Selective Soldering Markets

Selective Soldering - Global Strategic Business Report

Global Industry Analysts, Date of Publication: Apr 13, 2016, 187 Pages
US$4,500.00
GIA-MCP6564

Selective Soldering Market Trends

The global market for Selective Soldering Equipment is projected to reach US$63.5 million by 2022, driven by shrinking component size, rising component density and complexity, and growing investments in new generation semiconductor manufacturing equipment. The drive towards miniaturization of electronic components used mainly in telecom equipment and the increasing use of components that are temperature sensitive are being touted as key factors for growth of laser soldering. Simplified programming, flexible innovations, and better user interfaces are contributing towards the growth of selective soldering into a reliable replacement for custom pallets wave soldering and/or manual soldering. In comparison to hand-soldering, selective soldering systems provide higher ROI by lowering labor and production costs. Asia-Pacific represents the largest market worldwide. Trailing a CAGR of 9.0% over the analysis period, the region also ranks as the fastest growing market, led by stable GDP gains, and expanding semiconductor manufacturing base in countries such as China, Taiwan and South Korea.

This report analyzes the worldwide markets for Selective Soldering in US$ Thousand. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022. Also, a six-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 42 companies including many key and niche players such as -

ACE Production Technologies, Inc.
DDM Novastar LLC
Ebso GmbH
EPM Handels AG
ERSA GmbH

Selective Soldering - Global Strategic Business Report
TABLE OF CONTENTS

 I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

      Study Reliability and Reporting Limitations                       I-1
      Disclaimers                                                       I-2
      Data Interpretation & Reporting Level                             I-2
       Quantitative Techniques & Analytics                              I-3
      Product Definitions and Scope of Study                            I-3


 II. EXECUTIVE SUMMARY

  1. INDUSTRY OVERVIEW                                                  II-1
      A Prelude                                                         II-1
      Selective Soldering Machines and Equipment - Key Features and
       Uses                                                             II-2
       Wave Height Monitoring                                           II-2
       Top-side Preheating                                              II-2
       Inert Atmosphere Control and Solder Delivery                     II-2
       Nitrogen Peel-off Jet                                            II-3
       Dual Head Fluxers                                                II-3
       Swappable Solder Pots                                            II-3
       Larger Nozzles                                                   II-3
      Growth of SMT Equipment and Flexible PCBs Form Strong Base for
       Rising SSE Demand                                                II-4
       Opportunity Indicators                                           II-6
        Table 1: Global Electronics Systems Market by End-Use
        Industry (2015): Percentage Breakdown of Sales for Computers & 
        Peripheral, Communication Devices, Consumer Electronic
        Devices, Automotive Electronics, Industrial Electronics, and
        Aerospace/Defense Electronics (includes corresponding
        Graph/Chart)                                                    II-6

        Table 2: World Market for PCBs (2015): Percentage Share
        Breakdown of Key End-Use Application Markets (includes
        corresponding Graph/Chart)                                      II-6
      Growth of Flexible Printed Circuit Boards - A Business Case
       for SSE                                                          II-6
      Selective Soldering Still Enjoys Growth despite Shift from TH
       to SMT Component                                                 II-8
      Laser Soldering - An Important Selective Soldering Process        II-8
       Types of Selective Soldering Processes and Their Features        II-9
      Market Outlook                                                    II-10
       Asia-Pacific - Dominates the Global Scenario                     II-10
       Europe and the US - Other Prominent Markets                      II-10
      Competition - A Brief Note                                        II-10

  2. GROWTH DRIVERS, MARKET TRENDS AND ISSUES                           II-11
      Small but Persistent Demand for Through-Hole Components Drives
       Growth                                                           II-11
      Automation - A Buzz Word in Selective Soldering Market            II-11
       Automated Selective Soldering of SMT Components                  II-11
       Automated Selective Soldering Need of the Hour for Soldering
        PCBs with Double-Sided SMT Content                              II-12
      Innovations Drive Selective Soldering Market Growth               II-12
       Selective Aperture Tooling over Wave Solder                      II-12
       Mass Selective Dip Solder Foundation                             II-12
       Miniature Wave Selective Solder Fountains                        II-13
       Laser Selective Soldering System                                 II-13
       Selective Flux Applicators                                       II-13
      Advantages of Miniature Wave Selective Soldering over Wave
       Soldering                                                        II-13
      No-Clean Flux Encourages Efficiency in Selective Soldering        II-14
      Cost and Quality Issues Drive Industry towards Selective
       Soldering                                                        II-15
      Shrinking Component Size Paints Brighter Prospects                II-15
      Next Generation Electronics: A Tantalizing Opportunity for
       Selective Soldering                                              II-15
      Challenges Associated with Use of SSE                             II-15

