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Market research can provide your organization with a thorough understanding of its market, customers, and competitors, and can help your company establish a dominant position in its industry. Through market research, you can increase your market share, boosting revenues by millions and market valuations by billions. You can also reduce your costs and time to market. Publication offers company information and comprehensive and intelligent market data information on industry trends, technologies, product, and buyer behavior. This research category provides the list of latest market reports. Subscribe to our RSS feeds to receive excerpts of the latest research reports daily!

Date of Publication: Mar 25, 2015
World demand for security equipment will advance 6.8 percent annually to $125 billion in 2018. The fastest gains will be in relatively underdeveloped security markets located mainly in Asia, Eastern Europe, Africa, and the Middle East. Because the intensity of security product use is relatively low in these areas, there is still significant growth potential.

Date of Publication: May 25, 2015
ZigBee has emerged as the leading smart wireless lighting technology. However, the number of smart LED bulbs using Bluetooth is rapidly growing and products based on Bluetooth Smart Mesh is an emerging trend. By the end of 2019, Bluetooth will become the second largest smart lighting technology up from 7% of residential unit sales in 2014. This report analyzes the rapidly growing market for smart wireless lighting in the residential, commercial and outdoor markets. The report includes global five-year forecasts-- units and software/services-- by market, product segment, geography and technology; the results from surveys with consumers, vendors, retail outlets and other industry players; an in-depth technology evaluation and a competitive analysis with 66 companies across the whole smart lighting value chain.

Date of Publication: Jun 8, 2015
Now updated to Revision F  of the latest IPC-A-610  and J-STD-001  this  Training & Reference Guide  illustrates critical...

Date of Publication: May 1, 2015
Network Transmission Market Analysis and Equipment Forecast:  ROADMS, DWDM, Routers and Switches and the Impact of Net Neutrality This report is...

Date of Publication: May 24, 2015
Worldwide Carrier Routing Equipment Market Forecast This study presents a forecast of the worldwide carrier routing equipment market based on IDC's...

Date of Publication: May 20, 2015
This market, technologies & opportunities report provides an in-depth analysis of value-added and application specific ceramic capacitor world markets, including high voltage ceramic capacitors, high frequency ceramic capacitor, high temperature ceramic capacitors; ceramic feed thru capacitors; ceramic safety capacitors (X&Y) and automotive under-the-hood ceramic capacitors for applications in specialty segments of the power conversion, telecom infrastructure, medical test & scan, medical implant, defense, oil & gas, semiconductor manufacturing equipment, specialty lighting and automotive market segments.

Date of Publication: May 19, 2015
This industry study, Insulated Wire & Cable, presents historical demand data (2004, 2009 and 2014) plus forecasts (2019 and 2024) by material, product and market. The study also considers market environment factors, details the industry structure, assesses company market share and profiles over 20 US industry players.

Date of Publication: May 19, 2015
Home integrated networks implement home energy management (HEM) and security for the connected home. The connected home is evolving into a multibillion-dollar industry as people use the apps on their smart phone to substitute for a security monitoring service. The smart phone can send alerts and allow control of lighting.  As wireless communication standards evolve to support systems integration, home owners gain more control of the living environment through remote access controlled by apps on the smart phone.

Date of Publication: May 6, 2015
Thin Film Batteries: Market Shares, Strategies, and Forecasts, Worldwide, 2015 to 2021 Solid State Thin Film Batteries offer quality for powering...

Date of Publication: Apr 28, 2015
The market for radiation detection materials (Scintillator crystals, thin film scintillators, semiconductors and neutron detection materials) will grow from...

Date of Publication: Apr 27, 2015

This report examines the latest developments in thin-film and printed battery technologies, from materials and design to manufacturing. We also look at the supplier landscape as it stands today and how it continues to change. In this report we also evaluate all the various end markets, including eight-year forecasts for volumes and revenues. The thin-film and printed batteries sector will expand from $34 million in 2015 to $183 million by 2018 and $1.1 billion by 2022, as long-envisioned end markets such as smart cards and packaging are surpassed by emerging opportunities in consumer electronics, wearable devices, and the Internet-of-Things. 

Date of Publication: Apr 27, 2015
In this report n-tech Research updates our evaluation of the various types of technologies that companies are using to make mirrors "smart," while noting...

