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Market research can provide your organization with a thorough understanding of its market, customers, and competitors, and can help your company establish a dominant position in its industry. Through market research, you can increase your market share, boosting revenues by millions and market valuations by billions. You can also reduce your costs and time to market.  Electronics.ca Publication offers company information and comprehensive and intelligent market data information on industry trends, technologies, product, and buyer behavior. This research category provides the list of latest market reports. Subscribe to our RSS feeds to receive excerpts of the latest research reports daily!

US$2,500.00
Date of Publication: Oct 26, 2015
From January to August of 2015, China sold 108,654 new energy vehicles, showing a skyrocketing growth of 270% year on year. Benefiting from the rapid development of new energy vehicles, the motor controller market will value more than RMB1.8 billion in 2015. It is projected that by 2017 this figure will rise to 280,000 sets and that the market size will hit RMB4.6 billion, with an AAGR of as much as 93%.

US$4,000.00
Date of Publication: Oct 19, 2015

Quantities of fielded smart Photography drone systems of every size and description are set to increase. Every photo opportunity can be enhanced via use of a smart drone. Drones will connect to smart phones. Drones can fly indoors. Smart commercial drones units feature a variety of camera attachments, sensors, and internal loads. Large 2,000 pound payloads are possible, campus security is set to emerge as a significant sector. Electro-optical/Infrared (EO/IR) sensor, and an all-weather synthetic aperture radar indicators are maximizing long loiter capabilities and increasing the usefulness of smart commercial drones. Smart commercial drones drone markets at $1.6 billion in 2014 are anticipated to reach $8.5 billion by 2021. This forecast number is arrived at by close examination of all the segment growth trajectories. Photography, real estate, campus security, filmmaking, and Videography are all being implemented in the context of drone photography. Each of these will grow at a different pace, depending on the use case effectiveness of the smart commercial photography drones. Commercial grade consumer video drones represent the largest revenue segment in 2015 and remain the biggest throughout the forecast period.


US$4,000.00
Date of Publication: Oct 16, 2015

Snake robots used for small space access, inside airplane wing access, first responder tasks, and surgery:  They are used for going where nothing else can go.   Snake robots provide systems that significantly improve traditional open surgery by consolidating the number of minimally invasive access ports to one and eliminating open surgery. The automated process revolution has come to robotics, used in surgery, industry, ships, airplanes, first responder help, and communications.  Automated process is being implemented via robots. Robots are automating systems, providing significant improvement in the accuracy of surgery and penetration of spaces that were previously impenetrable.


US$4,000.00
Date of Publication: Oct 16, 2015
Biometric modalities include hybrid fingerprint / palm print, facial recognition, iris image, and voice recognition. The global biometrics market is $7.0 billion in 2014, rising to $44.2 billion by 2021. Biometrics revenue and device shipment forecasts are segmented by modality and market segment. There are four market segments, law enforcement, border control which includes government ID systems, workplace access, and consumer ID.

US$6,500.00
Date of Publication: Jun 29, 2015
Analysis of trends in 24 application areas for: ARM MCUs, ARM eMPUs, MIPS MCUs/eMPUs, Power Architecture MCUs/eMPUs, 68K/Coldfire MCUs/eMPUs, x86 MCUs/eMPUs, SuperH MCUs/eMPUs, TriCore MCUs/eMPUs, V850/RH850 MCUs/eMPUs, "Other 32/64-bit" MCUs/eMPUs and General Purpose DSPs.

US$6,500.00
Date of Publication: Jun 26, 2015
Analysis of trends in 24 application areas for: 32-bit ARM MCUs, 64-bit ARM MCUs, 32-bit ARM eMPUs, 64-bit ARM eMPUs, 32-bit ARM ASICs/ASSPs, 64-bit ARM ASICs/ASSPs, 32-bit ARM FPGAs, 64-bit ARM FPGAs, 32-bit ARM DSPs and 64-bit ARM DSPs. Forecasts to 2020. 

