Selective Soldering Markets

Selective Soldering - Global Strategic Business Report

Global Industry Analysts, Date of Publication: Feb 16, 2018, 174 Pages
US$4,500.00
GIA-MCP6564

This report analyzes the worldwide markets for Selective Soldering in US$ Thousand. The report provides separate comprehensive analytics for the US, Japan, Europe, China, South Korea, Taiwan, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.  Also, a five-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 42 companies including many key and niche players such as -

ACE Production Technologies, Inc.
DDM Novastar LLC
Ebso GmbH
epm Handels AG
ERSA GmbH
Hentec Industries, Inc.

Selective Soldering - Global Strategic Business Report
TABLE OF CONTENTS

 I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

      Study Reliability and Reporting Limitations                       I-1
      Disclaimers                                                       I-2
      Data Interpretation & Reporting Level                             I-2
       Quantitative Techniques & Analytics                              I-3
      Product Definitions and Scope of Study                            I-3


 II. EXECUTIVE SUMMARY

  1. INDUSTRY OVERVIEW                                                  II-1
      A Prelude                                                         II-1
      Selective Soldering - An Overview                                 II-2
      Selective Soldering Machines and Equipment - Key Features and
       Uses                                                             II-2
       Wave Height Monitoring                                           II-2
       Top-side Preheating                                              II-2
       Inert Atmosphere Control and Solder Delivery                     II-2
       Nitrogen Peel-off Jet                                            II-3
       Dual Head Fluxers                                                II-3
       Swappable Solder Pots                                            II-3
       Larger Nozzles                                                   II-4
      Growth of SMT Equipment and Flexible PCBs Form Strong Base for
       SSE Demand                                                       II-4
       Opportunity Indicators                                           II-6
        Table 1: Global Electronics Systems Market by End-Use
        Industry (2016): Percentage Breakdown of Sales for
        Communication Devices, Computers & Peripherals, Consumer
        Electronic Devices, Automotive Electronics, Industrial
        Electronics, and Aerospace/Defense Electronics (includes
        corresponding Graph/Chart)                                      II-6

        Table 2: World Market for PCBs (2016): Percentage Share
        Breakdown of Key End-Use Application Markets (includes
        corresponding Graph/Chart)                                      II-6
      Growth of Flexible Printed Circuit Boards - A Business Case
       for SSE                                                          II-6
      Selective Soldering Still Enjoys Growth despite Shift from TH
       to SMT Component                                                 II-8
      Laser Soldering - An Important Selective Soldering Process        II-8
       Types of Selective Soldering Processes and Their Features        II-9
      Market Outlook                                                    II-9
       Established ECMS Industry Drives Demand for SSE in Asia-Pacific  II-10
      Competition - A Brief Note                                        II-10
       Price-based Competition                                          II-10

  2. GROWTH DRIVERS, MARKET TRENDS AND ISSUES                           II-11
      Trend-Setting Technologies                                        II-11
      Intensifying R&D to Foster Growth                                 II-11
      Lead-Free Solder Emboldens Growth Opportunities                   II-12
      Small but Persistent Demand for Through-Hole Components Drives
       Growth                                                           II-12
      Automation - A Buzz Word in Selective Soldering Market            II-12
       Automated Selective Soldering of SMT Components                  II-13
       Automated Selective Soldering Need of the Hour for Soldering
        PCBs with Double-Sided SMT Content                              II-13
      Innovations Drive Selective Soldering Market Growth               II-14
       Selective Aperture Tooling over Wave Solder                      II-14
       Mass Selective Dip Solder Foundation                             II-14
       Miniature Wave Selective Solder Fountains                        II-14
       Laser Selective Soldering System                                 II-14
       Selective Flux Applicators                                       II-15
      Advantages of Miniature Wave Selective Soldering over Wave
       Soldering                                                        II-15
      No-Clean Flux Encourages Efficiency in Selective Soldering        II-16
      Cost and Quality Issues Drive Industry towards Selective
       Soldering                                                        II-16
      Shrinking Component Size Paints Brighter Prospects                II-16
      Next Generation Electronics: A Tantalizing Opportunity for
       Selective Soldering                                              II-16
      Challenges Associated with Use of SSE                             II-17