  3. OVERVIEW OF SELECT END-USE INDUSTRIES                              II-17
      From OEMs to CEMs and EMS Providers: Changing Customer Profile    II-17
       Important End Uses of Surface Mount Technology                   II-17
      Developments in Automotive Electronics Drives Opportunities
       for SSE                                                          II-17
       Table 3: Automotive Electronics as a Percentage of Vehicle
       Production Cost (includes corresponding Graph/Chart)             II-18

       Table 4: Increasing Electronic Content in Automobiles as a
       Percentage of Vehicle Value (includes corresponding
       Graph/Chart)                                                     II-19
       Enabling the Electronic Marvel                                   II-19
      Telecommunications Soars Demand                                   II-19
      Healthcare Segment Reinforcing Growth in Selective Soldering
       Equipment Industry                                               II-20
      Selective Soldering Machines in Medical EMS                       II-20
      Growing Proliferation of Consumer Electronic Devices to Drive
       Demand for Selective Soldering                                   II-20
       Table 5: Global Market for Consumer Electronics (2012 &
       2015): Breakdown of Annual Revenue (in US$ Billion) by
       Region/Country for US, Canada, Europe, Asia-Pacific
       (including Japan), Middle East, and Latin America (includes
       corresponding Graph/Chart)                                       II-21
      Electronic Manufacturing Services Industry: A Key Customer of
       Selective Soldering Equipment                                    II-22
       Advent of Laser Soldering in Various Industries                  II-22
        Industrial Applications                                         II-22
        Electronics Manufacturing                                       II-23
        Automobile Application                                          II-24
        Medical Application                                             II-24
        Laser Soldering Optoelectronics                                 II-24

  4. TECHNOLOGY INNOVATIONS                                             II-25
      Solder Nozzles Cleaning - Innovative Patented Ultrasonic
       Technology                                                       II-25
      Development of Direct Diode Lasers                                II-25
      Latest Feature Additions in i-Pulse Machines                      II-25
      Development of the InnoLot Lead-Free Alloy for Automotive
       Electronics                                                      II-26
      Development of Preheated Solder Joints for Power Electronics      II-27
      Solder Masks                                                      II-28
      Soldering of Image Sensors to PCBs                                II-28
       Electrostatic Damage                                             II-29
       Board Assembly                                                   II-29
       Manual Soldering of Leaded or Pinned Devices                     II-29
       Reflow-Soldering                                                 II-29
       Lead-Free Soldering                                              II-29

  5. PRODUCT OVERVIEW                                                   II-30
      Selective Soldering - An Introduction                             II-30
      Evolution of Automated Soldering                                  II-30
      Automated Selective Soldering                                     II-31
       Selective Wave Soldering                                         II-31
       Selective Fountain Soldering                                     II-31
       Programmable Selective Soldering                                 II-32
       Selective Miniwave Soldering                                     II-32
       Selective Laser Soldering                                        II-32
        Advantages of Laser Soldering                                   II-33
        Limitations of Laser Soldering                                  II-33
        Classification of Laser Soldering Processes                     II-33
         Single Spot Soldering Process                                  II-33
         Simultaneous Soldering                                         II-33
         Mask Soldering                                                 II-33
       Round-table Selective Soldering                                  II-34
        Automatic Soldering Techniques                                  II-34
        Reflow Soldering                                                II-34
        Wave Soldering                                                  II-35
        Circuit-board Loading Station                                   II-36
        Fluxing Station                                                 II-36
        Pre-heating Station                                             II-36
        Soldering Station                                               II-37
         Classification of Solder Joints                                II-37
          Good Solder Joint                                             II-37
          Poor Solder Fillet                                            II-37
          Shorts                                                        II-37
       Solder Paste Application/Paste Printing - The Blue Print         II-38
        Important Considerations for Good Quality Printing              II-38
        Why Use Solder Paste?                                           II-38
        Which Type of Solder Paste to be Used?                          II-39
        Prerequisites of an Ideal Solder Paste                          II-39
        Regulations on the Usage of Solder Pastes                       II-39
        Other Soldering Techniques                                      II-40
         Advantages of Using Selective Soldering Processes              II-40
         Encountering Selective Soldering Problems                      II-40
        Stringing/Webbing                                               II-41
        Fillet Tearing                                                  II-41
        Copper Dissolution                                              II-41
         Key Process Issues for Lead-free Selective Soldering           II-41
        Wave Height Monitoring                                          II-41
        Top Side Preheating                                             II-42
        Solder Delivery and Inert Atmosphere Control                    II-42
        Nitrogen Peel-off Jet                                           II-42
        Dual Head Fluxers                                               II-42
        Swappable Solder Pots for Lead-free                             II-43
        Larger Nozzles                                                  II-43
         Factors Affecting Investment in Selective Soldering Equipment  II-43
         Stamp Soldering                                                II-43
        Benefits of Stamp Soldering                                     II-44
         Diode Lasers - Creating Opportunity through “FlashSoldering”   II-44
        Hot Bar                                                         II-44
        Common Soldering Iron                                           II-44
        Micro-flame                                                     II-44
         Road Ahead for FlashSoldering                                  II-45

