New Publications

Market research can provide your organization with a thorough understanding of its market, customers, and competitors, and can help your company establish a dominant position in its industry. Through market research, you can increase your market share, boosting revenues by millions and market valuations by billions. You can also reduce your costs and time to market.  Electronics.ca Publication offers company information and comprehensive and intelligent market data information on industry trends, technologies, product, and buyer behavior. This research category provides the list of latest market reports. Subscribe to our RSS feeds to receive excerpts of the latest research reports daily!

US$2,150.00
Date of Publication: Nov 24, 2017
The Discrete and Power Products Cost and Price Model - new revision has now been released with new processes and other enhancements. Easily calculate the cost and price of high power silicon ICs and discrete devices with only 5 required selections/entries. The model supports over 260 processes and over 70 package types. All of our models include twelve month of updates with reasonable email and phone support.

US$2,150.00
Date of Publication: Nov 24, 2017

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.


US$5,000.00
Date of Publication: Nov 24, 2017

The IC Knowledge - Strategic Cost Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade. Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron


US$1,900.00
Date of Publication: Nov 24, 2017
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test..

US$7,500.00
Date of Publication: Nov 16, 2017
This report defines connected vehicles as those that contain software, sensors, and IP-enabled connectivity. Connected vehicles and electric vehicles are the two core strategies for China's car manufacturing industry development. The total market size will grow from US$4.87 billion in 2016 to US$10.5 billion by 2021 at a compound annual growth rate of 16.5%. While traditional car manufacturers and emerging Internet companies and carriers are coexisting in this ecosystem, the market is representing a competitive landscape.

US$4,500.00
Date of Publication: Nov 16, 2017
This study provides Worldwide Quarterly Server Forecast clients with the foundation of market and technology assumptions that our regional analysts used to generate our current expectations for server market growth and directions. In a market as broad and complex as the enterprise server market, not all assumptions that lead to specific technology or product segment growth predictions can be listed in a concise document.

US$4,500.00
Date of Publication: Aug 17, 2017

This study analyzes the hard disk drive component market for the period from 2017 to 2021.The segment shift in the HDD market from PCs, personal storage, and consumer electronics to enterprise and video surveillance will have profound implications for HDD component demand and HDD component technology. By 2021, about 60% of HDD read/write recording heads and disk media will be needed for enterprise HDDs, with about 50% of these components requiring relatively new, advanced HDD recording technologies.