US$2,000.00
Date of Publication: Jun 17, 2014
Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.

US$4,000.00
Date of Publication: Sep 8, 2015
Smart commercial drones drone markets at $3.4 billion in 2014 are anticipated to reach $27.1 billion by 2021. This forecast number is arrived at by close examination of all the segment growth trajectories.  Segments are, Agriculture, Oil and Gas, Border Patrol, Law Enforcement, Homeland Security, Disaster Response, Package Delivery, Photography, Videography. Each of these will grow at a different pace, depending on the use case effectiveness of the smart commercial drones. Commercial grade consumer video drones represent the largest revenue segment in 2015 and remain the biggest throughout the forecast period.

US$85.00
Date of Publication: Jul 22, 2015
This publication is intended to characterize the fracture strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. Includes the amendment to Section 8.7-Test Board Daisy-Chain Links. 

US$3,950.00
Date of Publication: Aug 31, 2015
Fiber-optic communications have been around for a very long time and have promised to take over all aspects of connectivity. However, high-speed copper connectors and cables have re-invented themselves time and again to prevent this from happening. But now, as we approach data rates of 400 Gb/s and beyond, copper is actually reaching the end of its usefulness.

US$85.00
Date of Publication: Sep 28, 2015
This standard establishes a Market Classification System and Level Classification System for printed electronics assemblies and provides a list of performance criteria and testing methods. It provides a standardized product category structure for designing and manufacturing printed electronics and assemblies which conform to industry-established performance metrics as determined by accepted testing methods.

US$7,500.00
Date of Publication: Sep 24, 2015
This study surveys revenue performance in the Japan disk storage system market between 2012 and 2014 by industry and number of employees and presents forecasts for 2015 through 2019. It analyzes industry-specific revenue in the Japan disk storage system market by OS and connection environment from the standpoint of external/internal configurations. The study also analyzes revenue by number of employees from the standpoint of external/internal configurations.

US$3,800.00
Date of Publication: Sep 15, 2015
The updated analysis of P25 and TETRA radios phased development. The current status of technologies, markets and standards, and survey of vendors’ profiles are presented. This report provides updated analysis of narrow-band LMR/PMR technologies and markets, including NXDN and MOTOTRBO (as well as dPMR, DMR and other). The growing role of LTE in the PSC development is emphasized. Though, at the present time, LTE is not ready to support some major requirements of first responders’ critical communications, the standards organizations indicate that in 3-5 years major standardization work will be mainly accomplished. Meanwhile, the PSC market will integrate P25/TETRA and LTE environments where traditional networks will be primarily used for voice applications. LTE is selected as the main technology for the FirstNet – the nationwide U.S. PSC network; similar developments are observed all around the globe.

US$4,279.00
Date of Publication: Mar 25, 2015
The High K / ALD Precursors report provides information on the applications and markets associated with front end and back end of line precursors used to produce high dielectric constant (K) dielectrics and atomic layer deposition dielectrics and metals. Market size, growth, and market share statistics are provided.

US$5,550.00
Date of Publication: Sep 15, 2015
This report presents the forecasts for energy harvesters for 2015 through 2020 on a volume and value basis. Sales values in terms of dollar sales are presented in U.S. dollars, while sales values in terms of unit sales are presented in thousand units.  The choice of thousands as a denomination unit was dictated by the shipment volumes for specific categories, which would have otherwise appeared too insignificant.  It is important to note that energy harvesters can power wireless sensor nodes, which will ship by the billions in the future.  Energy harvesters will also power several other device categories that will not be as prolific in number as wireless nodes, but that will experience tremendous growth as well.  

US$6,000.00
Date of Publication: Apr 21, 2015

This study provides coverage of the world market for classic ASICs, 32/64-bit MPU core-based ASICs, classic ASSPs, 32/64-bit MPU core-based ASSPs and PLDs/FPGAs. It is an update of the study last published by Semicast on this market in 2013 and provides analysis segmented into 25 application areas.


