from $3.7 billion in 2017 at a compound annual growth rate (CAGR) of 7.0%, from 2017 to 2022.

US$4,950.00
Date of Publication: Jan 29, 2018
Printed Electronics report covers market trends, market sizing and forecast across printed electronic component segments, including printing methods, inks and substrates, and across applications including optoelectronics for displays, energy, sensors and radio frequency devices. The global printed electronics market should reach $26.6 billion by 2022 from $14.0 billion in 2017 at a compound annual growth rate (CAGR) of 13.6%, from 2017 to 2022.

US$4,950.00
Date of Publication: Nov 10, 2017
The global market for nanowire-based devices was valued at $1.2 billion in 2016. This market will grow from nearly $1.6 billion in 2017 to around $6.0 billion by 2022 with a compound annual growth rate (CAGR) of 30.6% for the period of 2017-2022.

US$375.00
Date of Publication: Feb 13, 2018
Graphene has brought to the world’s attention the exceptional properties of two-dimensional (2D) nanosheet materials. Due to its exceptional transport, mechanical and thermal properties, graphene has been at the forefront of nanomaterials research over the past few years. Its development has enabled researchers to explore other 2D layered materials, such as the transition metal dichalcogenides, a wide variety of oxides and nitrides and clays.

US$2,495.00
Date of Publication: Feb 7, 2018

This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.


US$2,495.00
Date of Publication: Feb 7, 2018
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.

US$2,495.00
Date of Publication: Feb 7, 2018

This report describes the technology infrastructure of nine Asian countries, detailing each countries' developments in microelectronics, telecommunications, and computing. Market forecasts are also presented in these sectors for associated countries.


US$2,495.00
Date of Publication: Feb 7, 2018
This report presents a market and technical forecast for ITO and replacements for LCD panels, plasma display panels (PDP), touch panels, e-paper, solar cells and organic electroluminescent (EL) panels.

US$2,495.00
Date of Publication: Feb 7, 2018

The growth of the FPD market with the diffusion of digital home appliances is driving the large-format photomask market and prompting some companies to enter.  In order to remain competitive in such circumstances, companies have been strengthening their technological capabilities and creating higher value-added products, as well as provide products at reasonable cost and with a delivery time that satisfies customer demands. Driving the TFT-LCD photomask market are a generation-shift to bigger glass plates and a design-rule cycle of panel technology that changes every 12 months. In this report, the worldwide markets are analyzed and projected, and market shares of vendors presented.


US$2,495.00
Date of Publication: Feb 7, 2018
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.

US$2,495.00
Date of Publication: Feb 7, 2018
This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.

US$2,495.00
Date of Publication: Feb 7, 2018
The primary objective of this report is to review the current issues dealing with lithography as applied to the manufacture of VLSI devices.

US$2,495.00
Date of Publication: Feb 7, 2018
This report addresses the strategic issues impacting the mask making, inspection, and repair sectors of the semiconductor industry in the U.S. and the world. The mask market is segmented by geographic region. The mask equipment markets are analyzed and projected and market shares presented.

US$2,495.00
Date of Publication: Jul 18, 2017
This report analyzes the market for MEMS by devices and systems. The equipment and materials to make them are analyzed and forecast.

US$2,495.00
Date of Publication: Feb 7, 2018

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.


US$2,495.00
Date of Publication: Feb 7, 2018
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

US$2,495.00
Date of Publication: Feb 7, 2018
This report addresses these technical issues, presenting an analysis of the semiconductor factory automation industry, the key players, and the driving forces directing semiconductor factory automation. Markets are segmented as: 1. Automated transfer tools (robots, elevators, platforms, etc.), 2. Carrier transport (monorail, AGV, AS/RS, etc.), 3. Manufacturing execution systems (MES) software.

US$2,495.00
Date of Publication: Feb 7, 2018
This report analyzes the market for both crystalline and thin film solar cells, equipment to make them, and polysilicon as a starting point. Marker shares of vendors in all these sectors are presented.

US$2,495.00
Date of Publication: Feb 7, 2018
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

US$2,495.00
Date of Publication: Feb 7, 2018
This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.

US$2,495.00
Date of Publication: Feb 7, 2018
In this report we identify and forecast areas of semiconductor-related technologies where a small or mid-sized company can compete. These high-tech applications segmented as those are fabricated on 300mm wafers and those built on non-300mm wafers. The small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.

US$2,495.00
Date of Publication: Feb 7, 2018

In this report we identify and forecast areas of related technologies where a small or mid-sized chemical and material companies can compete: Solar, MEMS, LEDs, HDD, and WLP. As a result, the small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.


US$2,495.00
Date of Publication: Feb 7, 2018
This report analyzes and forecasts the traditional power semiconductor market as well as next generation devices. Market shares of vendors by type are presented.

US$2,495.00
Date of Publication: Feb 7, 2018
This report compares some of the issues impacting users of different deposition tools, including: APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD, ALD. Market forecasts and market shares of vendors is presented.