  6. PRODUCT INTRODUCTIONS/INNOVATIONS                                  II-46
      ACE to Showcase KISS-103IL, a Novel Selective Soldering
       Technology at SMT                                                II-46
      Vitronics Soltec to Launch New ZEVAm Selective Soldering Platform II-46
      Seho North America Introduces GoSelective-LS Selective
       Soldering Machine                                                II-46
      Manncorp Releases IS-T-300, an All-in-One Selective Fluxing
       and Soldering System                                             II-46
      Kurtz Ersa Showcases Complete Range of Ersa’s Selective
       Soldering Equipment                                              II-46
      SEHO Systems Showcases SelectLine and LeanSelect Selective
       Soldering Systems                                                II-46
      Fero Launches Selective Soldering Machines of Interselect in
       New Zealand                                                      II-47
      ACE Production Technologies Showcases KISS-102IL Selective
       Soldering Machine                                                II-47
      Count On Tools Develops Selective Soldering Nozzles for
       Pillarhouse Equipment                                            II-47
      Soltec Introduces Two Novel Selective Soldering Platforms         II-47
      DDM Introduces Model IS-B 335S, Automatic Selective Soldering
       Machine                                                          II-47
      RPS Automation Showcases FRX10 Selective Soldering System         II-47
      RPS Introduces Complete Range of Selective Soldering Equipment    II-47
      RPS Releases Economy Line of Selective Soldering with FRX16       II-48
      Soltec Showcases 6746 Selective Soldering Machine and XPM3i
       Reflow Oven                                                      II-48

  7. RECENT INDUSTRY ACTIVITY                                           II-49
      Wistron Corporation Selects ACE Selective Soldering System in
       China                                                            II-49
      BAE Systems Completes Installation of second Selective
       Soldering System from ACE                                        II-49
      Celestica Completes Installation of KISS-103IL Selective
       Soldering System                                                 II-49
      Accelerated Assemblies Invests KISS-102IL Selective Soldering
       System                                                           II-49
      Diehl Controls Orders EBSO SPA 400 NC Selective Soldering Systems II-49
      Soltec Inks Partnership Deal with EMEA Electro Solutions          II-49
      ACE Production Technologies Inaugurates Demo Center in Mexico     II-50
      Seika Machinery Acquires Malcomtech International                 II-50
      ACE Inks Partnership Deal with Rochester Institute of Technology  II-50
      Vitronics Soltec Inks Distribution Agreement with Seica S.p.A.    II-50
      XetaWave Installs ACE’s Selective Soldering System                II-50
      Teledyne Printed Circuit Technology Selects Ersa for Selective
       Soldering                                                        II-50
      W&S Benelux Selects Inertec Selective Soldering Solutions         II-50
      eTech-WEB Selects Juki’s CUBE.460 Selective Soldering System      II-51
      Conelec Electronic Manufacturing Selects Ersa’s ECOSELECT 2       II-51
      HP Caribe BV and Ersa Ink Partnership Deal                        II-51
      RPS Partners with South-Tek Systems for Developing Nitrogen
       Generation System                                                II-51
      Soltec Inks Partnership Agreement with EPM                        II-51
      Vitronics Soltec Enters Into Partnership Agreement with SMT House II-51
      Gen3 Systems Bags a Contract from ZOT Engineering for Supply
       of KISS 103                                                      II-51
      Conelec Electronic Selects Ersa ECOSELECT 2™ Selective
       Soldering System                                                 II-52
      Electronic Technologies Purchases ACE’s KISS-103 Selective
       Solder Machine                                                   II-52
      S and Y Industries Install KISS-140 Selective Wave Soldering
       Machine                                                          II-52