US$3,750.00
Date of Publication: Apr 21, 2015
The global soft magnetic material industry is a mature industry. However, a new energy paradigm, consisting of greater reliance on renewable energy sources and increased concern for energy efficiency in the total energy life-cycle, has accelerated research into energy-related technologies. New improved materials with higher energy efficiency have been demonstrated for amorphous and nanocrystalline soft magnetic materials. While amorphous steel has been used extensively as the core material for transformers and motors, the emerging nanocrystalline core material has even higher efficiency and will see much higher growth in the future.

US$3,950.00
Date of Publication: Aug 7, 2015
This research report identifies 17 specific connector types that are expected to grow at a significantly faster rate than the general market over the next five years. This 22-chapter, 220-page report defines the key characteristics of each connector, as well as provides typical applications, major manufacturers along with projected market values and five year CAGR. This report also reviews emerging trends and technologies that are likely to have a major impact on connector design and applications over this same period.

US$3,800.00
Date of Publication: Nov 3, 2014

This report analyzes WSS networking trends; with emphasis on the TCP/IP role in the creation the "Internet of things - IoT" and M2M communications. It also emphasizes the importance of Visible Light Communications in the creation of ubiquitous networking. The Internet offers the potential to connect billions of machines and objects, creating what are known as the 'Internet of Things'(IoT). This integrates various technologies including, Machine-to-Machine service platforms and WSNs.


US$10,000.00
Date of Publication: Jul 27, 2015
The semiconductor industry is undergoing an unprecedented number of changes. The electronic systems end market drivers are changing from personal computers to smart phones and tablets. Major consolidation is taking place in the industry particularly in memory. More and more companies are going to Fab lite and fabless companies are rising in importance.  Optical lithography has entered the multi-patterning era and EUV is late. 450mm is on the horizon. Planar transistors are transitioning to 3D FinFETs and FDSOI. New materials are being introduced at an increased pace. DRAM and NAND are facing fundamental barriers to scaling with new solutions needed.

US$4,000.00
Date of Publication: Jul 27, 2015
The 2015 study has 1022 pages, 258 tables and figures.  Worldwide Industrial Robot markets are poised to achieve significant growth as the  automotive early adopter base provides a way for other industries to leverage economies of scale.  Industrial Robot infrastructure in one industry makes it easier to extend product sets so that they are more available across all industries, remaking all manufacturing everywhere.

US$5,550.00
Date of Publication: Jul 24, 2015
This report provides an overview of the global markets for electronics contract manufacturing services; Analyses of global market trends, with estimates for 2015 and 2016, and projections of compound annual growth rates (CAGRs) through 2021;  Discussion covering electronics contract manufacturing services operations which may include designing, manufacturing, testing, distributing, and providing repair services for electronic assemblies required by original equipment manufacturers (OEMs).

US$2,500.00
Date of Publication: Jul 24, 2015
New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also companies that specialize in silicon interposer layers.

US$2,300.00
Date of Publication: Jul 24, 2015
China Semiconductor Industry Report Covers: 1. Global Semiconductor Market and Industry; 2. China Semiconductor Market and Industry; 3. Eleven Chinese...

US$2,999.00
Date of Publication: Jul 6, 2015

ZigBee is dominating the IEEE 802.15.4 ecosystem and is set to lead the smart home Internet of Things market. Annual shipments for 802.15.4 low power wireless chipsets doubled in 2014 and is on track to increase by 550% by 2020. ZigBee standards will be used in 80% of the 802.15.4 unit shipments at this time. ZigBee PRO has the largest share of the 802.15.4 market today, with wireless mesh networking, advanced sensor applications and industry designed profiles developed over the past decade. In five years, ZigBee PRO will be used in over half of all 802.15.4 shipments with most of the growth coming from the smart home and smart lighting in particular.


