New Publications

Market research can provide your organization with a thorough understanding of its market, customers, and competitors, and can help your company establish a dominant position in its industry. Through market research, you can increase your market share, boosting revenues by millions and market valuations by billions. You can also reduce your costs and time to market.  Electronics.ca Publication offers company information and comprehensive and intelligent market data information on industry trends, technologies, product, and buyer behavior. This research category provides the list of latest market reports. Subscribe to our RSS feeds to receive excerpts of the latest research reports daily!

US$4,950.00
Date of Publication: Oct 18, 2017
This report analyzes the worldwide markets for Electronic Security Systems (ESS) in US$ by the following Product Segments: Alarms, Electronic Access Control Systems, CCTV and Video Surveillance Systems, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$4,995.00
Date of Publication: Oct 18, 2017

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.


US$180.00
Date of Publication: Oct 17, 2017
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the components’ substrate structure.

US$160.00
Date of Publication: Oct 17, 2017
The IPC-J-STD-003C-WAM1&2 standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands and plated-through holes (PTHs). The IPC-J-STD-003C-WAM1&2 standard is not intended to verify the potential of successful processing at assembly or to evaluate design impact on wettability. 

US$90.00
Date of Publication: Oct 16, 2017
PC-9505  standard establishes uniform methods for testing electronic and electrical component parts, including both static and dynamic cleaning exposure tests to determine resistance to deleterious effects from exposure to the cleaning agent and mechanical energy used to deliver the cleaning agent to the part. For this document, the term "component parts" includes such items as capacitors, resistors, switches, relays, transformers, inductors, and others.

US$1,350.00
Date of Publication: Sep 18, 2017
This survey-based study covers production data, assembly attributes, yields, defect rates (DPMO), test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. This report enables electronics assembly companies to compare their performance to industry averages. The survey sample includes 94 electronics assembly companies from North America, Europe and Asia with total sales revenue ranging from under $10 million to more than $100 million.

US$1,995.00
Date of Publication: Sep 21, 2017
This research evaluates MEC technology, architecture and building blocks, ecosystem, market drivers, applications, solutions, and deployment challenges. The report also analyzes MEC industry initiatives, leading companies, and solutions. The report includes a market assessment and forecast for MEC users and MEC revenue globally, regionally, and within the enterprise market for years 2017 to 2022. Forecasts include MEC infrastructure (equipment, platforms, software, APIs, and services).