IPC 7711/21B Rework, Modification and Repair of 7711/21BElectronic Assemblies

IPC 7711/21B Rework, Modification and Repair of Electronic Assemblies

IPC, Date of Publication: Nov 28, 2007, 300 Pages

Major update for lead free support and enhanced inspection guidelines for repairs and modifications!

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex-print repair. Part 1 General Requirements has also been updated for ease of use and provides important direction and guidelines for all procedures. This section includes procedures common to rework, repair and modification. Part 2 is IPC-7711B and the procedures include tools, materials and methods to be used in removing and replacing surface mount and through-hole components. Part 3 is IPC-7721B and includes procedures for modifying assemblies and accomplishing laminate and conductor repairs. This guide is provided in a three ring binder for easy updating. Users can insert company specific procedures, or remove just the pages needed for a specific job to help keep the workbench clear. Future updates can be downloaded FREE from www.ipc.org/downloads. Many procedures have color illustrations to help the user understand the guide. Supersedes IPC-7711, IPC-7721 and IPC-R-700.



Date of Publication:
Nov 28, 2007
File Format:
CD-ROM & Print Copy
Number of Pages:
300 Pages
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