  8. FOCUS ON SELECT PLAYERS                                            II-53
      ACE Production Technologies, Inc. (US)                            II-53
      DDM Novastar LLC (US)                                             II-53
      Ebso GmbH (Germany)                                               II-53
      EPM Handels AG (Switzerland)                                      II-54
      ERSA GmbH (Germany)                                               II-54
      FTM Technologies (France)                                         II-55
      INERTEC Löttechnologien GmbH (Germany)                            II-55
      Japan Unix Co. Ltd. (Japan)                                       II-55
      Juki Automation Systems, Inc. (US)                                II-55
      Pillarhouse USA, Inc. (US)                                        II-56
      RPS Automation, LLC (US)                                          II-56
      SEHO Systems GmbH (Germany)                                       II-56
      Shenzhen JT Automation Equipment Co., Ltd. (China)                II-57
      Tai'an Puhui Electric Technology Co., Ltd. (China)                II-57
      Tamura H.A. Machinery, Inc. (US)                                  II-57
      Vitronics Soltec BV (The Netherlands)                             II-58

  9. GLOBAL MARKET PERSPECTIVE                                          II-59
      Table 6: World Recent Past, Current & Future Analysis for
      Selective Soldering Equipment by Geographic Region - US,
      Canada, Japan, Europe, Asia-Pacific (excluding Japan), Latin
      America and Rest of World Markets Independently Analyzed with
      Annual Revenues in US$ Thousand for Years 2015 through 2022
      (includes corresponding Graph/Chart)                              II-59

      Table 7: World Historic Review for Selective Soldering
      Equipment by Geographic Region - US, Canada, Japan, Europe,
      Asia-Pacific (excluding Japan), Latin America and Rest of
      World Markets Independently Analyzed with Annual Revenues in
      US$ Thousand for Years 2009 through 2014 (includes
      corresponding Graph/Chart)                                        II-60

      Table 8: World 14-Year Perspective for Selective Soldering
      Equipment by Geographic Region - Percentage Breakdown of
      Annual Revenues for US, Canada, Japan, Europe, Asia-Pacific
      (excluding Japan), Latin America and Rest of World Markets for
      Years 2009, 2016 & 2022 (includes corresponding Graph/Chart)      II-61


 III. MARKET

  1. THE UNITED STATES                                                  III-1
      A.Market Analysis                                                 III-1
        Current and Future Analysis                                     III-1
        Growth Trends in Selective Soldering Market                     III-1
        Pricing Scenario                                                III-2
        Shift towards Modular Equipment                                 III-2
        R&D Efforts in Selective Soldering Market                       III-3
        Product Launches                                                III-3
        Strategic Corporate Developments                                III-5
        Key Players                                                     III-8
      B.Market Analytics                                                III-10
        Table 9: US Recent Past, Current & Future Analysis for
        Selective Soldering Equipment Market Analyzed with Annual
        Revenues in US$ Thousand for Years 2015 through 2022
        (includes corresponding Graph/Chart)                            III-10

        Table 10: US Historic Review for Selective Soldering
        Equipment Market Analyzed with Annual Revenues in US$
        Thousand for Years 2009 through 2014 (includes corresponding
        Graph/Chart)                                                    III-11

  2. CANADA                                                             III-12
       Market Analysis                                                  III-12
        Table 11: Canadian Recent Past, Current & Future Analysis
        for Selective Soldering Equipment Market Analyzed with
        Annual Revenues in US$ Thousand for Years 2015 through 2022
        (includes corresponding Graph/Chart)                            III-12

        Table 12: Canadian Historic Review for Selective Soldering
        Equipment Market Analyzed with Annual Revenues in US$
        Thousand for Years 2009 through 2014 (includes corresponding
        Graph/Chart)                                                    III-13

  3. JAPAN                                                              III-14
      A.Market Analysis                                                 III-14
        Current and Future Analysis                                     III-14
        Key Player                                                      III-14
      B.Market Analytics                                                III-15
        Table 13: Japanese Recent Past, Current & Future Analysis
        for Selective Soldering Equipment Market Analyzed with
        Annual Revenues in US$ Thousand for Years 2015 through 2022
        (includes corresponding Graph/Chart)                            III-15

        Table 14: Japanese Historic Review for Selective Soldering
        Equipment Market Analyzed with Annual Revenues in US$
        Thousand for Years 2009 through 2014 (includes corresponding
        Graph/Chart)                                                    III-16