Date of Publication: Apr 24, 2015
Thin film resistors market report Demand for thin film resistors and integrated passive devices are increasing because of the precision nature of the...

Date of Publication: Apr 13, 2015
Global Markets and Technologies for Photovoltaic Systems The scope of this study encompasses the major PV technologies: monocrystalline silicon,...

Date of Publication: Apr 10, 2015
Robot Cars and Trucks Market Worldwide markets are poised to achieve significant growth as robot cars and trucks permit users to implement...

Date of Publication: Apr 6, 2015
As a major application for large-sized panels, LCD TV is the only end product enjoying shipment growth in 2014. Therefore, LCD TV panels have been given...

Date of Publication: Dec 3, 2014
Fuses are a $2 billion USD global market found in industrial, automotive, residential and digital electronic markets worldwide. It is an important...

Date of Publication: Mar 18, 2015
Worldwide markets for Low Iron Glass are growing as Concentrating Solar Power (CSP) takes off as a way to generate electricity. Rapid adoption of CSP...

Date of Publication: Mar 16, 2015
The Global Market for Gold Nanoparticles, 2010-2025 Market size, production volumes, applications, products, prospects and companies Gold nanoparticles...

Date of Publication: Dec 19, 2014
This report provides an updated review of rare earth materials, sources, pricing and production processes and identifies current and emerging applications for these materials. This research study delineates the current market status for rare earths, defines trends and presents growth forecasts for the next five years. Supply and sourcing issues, including the latest developments, are also discussed. The rare earth market is analyzed based on material type and application, and it is expressed as rare earth consumption (in metric tons [t]) and revenues (in $ millions).

Date of Publication: Feb 23, 2015
FDD still remains the prevalent standard for LTE deployment as a natural progression path for GSM, W-CDMA and CDMA network operators. However, unpaired TDD...

Date of Publication: Feb 18, 2015
IPC 7711/21B-CN...

Date of Publication: Feb 19, 2015
The Global Market for Aluminium Oxide Nanoparticles: Market, applications and manufacturers Nanomaterials are increasingly becoming part...

Date of Publication: Oct 20, 2014
IPC-J-STD-006C-CN 本标准规定了应用于电子焊接领域的电子级焊料合金、含助焊剂与不含助焊剂的棒状、带状、丝状、粉末状焊料及“专用”电子级焊料的命名原则、要求及测试方法。本标准是一个质量控制标准,无意直接关联制造工艺中材料的性能。对于应用于非电子领域的焊料,应该按照ASTM...

Date of Publication: Mar 12, 2008
J-STD-020D.1新增了无铅组装所用元器件的相关内容!本标准的目的是确定对湿气诱发应力敏感的非气密固态表面贴装器件(SMD)的潮湿敏感等 级。它可用于确定SMD封装的初始可靠性认证应该采用的分级等级。从而能够对这些器件进行正确地包装、存储和操作,以避免其在随后的再流焊接操作时受到热...

Date of Publication: Feb 12, 2013
IPC J-STD-033C-CN 本文件的目的是,针对潮湿/再流焊敏感表面贴装器件,向生产商和用户提供标准的操作、包装、运输及使用方法。所提供的这些方法可避免由于吸收湿气和暴露在...

Date of Publication: Jul 4, 2008
IPC-T-50H-CN 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂,可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语,新术语...

Date of Publication: Nov 4, 2008
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component...

Date of Publication: Mar 7, 2007
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment...

Date of Publication: Dec 12, 2012
本标准规定了高质量焊接互连用助焊剂的分类和特性描述的通用要求。本标准可用于助焊剂的质量控制和采购用途。本标准的目的是对印制电路板组件中电子装联所 用的锡/铅和无铅焊接助焊剂材料进行分类和描述。这些焊接助焊剂材料包括:液态助焊剂、膏状助焊剂、焊膏、外涂助焊剂以及含助焊剂芯的焊丝和预成形焊料。...

