New Publications

Market research can provide your organization with a thorough understanding of its market, customers, and competitors, and can help your company establish a dominant position in its industry. Through market research, you can increase your market share, boosting revenues by millions and market valuations by billions. You can also reduce your costs and time to market.  Electronics.ca Publication offers company information and comprehensive and intelligent market data information on industry trends, technologies, product, and buyer behavior. This research category provides the list of latest market reports. Subscribe to our RSS feeds to receive excerpts of the latest research reports daily!

US$5,500.00
Date of Publication: Jun 20, 2019
The global 5G chipset market should grow from $870.0 million in 2019 to reach $10.9 billion by 2024 at a compound annual growth rate (CAGR) of 65.7% for the period of 2019-2024.

US$5,500.00
Date of Publication: Apr 3, 2019

The Strategic Cost and Price Model - 2019 is now available with eight new fabs, expanded logic and DRAM process coverage, updated data and many other enhancements. Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron.


US$4,400.00
Date of Publication: Jul 30, 2019
The 2019 study has 376 pages, 159 tables and figures. Worldwide markets are poised to achieve explosive growth generating several new trillion-dollar markets as the digital economy takes hold. Across the industrial spectrum smart devices and robots provetheirvalue by managing digital informationin real time across enterprise boundaries, encouraging collaborative business efforts. Lowering the costs of manufacturing and logistics management is a key benefit.

US$3,720.00
Date of Publication: Jul 5, 2019
Analysis Of The Following Nanomaterials: Aluminium Oxide Nanoparticles, Antimony Tin Oxide Nanoparticles, Bismuth Oxide Nanoparticles, Carbon Nanotubes, Cerium Oxide Nanoparticles, Cobalt Oxide Nanoparticles, Copper Oxide Nanoparticles, Dendrimers, Fullerenes, Gold Nanoparticles, Graphene, Iron Oxide Nanoparticles, Magnesium Oxide Nanoparticles, Manganese Oxide Nanoparticles, Nanocellulose, Nanoclays, Nanodiamonds, Nanofibers, Nanosilver, Nanowires, Nickel Nanoparticles, Quantum Dots, Silicon Oxide Nanoparticles, Titanium Dioxide Nanoparticles, Zinc Oxide Nanoparticles, Zirconium Oxide Nanoparticles, Nanoprecipitated Calcium Carbonate, Graphene And Carbon Quantum Dots, Hydroxyapatite Nanoparticles, Palladium Nanoparticles, Yttrium Oxide Nanoparticles, Other 2D Materials.

US$3,995.00
Date of Publication: Jun 27, 2017
This comprehensive research evaluates the smart cities market including leading vendors and strategies (such as a single vendor centric approach), infrastructure, solutions, applications and services. It analyzes market factors driving solution adoption, technology readiness and fitness for use, and other considerations.

US$1,995.00
Date of Publication: Jun 25, 2019
The 6G technology market facilitating substantive improvements in the areas of sensing, imaging, presence and location determination. Higher frequencies will enable much faster sampling rates as well as significantly greater accuracy, down to the centimeter level. This will have big implications for many government and industry solutions in public safety and critical asset protection such as threat detection, health monitoring, feature/facial recognition and decision making (as in law enforcement, social credit systems, and other areas), air quality measurements, gas and toxicity sensing, and much more.

US$2,300.00
Date of Publication: Apr 9, 2019
The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices.

US$1,400.00
Date of Publication: Jun 24, 2019

The Assembly and Test Cost and Price model covers wafer sorts, assembly of leadframe and organic substrates packages including EMIB, wafer level packaging and InFO and class test. The model is user customizable and we are continually adding new features.