Semiconductor Manufacturing

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Silicon and Ferrosilicon - Global Strategic Business Report
Silicon and Ferrosilicon - Global Strategic Business Report
US$4,950.00
Date of Publication: May 21, 2018
This report analyzes the worldwide markets for Silicon and Ferrosilicon in Metric Tons by the following End-Use Applications: Silicon - Metallurgy, Chemicals, Semiconductors, and Others; Ferrosilicon - Ferrous Foundry, Steel Industry, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East & Africa, and Latin America. Annual estimates and forecasts are provided for the period 2016 through 2024.
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Global Market for Graphene 2018-2027
The Global Market for Graphene 2018-2027
US$1,360.00
Date of Publication: May 11, 2018

The Graphene Report is a comprehensive analysis of the market and commercial opportunities for these remarkable materials. This new edition has greatly expanded the sections covering flexible electronics, wearables and energy and details on industry demand in tons (current and projected) has been added for key markets.

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Packaging Cost and Price Model
Packaging Cost and Price Model
US$1,200.00
Date of Publication: May 2, 2018

The Packaging Cost and Price Model is designed to calculate the manufacturing cost and selling price of most semiconductor packages. The model forward forecasts out to 2025. 75mm to 300mm wafer sizes are supported. Packaging cost, packaging step costs and material usage are calculated.

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IC Cost and Price Model
2018 IC Cost and Price Model
US$2,300.00
Date of Publication: May 2, 2018

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.

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The IC Knowledge - MEMS Cost Model
The IC Knowledge - MEMS Cost and Price Model
US$1,995.00
Date of Publication: May 2, 2018
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.
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Semiconductor Automated Test Equipment (ATE) - Global Strategic Business Report
Semiconductor Automated Test Equipment (ATE) - Global Strategic Business Report
US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for Semiconductor Automated Test Equipment (ATE) in US$ by the following Application Areas: Consumer Electronics, Telecom & IT, and Others. The Global market is further analyzed by the following Product Types and Components - Product Type:   Memory, Non-Memory, and Others; Components:  Contactors, Testers, and Others. The report provides separate comprehensive analytics for the US, Japan, Europe, China, South Korea, Taiwan, and Rest of World.
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The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industries: Market Analysis And Processing Trends
The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industry: Market Analysis And Processing Trends
US$2,495.00
Date of Publication: Feb 7, 2018

This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.

300mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis
300/450mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis
US$2,495.00
Date of Publication: Feb 7, 2018
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.
Indium Tin Oxide (ITO) and Replacement Markets: Insight for End Users and Material and Equipment Suppliers
Indium Tin Oxide (ITO) and Replacement Markets: Insight for End Users and Material and Equipment Suppliers
US$2,495.00
Date of Publication: Feb 7, 2018
This report presents a market and technical forecast for ITO and replacements for LCD panels, plasma display panels (PDP), touch panels, e-paper, solar cells and organic electroluminescent (EL) panels.
The TFT-LCD Photomask Market
TFT-LCD Photomask Market
US$2,495.00
Date of Publication: Feb 7, 2018

The growth of the FPD market with the diffusion of digital home appliances is driving the large-format photomask market and prompting some companies to enter.  In order to remain competitive in such circumstances, companies have been strengthening their technological capabilities and creating higher value-added products, as well as provide products at reasonable cost and with a delivery time that satisfies customer demands. Driving the TFT-LCD photomask market are a generation-shift to bigger glass plates and a design-rule cycle of panel technology that changes every 12 months. In this report, the worldwide markets are analyzed and projected, and market shares of vendors presented.

CMP Technology: Competition, Products, Markets
CMP Technology: Competition, Products, Markets
US$2,495.00
Date of Publication: Feb 7, 2018
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.
The LED Revolution: Market Analysis And Insight On Reducing Manufacturing Costs
The LED Revolution: Market Analysis and Insight On Reducing Manufacturing Costs
US$2,495.00
Date of Publication: Feb 7, 2018
This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.
Sub-100nm Lithography: Market Analysis And Strategic Issues
Sub-100nm Lithography: Market Analysis And Strategic Issues
US$2,495.00
Date of Publication: Feb 7, 2018
The primary objective of this report is to review the current issues dealing with lithography as applied to the manufacture of VLSI devices.
Mask Making, Inspection, and Repair: Market Analysis and Strategic Issues
Mask Making, Inspection, and Repair: Market Analysis and Strategic Issues
US$2,495.00
Date of Publication: Feb 7, 2018
This report addresses the strategic issues impacting the mask making, inspection, and repair sectors of the semiconductor industry in the U.S. and the world. The mask market is segmented by geographic region. The mask equipment markets are analyzed and projected and market shares presented.
Metrology, Inspection, and Process Control in VLSI Manufacturing
Metrology, Inspection, and Process Control in VLSI Manufacturing
US$2,495.00
Date of Publication: Feb 7, 2018

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.

High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends
High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends
US$2,495.00
Date of Publication: Feb 7, 2018
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.
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