BdMATFAM: Base Materials Specifications for Printed Boards

IPC, Date of Publication: Jul 17, 2017

"Base Materials Specifications for Printed Boards", BdMATFAM - is a family of specifications for board materials used in the fabrication process.

This kit includes the following collection of IPC standards:

IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials

IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry

IPC-4203 Cover and Bonding Material for Flexible Printed Circuitry

IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

IPC-4562 Metal Foil for Printed Board Applications

IPC-4563 Resin Coated Copper Foil for Printed Boards Guideline

Additional Information:
Collection of IPC documents
Date of Publication:
Jul 17, 2017
File Format:
Printed Copies