Semiconductor Factory Automation: Technology Issues and Market Forecasts

Semiconductor Factory Automation: Technology Issues and Market Forecasts

Information Network, Date of Publication: Jun 29, 2020, 224 Pages

Clean processing has driven the proliferation of wafer-handling automation within process tools. Wafer-handling robot arms in vacuum and atmospheric tools are standard today. Meanwhile, Moore’s Law played the primary role in wafer size increases and the automation that is present outside of the process tools.

This report addresses these technical issues, presenting an analysis of the semiconductor factory automation industry, the key players, and the driving forces directing semiconductor factory automation. 

Markets are segmented as:

  • Automated transfer tools (robots, elevators, platforms, etc.)
  • Carrier transport (monorail, AGV, AS/RS, etc.)
  • Manufacturing execution systems (MES) software

With the move to 450mm wafers — changes in wafer size, weight, fragility, risk of damage or creation of damaging particles — existing wafer handling robots and the drives, motors, linear components and controls that automate these wafer handling tools will need a new generation of components to satisfy the requirements of 450mm wafer handling. The vacuum and atmospheric robotic market is forecast and market shares of vendors presented.

Semiconductor Factory Automation: Technology Issues and Market Forecasts

Chapter 1 Introduction

Chapter 2 Executive Summary

2.1 Summary of Major Issues
2.2 Summary of Market Forecasts

Chapter 3 Driving Forces

3.1 Introduction
3.2 Trend to 300/450mm Wafers
3.3 Development Costs
3.4 Single-Wafer Processing
3.5 Trends in Processing Tools
3.6 Automation Trends
3.7 Benefits of Automated Wafer Handling

Chapter 4 Software

4.1 Introduction
4.2 The Evolution of CIM
4.3 MES in Industry
4.3.1 MES Functionalities
4.3.2 MES Products
4.4 Communication Standards
4.5 Sematech CIM Framework

Chapter 5 Hardware

5.1 Introduction
5.2 Elements of Automation
5.2.1 Tool Automation
5.2.2 Intrabay Automation
5.2.3 Interbay Automation
5.2.4 Material-Control System
5.3 Flexible Automation
5.4 Reliability
5.5 Tool Issues and Trends
5.5.1 Flexible Tool Interface
5.5.2 Vacuum Robotics
5.5.3 AGV
5.5.4 Robot Control Systems
5.5.5 300-mm Wafer Transport
5.5.6 Mini-Environments and Cleanroom Issues
5.6 E-Manufacturing

Chapter 6 Market Analysis

6.1 Market Forces
6.2 Market Forecast Assumptions
6.3 Market Forecast
6.3.1 Automated Transfer Tool Market
6.3.2 Carrier Transport Market
6.3.3 MES Software Market

Chapter 7 User Issues

7.1 Current Automation Thinking
7.2 The New Factory Paradigm
7.3 The New Factory in Action
7.4 Return on Investment Considerations
7.5 Eight Symptoms of the Old Paradigm
7.6 Putting the New Paradigm to Work

List of Figures

1.1 Advanced CIM System
3.1 Automated Materials Handling System (AMHS) Framework
4.1 Evolution of CIM
4.2 Computer Integrated Fab Environment
4.3 Message Integration in CIM
4.4 Sematech CIM Framework Scope
5.1 Material-Control System
5.2 Traditional and Flexible Automated Material Handling System
5.3 Overhead Monorail Delivery - Cassette in Box, Cassette in SMIF Pod
5.4 Stocker Design and Interfaces
5.5 Layout Of a 45nm 300mm Fab
5.6 Interfaces To Factory Automation Systems
6.1 Semiconductor Equipment Utilization
6.2 Revenue Losses from Wafer Defects
6.3 Market Shares of Atmospheric Robot Suppliers
6.4 Market Shares of Vacuum Robot Suppliers
6.6 Worldwide Market Shares of Carrier Transport Suppliers
6.7 Worldwide Market of Shares MES Software Suppliers

List of Tables

5.1 Evolution Of Factory Metrics
6.1 Three-Year Savings for Automation
6.2 Cost of Alternative Automated Systems
6.3 Three-year Costs for Alternative Automated Systems
6.4 Worldwide Forecast of Automated Transfer Tools
6.5 Bill Of Materials For Atmospheric Automation Tool
6.6 Bill Of Materials For PVD Vacuum Tool
6.7 Process Tool Automation For 300mm Fabs
6.8 Worldwide Forecast of Carrier Transport Market
6.9 300mm Fab Construction Plans
6.10 Worldwide Forecast of MES Software

Date of Publication:
Jun 29, 2020
File Format:
PDF via E-mail
Number of Pages:
224 Pages