Performance Standard for Ball Grid Array Balls

Date of Publication: Jun 12, 2002
US$75.00
IPC-J-STD-032

IPC-J-STD-032 standard developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages.

It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications.

10 pages. Released June 2002.

Date of Publication:
Jun 12, 2002
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