US$1,800.00
Date of Publication: Jan 13, 2015
PTC Thermistors: World Markets, Technologies & Opportunities: 2015-2019  This report addresses the global market for PTC thermistors in both...

US$6,600.00
Date of Publication: Mar 25, 2015
World demand for security equipment will advance 6.8 percent annually to $125 billion in 2018. The fastest gains will be in relatively underdeveloped security markets located mainly in Asia, Eastern Europe, Africa, and the Middle East. Because the intensity of security product use is relatively low in these areas, there is still significant growth potential.

US$3,999.00
Date of Publication: May 25, 2015
ZigBee has emerged as the leading smart wireless lighting technology. However, the number of smart LED bulbs using Bluetooth is rapidly growing and products based on Bluetooth Smart Mesh is an emerging trend. By the end of 2019, Bluetooth will become the second largest smart lighting technology up from 7% of residential unit sales in 2014. This report analyzes the rapidly growing market for smart wireless lighting in the residential, commercial and outdoor markets. The report includes global five-year forecasts-- units and software/services-- by market, product segment, geography and technology; the results from surveys with consumers, vendors, retail outlets and other industry players; an in-depth technology evaluation and a competitive analysis with 66 companies across the whole smart lighting value chain.

US$45.00
Date of Publication: Jun 8, 2015
Now updated to Revision F  of the latest IPC-A-610  and J-STD-001  this  Training & Reference Guide  illustrates critical...

US$3,995.00
Date of Publication: May 1, 2015
Network Transmission Market Analysis and Equipment Forecast:  ROADMS, DWDM, Routers and Switches and the Impact of Net Neutrality This report is...

US$4,500.00
Date of Publication: May 24, 2015
Worldwide Carrier Routing Equipment Market Forecast This study presents a forecast of the worldwide carrier routing equipment market based on IDC's...

US$2,750.00
Date of Publication: May 20, 2015
This market, technologies & opportunities report provides an in-depth analysis of value-added and application specific ceramic capacitor world markets, including high voltage ceramic capacitors, high frequency ceramic capacitor, high temperature ceramic capacitors; ceramic feed thru capacitors; ceramic safety capacitors (X&Y) and automotive under-the-hood ceramic capacitors for applications in specialty segments of the power conversion, telecom infrastructure, medical test & scan, medical implant, defense, oil & gas, semiconductor manufacturing equipment, specialty lighting and automotive market segments.

US$5,300.00
Date of Publication: May 19, 2015
This industry study, Insulated Wire & Cable, presents historical demand data (2004, 2009 and 2014) plus forecasts (2019 and 2024) by material, product and market. The study also considers market environment factors, details the industry structure, assesses company market share and profiles over 20 US industry players.

US$4,000.00
Date of Publication: May 19, 2015
Home integrated networks implement home energy management (HEM) and security for the connected home. The connected home is evolving into a multibillion-dollar industry as people use the apps on their smart phone to substitute for a security monitoring service. The smart phone can send alerts and allow control of lighting.  As wireless communication standards evolve to support systems integration, home owners gain more control of the living environment through remote access controlled by apps on the smart phone.

US$4,000.00
Date of Publication: May 6, 2015
Thin Film Batteries: Market Shares, Strategies, and Forecasts, Worldwide, 2015 to 2021 Solid State Thin Film Batteries offer quality for powering...

US$3,495.00
Date of Publication: Apr 28, 2015
The market for radiation detection materials (Scintillator crystals, thin film scintillators, semiconductors and neutron detection materials) will grow from...

US$3,495.00
Date of Publication: Apr 27, 2015

This report examines the latest developments in thin-film and printed battery technologies, from materials and design to manufacturing. We also look at the supplier landscape as it stands today and how it continues to change. In this report we also evaluate all the various end markets, including eight-year forecasts for volumes and revenues. The thin-film and printed batteries sector will expand from $34 million in 2015 to $183 million by 2018 and $1.1 billion by 2022, as long-envisioned end markets such as smart cards and packaging are surpassed by emerging opportunities in consumer electronics, wearable devices, and the Internet-of-Things. 