  3. OVERVIEW OF SELECT END-USE INDUSTRIES                              II-18
      From OEMs to CEMs and EMS Providers: Changing Customer Profile    II-18
       Important End Uses of Surface Mount Technology                   II-18
      Developments in Automotive Electronics Drives Opportunities
       for SSE                                                          II-18
       Table 3: Automotive Electronics as a Percentage of Vehicle
       Production Cost for Years 2010, 2020 & 2030 (includes
       corresponding Graph/Chart)                                       II-19

       Table 4: Increasing Electronic Content in Automobiles as a
       Percentage of Vehicle Value for Years 1975 & 2014 (includes
       corresponding Graph/Chart)                                       II-20

       Table 5: Breakdown of the Global Automotive Electronics
       Market (In US$ Billion) by Application for the Year 2020
       (includes corresponding Graph/Chart)                             II-20
       Enabling the Electronic Marvel                                   II-21
      Telecommunications Drive Demand for SMT and SSE                   II-21
      Healthcare Segment Reinforcing Growth in Selective Soldering
       Equipment Industry                                               II-21
      Selective Soldering Machines in Medical EMS                       II-21
      Proliferation of Consumer Electronic Devices Drives Demand for
       Selective Soldering                                              II-22
      Contract Manufacturers: A Key Customer Market for Selective
       Soldering Equipment                                              II-23
      Advent of Laser Soldering in Various Industries                   II-24
       Industrial Applications                                          II-24
        Laser Selective Soldering in Electronics Manufacturing          II-24
         Issues and Challenges                                          II-25
       Electronics Manufacturing                                        II-26
       Automobile Applications                                          II-26
        Advantages of Laser Selective Soldering in Automotive
         Manufacturing                                                  II-26
       Medical Applications                                             II-27
       Laser Soldering Optoelectronics                                  II-27

  4. TECHNOLOGY INNOVATIONS                                             II-28
      Versaflex from Ersa - A New Twin-Pot Soldering Module for Low
       Level Soldering and Reduced Cycle Times                          II-28
      Jade MK IV from Pillarhouse                                       II-28
      Tamura Brand HC26 38F Model Selective Soldering System            II-29
      ACE Elite Series                                                  II-29
      DDM Novastar ESS Selective Soldering Machines                     II-29
      Ersa Versaflow 4/55 Selective Soldering Machine                   II-29
      Solder Nozzles Cleaning - Innovative Patented Ultrasonic
       Technology                                                       II-29
      Development of Direct Diode Lasers                                II-30
      Additions in i-Pulse Machines                                     II-30
      Development of the InnoLot Lead-Free Alloy for Automotive
       Electronics                                                      II-31
      Development of Preheated Solder Joints for Power Electronics      II-31
      Solder Masks                                                      II-33
      Soldering of Image Sensors to PCBs                                II-33
       Electrostatic Damage                                             II-34
       Board Assembly                                                   II-34
       Manual Soldering of Leaded or Pinned Devices                     II-34
       Reflow-Soldering                                                 II-34
       Lead-Free Soldering                                              II-34

