New Publications

Market research can provide your organization with a thorough understanding of its market, customers, and competitors, and can help your company establish a dominant position in its industry. Through market research, you can increase your market share, boosting revenues by millions and market valuations by billions. You can also reduce your costs and time to market.  Electronics.ca Publication offers company information and comprehensive and intelligent market data information on industry trends, technologies, product, and buyer behavior. This research category provides the list of latest market reports. Subscribe to our RSS feeds to receive excerpts of the latest research reports daily!

US$1,200.00
Date of Publication: May 2, 2018

The Packaging Cost and Price Model is designed to calculate the manufacturing cost and selling price of most semiconductor packages. The model forward forecasts out to 2025. 75mm to 300mm wafer sizes are supported. Packaging cost, packaging step costs and material usage are calculated.


US$2,300.00
Date of Publication: May 2, 2018

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.


US$1,995.00
Date of Publication: May 2, 2018
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.

US$1,995.00
Date of Publication: Apr 24, 2018
This research assesses core public safety technology and solutions as well as emerging key areas for critical communications including 5G, AI, and IoT.  The report identifies market opportunities and the market outlook for critical communications with forecasts for 2018 to 2023.  This report purchase includes time with an expert analyst who will help you link key findings in the report to the business issues you're addressing.

US$1,885.00
Date of Publication: Apr 24, 2018
Electronics and power sources electronics which are not only flexible but also conformable and deformable offer the advantages of conventional devices while ideally maintaining excellent electrical properties under strain. They can stretched like a rubber band and twisted like a rope without any significant reduction in performance.

US$775.00
Date of Publication: Apr 24, 2018
There is great interest in developing 2-D electronic devices to overcome the performance limitations of currently used materials. Graphene and other 2-D materials are key candidates for new and future electronics, including flexible and stretchable electronics, wearables, sensors and photonics. These materials possess a combination of high electron mobility, high thermal conductivity, high specific surface area, high optical transparency, excellent mechanical flexibility, and environmental stability.

US$2,150.00
Date of Publication: Jan 26, 2018
Based on a new generation of advanced materials, printed, flexible and stretchable sensors and electronics will enable new possibilities in a diverse range of industries from healthcare to automotive to buildings These technologies will drive innovation in smart medical technology, automotive, smart manufacturing, Internet of Things (IoT) and consumer electronics.