Date of Publication: Feb 8, 2012
本标准列出了焊膏鉴定、特征描述的要求。本标准参考了有关金属含量、粘度、塌落、焊料球、粘附力、润湿等的测试方法及标准。IPC-HDBK-005 焊膏评估指南(不包含在本标准的购买中)提供了更多的支持。取代J-STD-005。共10页。于2012年2月发布。    

Date of Publication: Apr 17, 2013
本规范基于性能标准规定了使用浸银作为印制板表面处理的要求。本规范适用于化学药水供应商、印制板制造商、电子制造服务业(EMS)、原始设备制造商 (OEM)。浸银是在铜面上沉积一层薄的银。它是一种多功能的表面处理,适用于焊接。也可应用在一些挤入式接触和表面接触。它适合打铝线。浸银保护下面的...

Date of Publication: Jan 21, 2009
本规范涵盖了按IPC-2221和IPC-2223进行设计的挠性印制板的鉴定及性能要求。挠性印制板可以是单面板、双面板、多层板或刚-挠多层 板。所有这些印制板的结构可以有或无增强板、镀覆孔(PTH)和盲/埋孔。B版本更新的内容包括:表面镀层、白斑、外来夹杂物、粘合剂挤出、可焊环宽、...

Date of Publication: Mar 23, 2011
本标准描述了采用底部端子表面贴装元器件(BTC)在设计和组装方面的挑战,BTC元器件外部连接由构成元器件整体一部分的金属端子组成。本文件中 BTC包括了仅有底部端子并要实施表面贴装的所有类型元器件。包括QFN、 DFN、 SON、 LGA、MLP...

Date of Publication: Oct 19, 2011
中文描述 本文件为设计与制造焊膏及表面贴装胶用模板提供 指导以及采用通孔或者倒装芯片器件的混装技术模 板设计,其中包括锡铅和无铅焊膏、套印、二次印 刷和阶梯模板设计之间的差别。该文件同时提供了 样品定购单和用户检验检查表。共14页,2011年10 月出版。2013年6月翻译。   ...

Date of Publication: Aug 13, 2013
 本用户指南的目的是为如何更好地使用IPC-TM-650测试方法2.6.25耐导电阳极丝(CAF)测试提供指导,以评估机械应力、层压板材料断裂、离 子污染、压合层压板前湿气含量以及其它材料加工特性对耐导电阳极丝(CAF)测试方法结果的影响。...

Date of Publication: Feb 24, 2010
本规范制定了详细的测试方法来评估电子组件表面贴装焊接连接的性能和可靠性,并建立了表面贴装器件在刚性、挠性及刚-挠结构电路板上焊接连接的性能和可靠 性的不同等级。当与IPC-SM-785一起使用本文件时,可更好地理解SMT焊点失效的机理,还提供了将这些性能测试的结果与电子组件在不同的使用环境...

Date of Publication: Jun 23, 2011
本文件旨在描述元器件板级互连的断裂强度特性,它详细说明了确定板级器件互连对非周期板组装和测试操作过程中可能发生的弯曲载荷的抗断裂力的常用方法。本 文件适用于采用常规再流焊接技术连接到印制板上的表面贴装元器件,并补充了有关运输、装卸或现场操作过程中的机械冲击或撞击的现有标准。全文共14...

Date of Publication: Feb 8, 2012
应变测试可以对SMT封装在组装过程、测试和操作中受到的应变和应变率水平进行客观分析。对于不同的焊料合金、封装类型、表面处理或层压板材料,过大的应变都会导致各种模式的失效。 本文件对印制板制造过程中PCAs的应变测试制定了详细的指南,这些制造过程包括组装、测试、系统集成以及其他可能导致印制板弯曲的操作方式。...

Date of Publication: Feb 9, 2015
Independent 5-year Consumer Electronics Industry Forecasts for China The outlook for consumer electronics spending growth in China is strong over the...

Date of Publication: Dec 18, 2012
Cette norme couvre les définitions et les propriétés des circuits imprimés rigides, incluant les simple-faces, les double-faces,...

Date of Publication: Nov 15, 2007
 IPC-7711/21B-SP Retrabajo, Modificación y Reparación de Ensamble Electrónicos This is the Spanish language translation of...

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Date of Publication: Feb 14, 2014
1601-DE Handhabung und Lagerung von Leiterplatten 2152-DE Designrichtlinie für die Bestimmung der...