  5. PRODUCT OVERVIEW                                                   II-35
      Selective Soldering - An Introduction                             II-35
      Evolution of Automated Soldering                                  II-35
      Automated Selective Soldering                                     II-36
       Selective Wave Soldering                                         II-36
       Selective Fountain Soldering                                     II-36
       Programmable Selective Soldering                                 II-37
       Selective Miniwave Soldering                                     II-37
       Selective Laser Soldering                                        II-37
        Advantages of Laser Soldering                                   II-38
        Limitations of Laser Soldering                                  II-38
        Classification of Laser Soldering Processes                     II-38
         Single Spot Soldering Process                                  II-38
         Simultaneous Soldering                                         II-38
         Mask Soldering                                                 II-38
       Round-table Selective Soldering                                  II-39
      Automatic Soldering Techniques                                    II-39
       Reflow Soldering                                                 II-39
       Wave Soldering                                                   II-40
        Circuit-board Loading Station                                   II-41
        Fluxing Station                                                 II-41
        Pre-heating Station                                             II-41
        Soldering Station                                               II-42
         Classification of Solder Joints                                II-42
          Good Solder Joint                                             II-42
          Poor Solder Fillet                                            II-42
          Shorts                                                        II-42
      Solder Paste Application/Paste Printing - The Blue Print          II-43
       Important Considerations for Good Quality Printing               II-43
       Why Use Solder Paste?                                            II-43
       Which Type of Solder Paste to be Used?                           II-44
        A Comparative Evaluation of Solder Paste Types - Rosin
         Mildly Activated, Water Soluble Organic Acid and No-Clean      II-44
       Prerequisites of an Ideal Solder Paste                           II-44
       Regulations on the Usage of Solder Pastes                        II-44
       Other Soldering Techniques                                       II-45
        Advantages of Using Selective Soldering Processes               II-45
        Encountering Selective Soldering Problems                       II-45
         Stringing/Webbing                                              II-46
         Fillet Tearing                                                 II-46
         Copper Dissolution                                             II-46
        Key Process Issues for Lead-free Selective Soldering            II-46
         Wave Height Monitoring                                         II-46
         Top Side Preheating                                            II-47
         Solder Delivery and Inert Atmosphere Control                   II-47
         Nitrogen Peel-off Jet                                          II-47
         Dual Head Fluxers                                              II-47
         Swappable Solder Pots for Lead-free Soldering                  II-48
         Larger Nozzles                                                 II-48
        Factors Affecting Investment in Selective Soldering Equipment   II-48
       Stamp Soldering                                                  II-48
        Benefits of Stamp Soldering                                     II-49
        Diode Lasers - Creating Opportunity through “FlashSoldering”    II-49
       Hot Bar                                                          II-49
       Common Soldering Iron                                            II-49
       Micro-flame                                                      II-50
      Road Ahead for FlashSoldering                                     II-50

  6. PRODUCT INTRODUCTIONS/INNOVATIONS                                  II-51
      Hentec Launches Vector Series of Soldering Machines               II-51
      Alpha Unveils ALPHA® EF-2100                                      II-51
      ACE Introduces Elite Series In-line Selective Soldering Systems   II-51
      Kester Introduces SELECT-10™ Selective Solder Flux                II-51
      ACE to Showcase KISS-103IL, a Novel Selective Soldering
       Technology at SMT                                                II-51
      Vitronics Soltec to Launch New ZEVAm Selective Soldering Platform II-52
      Seho North America Introduces GoSelective-LS Selective
       Soldering Machine                                                II-52
      Manncorp Releases IS-T-300, an All-in-One Selective Fluxing
       and Soldering System                                             II-52
      Kurtz Ersa Showcases Complete Range of Ersa’s Selective
       Soldering Equipment                                              II-52
      SEHO Systems Showcases SelectLine and LeanSelect Selective
       Soldering Systems                                                II-52

  7. RECENT INDUSTRY ACTIVITY                                           II-53
      RH Technologies Chooses SELECT Integra™ 508.5 Selective
       Soldering Equipment                                              II-53
      Nordson SELECT Appoints smartTec GmbH as Eastern European
       Distributor                                                      II-53
      Nordson SELECT Appoints Gen3 as Distributor for the UK and
       Ireland                                                          II-53
      PQ4 USA Installs ACE Selective Soldering System                   II-53
      Nordson Corporation Takes Over InterSelect GmbH                   II-53
      Ersa GmbH and EasyLogix Enter into Collaboration                  II-53
      Nordson Corporation Takes Over ACE Production Technologies        II-54
      Kimchuk Installs KISS- 103 Selective Soldering Machine            II-54
      ITW Establishes EAE Division by Integrating Three Businesses      II-54
      Creation Technologies Installs KISS-102IL In-Line Selective
       Soldering Systems                                                II-54
      Jet Propulsion Laboratory Installs Third KISS-103 Machine from
       ACE                                                              II-54
      HANDERA Installs Second KISS-102 System                           II-54
      Wistron Corporation Selects ACE Selective Soldering System in
       China                                                            II-54
      BAE Systems Completes Installation of second Selective
       Soldering System from ACE                                        II-54
      Celestica Completes Installation of KISS-103IL Selective
       Soldering System                                                 II-55
      Accelerated Assemblies Invests KISS-102IL Selective Soldering
       System                                                           II-55
      Diehl Controls Orders EBSO SPA 400 NC Selective Soldering Systems II-55
      Soltec Inks Partnership Deal with EMEA Electro Solutions          II-55
      ACE Production Technologies Inaugurates Demo Center in Mexico     II-55
      Seika Machinery Acquires Malcomtech International                 II-55

