REPAIR / REWORK

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Ball Grid Array Rework
DVD-196C Area Array Rework
US$520.00
Date of Publication: Jul 7, 2016
DVD-196C explains the advantages and challenges of area grid arrays, including component descriptions and terminology. Provides a visual overview of removal / replacement procedures for BGAs and QFNs, using both convection and IR equipment. Covers site preparation, reballing, component alignment, solder paste printing, preheating considerations and thermal profiles.
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Ray's Rework Secrets
Ray's Rework Secrets
US$520.00
Date of Publication: Jun 21, 2016

An introduction to operator safety training in electronics assembly — covers personal protective wear; how to avoid injury from cuts and burns; prevention of "cumulative trauma disorders"; proper lifting technique; HazMat and MSDS; lead free and tin lead solders, electrical safety, warning systems, and the importance of good housekeeping. Stresses the importance of operator knowledge and attitude to avoid personal injury.

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Through-Hole Rework - Includes Lead Free
Through-Hole Rework - Includes Lead Free
US$495.00
Date of Publication: Jul 9, 2015
DVD-41C introduces industry specifications J-STD-001 & IPC-A-610 and explains the concept of process indicators. Includes an animated examination of the invisible problems that can be created during rework -- to explain why it's so important to avoid unnecessary rework. Reviews each of the tools and materials for PTH Rework (including low-residue fluxes). Individual sections cover vacuum extraction of straight-through (round) leads; partially and fully-clinched leads, DIP and auxiliary heating techniques for large thermal mass boards and inaccessible leads. Details industry-approved rework techniques for solder defects, including solder bridges, icicles, and excess / insufficient solder. 
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Rework of Surface Mount Chip Components
Rework of Surface Mount Chip Components
US$475.00
Date of Publication: Jul 9, 2015
DVD-92C begins with an explanation of chip component terminology and size codes and provides detail flux considerations and land preparation using solder braid and vacuum extractor. Demonstrates industry approved techniques and common problems to avoid during removal and replacement of all types of chip components using the following hand tools: hand soldering iron (single-point and bifurcated tip); pulse heat tweezers; continuous heat tweezers; and hot air pencil. Also explains adhesive bonded components and special heating considerations for ceramic chip capacitors.
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Gull Wing Rework
Gull Wing Rework
US$475.00
Date of Publication: Jul 9, 2015
High-quality microphotography and computer animation provide precise visual instruction on industry-approved techniques for the removal of all types of gull wing components (QFPs, SOICs, TSOPs, and SOTs) using a hand soldering iron, thermal tweezers, and thermal vacuum pick. Land preparation using solder braid and vacuum extraction, and component replacement using a hand soldering iron, hot air pencil, continuous flow solder, and hot bar are demonstrated. Also covers gull wing component ID / handling, tool preparation and maintenance, and heat enhancement techniques.
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Rework of J-Lead Components
Rework of J-Lead Components
US$350.00
Date of Publication: Jul 9, 2015
DVD-94C begins with PLCC/SOJ component descriptions and terminology and demonstrates component removal with the pulse-heated hand tool and thermal tweezers, using three different heat enhancement techniques (flux, bridge-fill, and solder wrap). Reviews land preparation, component orientation and alignment techniques. Shows component replacement using point to point, continuous flow and hot air pencil soldering techniques. Also covers cleaning options.
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Land and Conductor Repair for Electronic Assemblies
Land and Conductor Repair for Electronic Assemblies
US$475.00
Date of Publication: Jul 9, 2015
DVD-97ABC demonstrates industry-approved repair techniques for electronic assemblies. Each procedure includes damage analysis, repair procedures and evaluation criteria and covers laminate damage repair, rebonding isolated surface mount lands using adhesive bonding film/adhesive-backed replacement lands, and rebonding lifted conductors using liquid epoxy overbond. Also covers conductor replacement with adhesive backed material and liquid epoxy, repairing gaps in conductors, replacing straight and bent conductors, surface mount land/conductor replacement with adhesive-backed material, and solder mask replacement.
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