Date of Publication: Sep 2, 2014
Silicon wafer purchases represent the highest operating expense for many device manufacturers and as a result are a constant target for price reduction....

Date of Publication: May 22, 2014
Volume 2 is a compilation of key contacts involved in military and aerospace fiber optics research, design, manufacture, installation, and test. The number of experts in fiber optics in the military and aerospace industry is limited. Knowing who these experts are and how to contact them is critical to any marketing effort by companies already doing business with the military and those new to the business. Over 300 key contacts in government agencies and suppliers to the military including component and subsystem suppliers, OEMs, research, training and standards organizations have been identified.

Date of Publication: Dec 17, 2014
Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure...

Date of Publication: Feb 3, 2015
Wafer Level Packaging (WLP) is one of the fastest, if not the fastest, growing segments of the semiconductor industry. This is driven by the mobile...

Date of Publication: Feb 2, 2015
The global smart card industry has been witnessing dynamic changes since the last few years which have created significant opportunities for players...

Date of Publication: Feb 2, 2015
The global nanoparticle market is showing tremendous growth backed by nanoparticle development programs, research initiatives, government support and...

Date of Publication: Feb 2, 2015
The research study analyzes the market dynamics of key segments to draw attention to areas offering immense possibilities for companies to boost their growth. The report studies the market at three levels viz. by region (North America, Europe, Asia and ROW), by type (PEMFC, DMFC, SOFC, PAFC, MCFC and AFC) and by application (Transportation, Stationary and Portable). Our research depicts the state of fuel cell market in each of these segments in both volume (in shipments and MW) and value terms during 2012-2020.

Date of Publication: Mar 11, 2014
The IPC-1755 Conflict Minerals Data Exchange establishes a standard reporting format for exchange of information between supply chain participants about...

Date of Publication: Jan 22, 2015
This market research report covers the global market for metal oxide varistors including multilayered chip varistors, varistor arrays, radial leaded disc...

Date of Publication: Nov 3, 2014
The properties of metal oxide nanoparticles/ nanopowders/nanocrystals display enhanced electrical, optical, magnetic and chemical properties from the bulk...

Date of Publication: Jan 15, 2015
Global demand for private contract security services is forecast to increase 6.9 percent per year to nearly $267 billion in 2018, driven by the continued growth of security service markets in a number of developing countries, notably Brazil, China, India, and Mexico. Demand for security services will be buoyed by an improved economic environment and growing building construction activity, particularly in developed nations, with rising urbanization and higher personal incomes supporting demand in developing nations. The security service market will also be supported by concerns about crime, terrorism, and insufficient public safety measures.

Date of Publication: Jan 13, 2015
Next generation commercial drones achieve a complete replacement of existing commercial airfreight delivery systems, they are used for 3D mapping, commercial...

Date of Publication: Jan 7, 2015
Global Market Analysis on Gas Discharge Tube Arresters This newly released market research report provides detailed analysis of the global market for gas...

Date of Publication: Nov 26, 2014
The much-heralded arrival of the Internet-of-Things (IoT) will lead to a remaking of the sensor industry, generating hundreds of new opportunities for...

Date of Publication: Nov 20, 2014
This report provides business and technical information on sputter targets as used for semiconductor devices. Also included is information on supply chain...

Date of Publication: Apr 16, 2014
The Wet Chemicals Report provides a detailed look at the wet chemicals market as it applies to semiconductor processing. A view of the larger world chemical...

Date of Publication: Nov 20, 2014
The Quartz Report provides a comprehensive look at quartz used for semiconductor equipment and wafer production.  Included are business and technical...

Date of Publication: Nov 20, 2014
CMP Consumables has just broken through the $3B market and continues to grow at rates which exceed wafer starts. This report reviews in detail the markets...

Date of Publication: Dec 9, 2013
The Silicon Carbide Report focuses on silicon carbide used for and with semiconductor process equipment. A contrast between silicon carbide and quartz is...

Date of Publication: Nov 20, 2014
The CMP Equipment Components Report reviews in detail the markets and technology as it applies to materials related to Chemical Mechanical Polishing, such...

Date of Publication: Nov 20, 2014
The CMP Equipment Components Report reviews in detail the markets and technology as it applies to materials related to Chemical Mechanical Polishing, such...