US$3,495.00
Date of Publication: Apr 27, 2015
In this report n-tech Research updates our evaluation of the various types of technologies that companies are using to make mirrors "smart," while noting...

US$1,800.00
Date of Publication: Apr 24, 2015
Thin film resistors market report Demand for thin film resistors and integrated passive devices are increasing because of the precision nature of the...

US$5,550.00
Date of Publication: Apr 13, 2015
Global Markets and Technologies for Photovoltaic Systems The scope of this study encompasses the major PV technologies: monocrystalline silicon,...

US$4,000.00
Date of Publication: Apr 10, 2015
Robot Cars and Trucks Market Worldwide markets are poised to achieve significant growth as robot cars and trucks permit users to implement...

US$2,000.00
Date of Publication: Apr 6, 2015
As a major application for large-sized panels, LCD TV is the only end product enjoying shipment growth in 2014. Therefore, LCD TV panels have been given...

US$1,800.00
Date of Publication: Dec 3, 2014
Fuses are a $2 billion USD global market found in industrial, automotive, residential and digital electronic markets worldwide. It is an important...

US$2,000.00
Date of Publication: Mar 18, 2015
Worldwide markets for Low Iron Glass are growing as Concentrating Solar Power (CSP) takes off as a way to generate electricity. Rapid adoption of CSP...

US$475.00
Date of Publication: Mar 16, 2015
The Global Market for Gold Nanoparticles, 2010-2025 Market size, production volumes, applications, products, prospects and companies Gold nanoparticles...

US$5,550.00
Date of Publication: Dec 19, 2014
This report provides an updated review of rare earth materials, sources, pricing and production processes and identifies current and emerging applications for these materials. This research study delineates the current market status for rare earths, defines trends and presents growth forecasts for the next five years. Supply and sourcing issues, including the latest developments, are also discussed. The rare earth market is analyzed based on material type and application, and it is expressed as rare earth consumption (in metric tons [t]) and revenues (in $ millions).

US$2,500.00
Date of Publication: Feb 23, 2015
FDD still remains the prevalent standard for LTE deployment as a natural progression path for GSM, W-CDMA and CDMA network operators. However, unpaired TDD...

US$304.00
Date of Publication: Feb 18, 2015
IPC 7711/21B-CN...

US$510.00
Date of Publication: Feb 19, 2015
The Global Market for Aluminium Oxide Nanoparticles: Market, applications and manufacturers Nanomaterials are increasingly becoming part...

US$85.00
Date of Publication: Oct 20, 2014
IPC-J-STD-006C-CN 本标准规定了应用于电子焊接领域的电子级焊料合金、含助焊剂与不含助焊剂的棒状、带状、丝状、粉末状焊料及“专用”电子级焊料的命名原则、要求及测试方法。本标准是一个质量控制标准,无意直接关联制造工艺中材料的性能。对于应用于非电子领域的焊料,应该按照ASTM...

US$85.00
Date of Publication: Mar 12, 2008
J-STD-020D.1新增了无铅组装所用元器件的相关内容!本标准的目的是确定对湿气诱发应力敏感的非气密固态表面贴装器件(SMD)的潮湿敏感等 级。它可用于确定SMD封装的初始可靠性认证应该采用的分级等级。从而能够对这些器件进行正确地包装、存储和操作,以避免其在随后的再流焊接操作时受到热...

US$85.00
Date of Publication: Feb 12, 2013
IPC J-STD-033C-CN 本文件的目的是,针对潮湿/再流焊敏感表面贴装器件,向生产商和用户提供标准的操作、包装、运输及使用方法。所提供的这些方法可避免由于吸收湿气和暴露在...

US$152.00
Date of Publication: Jul 4, 2008
IPC-T-50H-CN 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂,可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语,新术语...

US$119.00
Date of Publication: Nov 4, 2008
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component...

US$119.00
Date of Publication: Mar 7, 2007
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment...