  4. EUROPE                                                             III-17
      A.Market Analysis                                                 III-17
        Current and Future Analysis                                     III-17
        Revival in SMT Reflow Soldering Equipment Demand in Europe -
         A Case in Point                                                III-17
        Product Launches                                                III-17
        Strategic Corporate Developments                                III-18
        Key Players                                                     III-19
      B.Market Analytics                                                III-22
        Table 15: European Recent Past, Current & Future Analysis
        for Selective Soldering Equipment by Geographic Region -
        France, Germany, Italy, UK, Spain, Russia and Rest of Europe
        Markets Independently Analyzed with Annual Revenues in US$
        Thousand for Years 2015 through 2022 (includes corresponding
        Graph/Chart)                                                    III-22

        Table 16: European Historic Review for Selective Soldering
        Equipment by Geographic Region - France, Germany, Italy, UK,
        Spain, Russia and Rest of Europe Markets Independently
        Analyzed with Annual Revenues in US$ Thousand for Years 2009
        through 2014 (includes corresponding Graph/Chart)               III-23

        Table 17: European 14-Year Perspective for Selective
        Soldering Equipment by Geographic Region - Percentage
        Breakdown of Annual Revenues for France, Germany, Italy, UK,
        Spain, Russia and Rest of Europe Markets for Years 2009,
        2016 & 2022 (includes corresponding Graph/Chart)                III-24

  5. ASIA-PACIFIC                                                       III-25
      A.Market Analysis                                                 III-25
        Current & Future Analysis                                       III-25
        Soaring Growth Opportunities                                    III-25
        Snapshot of Electronics Industry in Asia-Pacific                III-25
        Well Established ECMS Industry Drives Demand for Selective
         Soldering Equipment                                            III-25
        Price-based Competition                                         III-26
        Product Launch                                                  III-26
        Key Players                                                     III-26
      B.Market Analytics                                                III-28
        Table 18: Asia-Pacific Recent Past, Current & Future
        Analysis for Selective Soldering Equipment by Geographic
        Region - China, South Korea, Taiwan and Rest of Asia-Pacific
        Markets Independently Analyzed with Annual Revenues in US$
        Thousand for Years 2015 through 2022 (includes corresponding
        Graph/Chart)                                                    III-28

        Table 19: Asia-Pacific Historic Review for Selective
        Soldering Equipment by Geographic Region - China, South
        Korea, Taiwan and Rest of Asia-Pacific Markets Independently
        Analyzed with Annual Revenues in US$ Thousand for Years 2009
        through 2014 (includes corresponding Graph/Chart)               III-29

        Table 20: Asia-Pacific 14-Year Perspective for Selective
        Soldering Equipment by Geographic Region - Percentage
        Breakdown of Annual Revenues for China, South Korea, Taiwan
        and Rest of Asia-Pacific Markets for Years 2009, 2016 & 2022
        (includes corresponding Graph/Chart)                            III-30

  6. LATIN AMERICA                                                      III-31
       Market Analysis                                                  III-31
        Table 21: Latin American Recent Past, Current & Future
        Analysis for Selective Soldering Equipment Market Analyzed
        with Annual Revenues in US$ Thousand for Years 2015 through
        2022 (includes corresponding Graph/Chart)                       III-31

        Table 22: Latin American Historic Review for Selective
        Soldering Equipment Market Analyzed with Annual Revenues in
        US$ Thousand for Years 2009 through 2014 (includes
        corresponding Graph/Chart)                                      III-32

  7. REST OF WORLD                                                      III-33
       Market Analysis                                                  III-33
        Table 23: Rest of World Recent Past, Current & Future
        Analysis for Selective Soldering Equipment Market Analyzed
        with Annual Revenues in US$ Thousand for Years 2015 through
        2022 (includes corresponding Graph/Chart)                       III-33

        Table 24: Rest of World Historic Review for Selective
        Soldering Equipment Market Analyzed with Annual Revenues in
        US$ Thousand for Years 2009 through 2014 (includes
        corresponding Graph/Chart)                                      III-34


 IV. COMPETITIVE LANDSCAPE

     Total Companies Profiled: 42 (including Divisions/Subsidiaries - 47)

     The United States (12)
     Canada (1)
     Japan (6)
     Europe (19)
     - France (1)
     - Germany (8)
     - The United Kingdom (1)
     - Italy (2)
     - Rest of Europe (7)
     Asia-Pacific (Excluding Japan) (9)
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