  8. FOCUS ON SELECT PLAYERS                                            II-56
      ACE Production Technologies (USA)                                 II-56
      DDM Novastar LLC (USA)                                            II-56
      Ebso GmbH (Germany)                                               II-56
      epm Handels AG (Switzerland)                                      II-57
      ERSA GmbH (Germany)                                               II-57
      Hentec Industries, Inc. (USA)                                     II-57
      INERTEC Löttechnologien GmbH (Germany)                            II-58
      ITW EAE (USA)                                                     II-58
      Japan Unix Co. Ltd. (Japan)                                       II-58
      Juki Corporation (Japan)                                          II-59
       Juki Automation Systems, Inc. (USA)                              II-59
      Pillarhouse USA, Inc. (USA)                                       II-59
      SEHO Systems GmbH (Germany)                                       II-59
      Shenzhen JT Automation Equipment Co., Ltd. (China)                II-60
      Tai'an Puhui Electric Technology Co., Ltd. (China)                II-60
      Tamura H.A. Machinery, Inc. (USA)                                 II-60

  9. GLOBAL MARKET PERSPECTIVE                                          II-61
      Table 6: World Recent Past, Current & Future Analysis for
      Selective Soldering Equipment by Geographic Region - US,
      Japan, Europe, China, South Korea, Taiwan, and Rest of World
      Markets Independently Analyzed with Annual Revenues in US$
      Thousand for Years 2016 through 2024 (includes corresponding
      Graph/Chart)                                                      II-61

      Table 7: World Historic Review for Selective Soldering
      Equipment by Geographic Region - US, Japan, Europe, China,
      South Korea, Taiwan, and Rest of World Markets Independently
      Analyzed with Annual Revenues in US$ Thousand for Years 2011
      through 2015 (includes corresponding Graph/Chart)                 II-62

      Table 8: World 14-Year Perspective for Selective Soldering
      Equipment by Geographic Region - Percentage Breakdown of
      Annual Revenues for US, Japan, Europe, China, South Korea,
      Taiwan, and Rest of World Markets for Years 2011, 2017 & 2024
      (includes corresponding Graph/Chart)                              II-63


 III. MARKET

  1. THE UNITED STATES                                                  III-1
      A.Market Analysis                                                 III-1
        Current and Future Analysis                                     III-1
        Recovery in Electronics Manufacturing & Subsequent Rise in
         Demand for PCB Assemblies to Drive Selective Soldering
          Market                                                        III-1
        Growth Trends in Selective Soldering Market                     III-1
        Pricing Scenario                                                III-2
        Shift towards Modular Equipment                                 III-2
        R&D Efforts in Selective Soldering Market                       III-3
        Product Launches                                                III-3
        Strategic Corporate Developments                                III-5
        Select Players                                                  III-7
      B.Market Analytics                                                III-10
        Table 9: US Recent Past, Current & Future Analysis for
        Selective Soldering Equipment Market Analyzed with Annual
        Revenues in US$ Thousand for Years 2016 through 2024
        (includes corresponding Graph/Chart)                            III-10

        Table 10: US Historic Review for Selective Soldering
        Equipment Market Analyzed with Annual Revenues in US$
        Thousand for Years 2011 through 2015 (includes corresponding
        Graph/Chart)                                                    III-11

  2. JAPAN                                                              III-12
      A.Market Analysis                                                 III-12
        Current and Future Analysis                                     III-12
        Japan Unix Co. Ltd. - A Key Player                              III-12
      B.Market Analytics                                                III-13
        Table 11: Japanese Recent Past, Current & Future Analysis
        for Selective Soldering Equipment Market Analyzed with
        Annual Revenues in US$ Thousand for Years 2016 through 2024
        (includes corresponding Graph/Chart)                            III-13

        Table 12: Japanese Historic Review for Selective Soldering
        Equipment Market Analyzed with Annual Revenues in US$
        Thousand for Years 2011 through 2015 (includes corresponding
        Graph/Chart)                                                    III-14