US$152.00
Date of Publication: Dec 12, 2012
本标准规定了高质量焊接互连用助焊剂的分类和特性描述的通用要求。本标准可用于助焊剂的质量控制和采购用途。本标准的目的是对印制电路板组件中电子装联所 用的锡/铅和无铅焊接助焊剂材料进行分类和描述。这些焊接助焊剂材料包括:液态助焊剂、膏状助焊剂、焊膏、外涂助焊剂以及含助焊剂芯的焊丝和预成形焊料。...

US$85.00
Date of Publication: Feb 8, 2012
本标准列出了焊膏鉴定、特征描述的要求。本标准参考了有关金属含量、粘度、塌落、焊料球、粘附力、润湿等的测试方法及标准。IPC-HDBK-005 焊膏评估指南(不包含在本标准的购买中)提供了更多的支持。取代J-STD-005。共10页。于2012年2月发布。    

US$152.00
Date of Publication: Apr 17, 2013
本规范基于性能标准规定了使用浸银作为印制板表面处理的要求。本规范适用于化学药水供应商、印制板制造商、电子制造服务业(EMS)、原始设备制造商 (OEM)。浸银是在铜面上沉积一层薄的银。它是一种多功能的表面处理,适用于焊接。也可应用在一些挤入式接触和表面接触。它适合打铝线。浸银保护下面的...

US$119.00
Date of Publication: Jan 21, 2009
本规范涵盖了按IPC-2221和IPC-2223进行设计的挠性印制板的鉴定及性能要求。挠性印制板可以是单面板、双面板、多层板或刚-挠多层 板。所有这些印制板的结构可以有或无增强板、镀覆孔(PTH)和盲/埋孔。B版本更新的内容包括:表面镀层、白斑、外来夹杂物、粘合剂挤出、可焊环宽、...

US$160.00
Date of Publication: Mar 23, 2011
本标准描述了采用底部端子表面贴装元器件(BTC)在设计和组装方面的挑战,BTC元器件外部连接由构成元器件整体一部分的金属端子组成。本文件中 BTC包括了仅有底部端子并要实施表面贴装的所有类型元器件。包括QFN、 DFN、 SON、 LGA、MLP...

US$85.00
Date of Publication: Oct 19, 2011
中文描述 本文件为设计与制造焊膏及表面贴装胶用模板提供 指导以及采用通孔或者倒装芯片器件的混装技术模 板设计,其中包括锡铅和无铅焊膏、套印、二次印 刷和阶梯模板设计之间的差别。该文件同时提供了 样品定购单和用户检验检查表。共14页,2011年10 月出版。2013年6月翻译。   ...

US$152.00
Date of Publication: Aug 13, 2013
 本用户指南的目的是为如何更好地使用IPC-TM-650测试方法2.6.25耐导电阳极丝(CAF)测试提供指导,以评估机械应力、层压板材料断裂、离 子污染、压合层压板前湿气含量以及其它材料加工特性对耐导电阳极丝(CAF)测试方法结果的影响。...

US$85.00
Date of Publication: Feb 24, 2010
本规范制定了详细的测试方法来评估电子组件表面贴装焊接连接的性能和可靠性,并建立了表面贴装器件在刚性、挠性及刚-挠结构电路板上焊接连接的性能和可靠 性的不同等级。当与IPC-SM-785一起使用本文件时,可更好地理解SMT焊点失效的机理,还提供了将这些性能测试的结果与电子组件在不同的使用环境...

US$85.00
Date of Publication: Jun 23, 2011
本文件旨在描述元器件板级互连的断裂强度特性,它详细说明了确定板级器件互连对非周期板组装和测试操作过程中可能发生的弯曲载荷的抗断裂力的常用方法。本 文件适用于采用常规再流焊接技术连接到印制板上的表面贴装元器件,并补充了有关运输、装卸或现场操作过程中的机械冲击或撞击的现有标准。全文共14...