Semiconductor Manufacturing

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Global Market for Mixed-signal System-on-Chip Applications with a Focus on Node Geometries
Global Market for Mixed-signal System-on-Chip Applications with a Focus on Node Geometries
US$3,950.00
Date of Publication: Feb 7, 2020
The global mixed-signal system-on-chip (SoC) market is showing significant growth with a compound annual growth rate (CAGR) of 8.5% during the forecast period; regional markets, however, are showing variable trends. In North America and Europe, the market is experiencing slow performance due to maturity and saturation. Product and application awareness is the primary reason for declining demand in these two regions.
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2019 Semiconductor Manufacturing Research Review
2019 Semiconductor Manufacturing Research Review
US$2,500.00
Date of Publication: Feb 7, 2020
Semiconductors sales have grown in various industries, especially consumer electronics, automotive, industrial automation, healthcare diagnostics, aerospace and defence. Artificial Intelligence (AI) is one of the fastest growing segments for semiconductor industry, as the global spending for AI was over $35 billion by the end of 2018 and is expected to grow at ~24% over the next five years.
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Global Semiconductor Silicon Wafer Market
Global Semiconductor Silicon Wafer Market
US$2,750.00
Date of Publication: Nov 20, 2019
This report forecasts the market for compound semiconductor wafers for 2018-2023. The report presents the market forecast in terms of dollar value ($ million) and shipment volume (msi).
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Thin-layer Deposition: CVD, Ion Implantation and Epitaxy
Thin-layer Deposition: CVD, Ion Implantation and Epitaxy
US$5,550.00
Date of Publication: Aug 20, 2019
The global market for thin-layer deposition technologies should grow from $32.1 billion in 2017 to $60.7 billion by 2022 at a compound annual growth rate (CAGR) of 13.6% for the period of 2017-2022.
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Semiconductor Machinery Manufacturing: Global Markets to 2023
Semiconductor Machinery Manufacturing: Global Markets to 2023
US$5,500.00
Date of Publication: Nov 6, 2018
This research report categorizes the semiconductor machinery manufacturing by type. Product types include wafer processing equipment, assembly, packaging equipment, and other front-end equipment. The global market for semiconductor machinery manufacturing should grow from $57.8 billion in 2018 to $114.4 billion by 2023, with a compound annual growth rate (CAGR) of 14.6% from 2018 to 2023.
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Electronic Thermal Management - Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets
Thermal Management Technologies for Semiconductor Microchips
US$5,500.00
Date of Publication: Aug 18, 2017
This report addresses the global market for thermal management products for microchips during the forecast period through 2022. The global market for thermal management products should reach $6.3 billion by 2022 from $4.7 billion in 2017 at a compound annual growth rate (CAGR) of 6.0%, from 2017 to 2022.
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Sputtering Targets and Sputtered Films: Technology and Markets
Sputtering Targets and Sputtered Films: Technology and Markets
US$5,550.00
Date of Publication: Mar 13, 2017
The global market for sputtered films and sputtering targets should reach over $3.2 billion by 2021 from nearly $2.9 billion in 2016 at a compound annual growth rate (CAGR) of 2.2%, from 2016 to 2021. Details of the global market analysis are covered. For each major application group or industry sector (specifically electronics, optoelectronics, mechanical/chemical, energy, optical coatings and life sciences and others), this research provides information on production of sputtered films, consumption of sputtering targets and target revenues by material and region.
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New Electronic Materials and Device Technologies: Global Markets
New Electronic Materials and Device Technologies: Global Markets
US$5,550.00
Date of Publication: Jan 23, 2017
The report addresses the global market for new electronic materials during the period from 2016 through 2026. The report quantifies new electronic materials produced for use in the production of electronic materials (transistors, semiconductors, displays, etc). The global market for advanced electronic materials totaled nearly $4.9 billion in 2016. This market should total $10.3 billion in 2021 and $24.1 billion by 2026 at a five-year compound annual growth rate (CAGR) of 18.5%, for the period of 2021-2026.
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Atomic Layer Deposition and other Ultrathin-Film Fabrication Processes
Atomic Layer Deposition and other Ultrathin-Film Fabrication Processes
US$5,550.00
Date of Publication: Nov 23, 2016
The global market for atomic layer deposition and other ultrathin film fabrication processes was valued at $1.1 billion and $1.3 billion in 2014 and 2015, respectively. This market is expected to increase from $1.5 billion in 2016 to nearly $3.7 billion in 2021 at a compound annual growth rate (CAGR) of 19.1% for 2016-2021
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Thermal Management Technoligies
The Market for Thermal Management Technologies
US$5,550.00
Date of Publication: Mar 16, 2016

The global market for thermal management products will grow from about $10.7 billion in 2015 to nearly $11.2 billion in 2016 and $14.7 billion by 2021, representing a compound annual growth rate (CAGR) of 5.6% between 2016 and 2021. The scope of this report is broad, covering several product areas. The individual materials, hardware, and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected through 2021. The application sections feature forecasts for the most important applications by product.

