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US$2,495.00
Date of Publication: Oct 18, 2017
The high price of oil in the past few years has been a catalyst for development in other alternative energy sources. Semiconductor technology surrounding the alternative energy markets includes advanced IGBT design, optoelectronics, advanced power conversion ICs, digital signal processing, MCUs, and advanced mixed signal and analog circuits.  This report discussed the potential for these products to be the next killer green application.

US$2,495.00
Date of Publication: Oct 18, 2017
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

US$2,495.00
Date of Publication: Oct 18, 2017
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

US$2,495.00
Date of Publication: Oct 18, 2017

The commercial battle for next-generation power semiconductors is evolving. IGBTs, SiC and other technologies are geared for the niche-oriented markets at 1,700 volts and higher. But what is the best technology for the larger 600- and 1,200-volt markets? both super-junction MOSFETs and IGBTs are ramping up on 300mm wafers, making them less expensive than GaN and SiC. In comparison, SiC MOSFETs are ramping up on 100mm wafers, while GaN-on-silicon is running on 150mm substrates. This report analyzes and forecasts the traditional power semiconductor market as well as next generation devices.  Market shares of vendors by type are presented.


US$4,950.00
Date of Publication: Oct 18, 2017

This report analyzes the worldwide markets for Lighting Fixtures and Luminaires in US$ by the following Product Segments and End-Use Sectors: Product Segments - Portable, Non-Portable, and Parts and Accessories; End-Use Sectors - Automotive Lighting, and General Lighting (Residential, Office, Outdoor, Architectural, & Others). The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. 


US$4,950.00
Date of Publication: Oct 18, 2017
This report analyzes the worldwide markets for Automatic Number Plate Recognition Systems in US$ Thousand. The Global market is analyzed by the following Applications: Toll & Parking, Law Enforcement, and Journey Time. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, China, South Korea and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024. 

US$4,950.00
Date of Publication: Oct 18, 2017
This report analyzes the worldwide markets for Environmental Sensing and Monitoring Technologies in US$ Million by the following Segments: Air Monitoring, Water Monitoring, Soil Monitoring, and Noise Monitoring. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.