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US$510.00
Date of Publication: Feb 19, 2015
The Global Market for Aluminium Oxide Nanoparticles: Market, applications and manufacturers Nanomaterials are increasingly becoming part...

US$85.00
Date of Publication: Mar 12, 2008
J-STD-020D.1新增了无铅组装所用元器件的相关内容!本标准的目的是确定对湿气诱发应力敏感的非气密固态表面贴装器件(SMD)的潮湿敏感等 级。它可用于确定SMD封装的初始可靠性认证应该采用的分级等级。从而能够对这些器件进行正确地包装、存储和操作,以避免其在随后的再流焊接操作时受到热...

US$85.00
Date of Publication: Feb 12, 2013
IPC J-STD-033C-CN 本文件的目的是,针对潮湿/再流焊敏感表面贴装器件,向生产商和用户提供标准的操作、包装、运输及使用方法。所提供的这些方法可避免由于吸收湿气和暴露在...

US$152.00
Date of Publication: Jul 4, 2008
IPC-T-50H-CN 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂,可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语,新术语...

US$85.00
Date of Publication: Oct 15, 2008
This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with...

US$152.00
Date of Publication: Oct 8, 2013
本文件集合了电路板及组件清洗信息。该修订版本主要阐述了制造和组装运营中材料、制程及污染物之间的关系。它还提出清洁度评估方案和涉及清洁度的制程控制 方案。配有彩图帮助理解。全文共200页。取代IPC-CH-65A、IPC-SC-60A、IPC-SA-61A、IPC-AC-62A、IPC-...

US$119.00
Date of Publication: Nov 4, 2008
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component...