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Global Markets, Technologies and Materials for Thin and Ultrathin Films
Global Markets, Technologies and Materials for Thin and Ultrathin Films
US$5,550.00
Date of Publication: Sep 28, 2016
The global market for thin film materials reached nearly $9.9 billion and $9.8 billion in 2014 and 2015, respectively. The market is expected to reach nearly $11.3 billion by 2021 increasing at a compound annual growth rate (CAGR) of 3.0% from 2016 to 2021. This report provides an updated review of thin film technologies, including materials and production processes, and identifies current and emerging applications for these technologies. 
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Flip-Chip Technologies and Global Markets
Flip-Chip Technologies and Global Markets
US$5,550.00
Date of Publication: Jul 20, 2016
This report provides: An overview of the global markets for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads; Analyses of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021. The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.
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Semiconductor Metallization and Interconnects: Technologies and Global Markets
Semiconductor Metallization and Interconnects: Technologies and Global Markets
US$5,550.00
Date of Publication: Jun 20, 2016
This report provides an overview of the global markets for semiconductor metallization, a process which produces a thin-film metal layer that will serve as the required conductor pattern for the interconnection of the various components on the chip. The global semiconductor metallization and interconnects market totaled $912.8 million and $1.0 billion in 2014 and 2015 respectively. The market should total nearly $1.8 billion by 2020, growing at a compound annual growth rate (CAGR) of 11.4% from 2015 to 2020.
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Graphene: Technologies, Applications, and Markets
Graphene: Technologies, Applications and Markets
US$2,750.00
Date of Publication: Feb 10, 2016

Potential electronics applications of graphene include ultrasmall transistors, superdense data storage, touchscreens and wearable electronics. In the energy field, potential applications include ultracapacitors to store and transmit electrical power as well as highly efficient solar cells. Some researchers argue that the greatest potential for graphene lay in its ability to conduct light as well as electricity. They believe that graphene can improve the efficiency of light-emitting diodes (LEDs) and aid in the production of next-generation devices like flexible touchscreens, photodetectors and ultrafast lasers.

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Electronic Chemicals and Materials: The Global Market
Electronic Chemicals and Materials: The Global Market
US$5,550.00
Date of Publication: Jan 12, 2016

This report provides an overview of the global markets for electronic chemicals and materials, covering the entire range of chemicals and materials that are used in the fabrication of ICs and PCBs. The global electronic chemicals and materials market was nearly $22.0 billion in 2014. The market is projected to grow at a compound annual growth rate (CAGR) of 5.9% from $22.9 billion in 2015 to $30.5 billion by 2020.

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Wafer-Level Packaging: WLP Technologies and Global Markets
Wafer-Level Packaging: Technologies and Global Markets
US$5,550.00
Date of Publication: Sep 23, 2015
Global markets and technologies for wafer-level packaging. The report provides analyses of global market trends, with data from 2013, 2014, and projections of CAGRs through 2019. Coverage of technologies including: Flip-Chip, 3-D WLP, Conventional CSP, Wafer Level CSP, Compliant WLP, Nano WLP, and others. Information on integration techniques including Fan-out WLP, Fan-in WLP, TSV, IPD.


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Thermal Interface Materials: Technologies, Applications and Global Markets
Thermal Interface Materials: Technologies, Applications and Global Markets
US$5,550.00
Date of Publication: Jul 24, 2015

This report provides: An overview of the global market for thermal interface materials, which have experienced growing demand with the increased need for thermal management technologies. Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020. Identification of thermal interface materials (TIM) technologies and products with the greatest commercial potential in the near to mid-term, and of companies that are best positioned to meet this demand because of proprietary technologies, strategic alliances, or other advantages.  The global market for thermal interface materials reached $715.9 million in 2014. This market is forecasted to grow at a compound annual growth rate (CAGR) of 7.4% to reach nearly $1.1 billion in 2020.

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Physical Vapor Deposition (PVD): Global Markets
Physical Vapor Deposition (PVD): Global Markets
US$5,550.00
Date of Publication: Sep 22, 2014
This study encompasses PVD technologies and materials in terms of application, properties and processes. This research analyzes the major types of PVD...
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System-in-Package (SiP) Die Technologies and Global Markets
System-in-Package (SiP) Die Technologies and Global Markets
US$5,550.00
Date of Publication: Feb 26, 2014
System-in-package (SiP) is a combination of integrated circuits (ICs) enclosed in a single package or module. Additionally, passive components are mounted on the same substrate. SiP is not just an IC package with multiple dies; it comprises fully functional systems or subsystems in an IC package format. SiP, while being a packaging technique, differs substantially from other packaging technologies. The latter largely involve minimal complex design considerations, whereas for SiP, an effective subsystem or system, the interconnection and integration are substantially more complex. SiP brings tangible gains in space reduction. While system-on-chip (SoC) achieves the same objective more effectively, SoC design is more complex and time consuming than SiP. SiP’s simplicity has opened a wide array of uses for it in less than a decade since its inception. However, SiP also faces significant challenges in being able to assure form yield maximization.
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