  3. EUROPE                                                             III-15
      A.Market Analysis                                                 III-15
        Current and Future Analysis                                     III-15
        Revival in SMT Reflow Soldering Equipment Demand in Europe -
         A Case in Point                                                III-15
        Product Launches                                                III-15
        Strategic Corporate Developments                                III-16
        Select Players                                                  III-16
      B.Market Analytics                                                III-19
        Table 13: European Recent Past, Current & Future Analysis
        for Selective Soldering Equipment Market Analyzed with
        Annual Revenues in US$ Thousand for Years 2016 through 2024
        (includes corresponding Graph/Chart)                            III-19

        Table 14: European Historic Review for Selective Soldering
        Equipment Market Analyzed with Annual Revenues in US$
        Thousand for Years 2011 through 2015 (includes corresponding
        Graph/Chart)                                                    III-20

  4. CHINA                                                              III-21
      A.Market Analysis                                                 III-21
        Current and Future Analysis                                     III-21
        Soaring Growth Opportunities                                    III-21
        Snapshot of Electronics Industry                                III-21
        Price-based Competition                                         III-21
        Overview of SMT Market                                          III-21
        PCB Industry in China                                           III-22
        Product Launch                                                  III-22
        Select Players                                                  III-23
      B.Market Analytics                                                III-24
        Table 15: Chinese Recent Past, Current & Future Analysis for
        Selective Soldering Equipment Market Analyzed with Annual
        Revenues in US$ Thousand for Years 2016 through 2024
        (includes corresponding Graph/Chart)                            III-24

        Table 16: Chinese Historic Review for Selective Soldering
        Equipment Market Analyzed with Annual Revenues in US$
        Thousand for Years 2011 through 2015 (includes corresponding
        Graph/Chart)                                                    III-25

  5. SOUTH KOREA                                                        III-26
      A.Market Analysis                                                 III-26
        Current and Future Analysis                                     III-26
        South Korea - A Major Electronics Hub                           III-26
      B.Market Analytics                                                III-26
        Table 17: South Korean Recent Past, Current & Future
        Analysis for Selective Soldering Equipment Market Analyzed
        with Annual Revenues in US$ Thousand for Years 2016 through
        2024 (includes corresponding Graph/Chart)                       III-26

        Table 18: South Korean Historic Review for Selective
        Soldering Equipment Market Analyzed with Annual Revenues in
        US$ Thousand for Years 2011 through 2015 (includes
        corresponding Graph/Chart)                                      III-27

  6. TAIWAN                                                             III-28
      A.Market Analysis                                                 III-28
        Current and Future Analysis                                     III-28
        Taiwan - Global Semiconductor Leader                            III-28
      B.Market Analytics                                                III-28
        Table 19: Taiwanese Recent Past, Current & Future Analysis
        for Selective Soldering Equipment Market Analyzed with
        Annual Revenues in US$ Thousand for Years 2016 through 2024
        (includes corresponding Graph/Chart)                            III-28

        Table 20: Taiwanese Historic Review for Selective Soldering
        Equipment Market Analyzed with Annual Revenues in US$
        Thousand for Years 2011 through 2015 (includes corresponding
        Graph/Chart)                                                    III-29

  7. REST OF WORLD                                                      III-30
      A.Market Analysis                                                 III-30
        Current and Future Analysis                                     III-30
        Strategic Corporate Development                                 III-30
      B.Market Analytics                                                III-31
        Table 21: Rest of World Recent Past, Current & Future
        Analysis for Selective Soldering Equipment Market Analyzed
        with Annual Revenues in US$ Thousand for Years 2016 through
        2024 (includes corresponding Graph/Chart)                       III-31

        Table 22: Rest of World Historic Review for Selective
        Soldering Equipment Market Analyzed with Annual Revenues in
        US$ Thousand for Years 2011 through 2015 (includes
        corresponding Graph/Chart)                                      III-32


 IV. COMPETITIVE LANDSCAPE

     Total Companies Profiled: 42 (including Divisions/Subsidiaries - 52)

     The United States (17)
     Canada (1)
     Japan (8)
     Europe (17)
     - France (1)
     - Germany (8)
     - The United Kingdom (1)
     - Italy (2)
     - Rest of Europe (5)
     Asia-Pacific (Excluding Japan) (9)
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Date of Publication:
Feb 16, 2018
File Format:
PDF via E-mail
Number of Pages:
174 Pages