Semiconductor Manufacturing

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System-On-A-Chip - Global Strategic Business Report
System-On-A-Chip (SOCs) - Global Strategic Business Report
US$5,600.00
Date of Publication: Jul 27, 2018

This report analyzes the worldwide markets for System-on-A-Chip in US$ Million by the following Types: Mixed Signal SoCs, and Others. The Global market is further analyzed by the following End-Use Segments: Computers, Communication Equipment, Consumer Appliances, Automotive Applications, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

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System-in-Package (SiP) Technology - Global Strategic Business Report
System-in-Package (SiP) Technology - Global Strategic Business Report
US$5,600.00
Date of Publication: Mar 20, 2018
This report analyzes the worldwide markets for System-in-Package (SiP) Technology in US$ Million. The Global market is further analyzed by: Interconnection Technology - Wire Bonding, and Flip-Chip; and End-Use Sector - Consumer Electronics, Communications, Aerospace & Defense, Automotive, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.
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Semiconductor Fabrication Material - Global Strategic Business Report
Semiconductor Fabrication Materials - Global Strategic Business Report
US$5,600.00
Date of Publication: May 22, 2018
This report analyzes the worldwide markets for Semiconductor Fabrication Material in US$ Million by the following Segments: Silicon Wafers, Photoresists & Adjuncts, Electronic Gases, CMP Material, and Others. The report provides separate comprehensive analytics for the US, Japan, Europe, China, South Korea, Taiwan, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.
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Discrete and Power Products Cost and Price Model
The IC Knowledge - Discrete and Power Products Cost and Price Model (2018)
US$2,300.00
Date of Publication: Sep 12, 2018
The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices.
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IC Cost and Price Model
2018 IC Cost and Price Model
US$2,300.00
Date of Publication: Sep 12, 2018

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.

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Wafer Fabrication Costs Model and Equipment Requirements
Strategic Cost and Price Model
US$5,000.00
Date of Publication: Sep 12, 2018

Strategic Cost and Price Model - a forward looking model that projects Logic processes out to 13.5nm, DRAM and 2D NAND out to 1z plus 3D NAND and 3D XPoint. The model covers the top 3 DRAM, Foundry,and NAND manufacturers and leading logic manufacturers by node and produces detailed process flows, equipment requirements, materials requirements and wafer cost projections. The model is fully pre populated but also customizable customizable for process, equipment and materials. The model is wafer cost only and does not include packaging or test.

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The IC Knowledge - MEMS Cost Model
The IC Knowledge - MEMS Cost and Price Model
US$1,995.00
Date of Publication: Sep 12, 2018
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.
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Packaging Cost and Price Model
Assembly and Test Cost and Price Model
US$1,200.00
Date of Publication: Sep 12, 2018

The Assembly and Test Cost and Price model covers wafer sorts, assembly of leadframe and organic substrates packages including EMIB, wafer level packaging and InFO and class test. The model is user customizable and we are continually adding new features.

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Industrial X-Ray Inspection Systems - Global Strategic Business Report
Industrial X-Ray Inspection Systems - Global Strategic Business Report
US$4,950.00
Date of Publication: Feb 27, 2018

Industrial X-Ray Inspection Systems - Global Strategic Business Report analyzes the worldwide markets for Industrial X-ray Inspection Systems in US$ by the following Product Group/Segments: Digital (Computed Tomography (CT), & Others) and Film. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

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Silicon and Ferrosilicon - Global Strategic Business Report
Silicon and Ferrosilicon - Global Strategic Business Report
US$4,950.00
Date of Publication: May 21, 2018
This report analyzes the worldwide markets for Silicon and Ferrosilicon in Metric Tons by the following End-Use Applications: Silicon - Metallurgy, Chemicals, Semiconductors, and Others; Ferrosilicon - Ferrous Foundry, Steel Industry, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East & Africa, and Latin America. Annual estimates and forecasts are provided for the period 2016 through 2024.
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Global Market for Graphene 2018-2027
The Global Market for Graphene 2018-2027
US$1,360.00
Date of Publication: May 11, 2018

The Graphene Report is a comprehensive analysis of the market and commercial opportunities for these remarkable materials. This new edition has greatly expanded the sections covering flexible electronics, wearables and energy and details on industry demand in tons (current and projected) has been added for key markets.

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Metrology Software - Global Strategic Business Report
Metrology Software - Global Strategic Business Report
US$4,950.00
Date of Publication: Jan 18, 2018
This report analyzes the worldwide markets for Metrology Software in US$ Thousand. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East & Africa, and Latin America. Annual estimates and forecasts are provided for the period 2016 through 2024.
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Semiconductor Automated Test Equipment (ATE) - Global Strategic Business Report
Semiconductor Automated Test Equipment (ATE) - Global Strategic Business Report
US$4,950.00
Date of Publication: Feb 16, 2018
This report analyzes the worldwide markets for Semiconductor Automated Test Equipment (ATE) in US$ by the following Application Areas: Consumer Electronics, Telecom & IT, and Others. The Global market is further analyzed by the following Product Types and Components - Product Type:   Memory, Non-Memory, and Others; Components:  Contactors, Testers, and Others. The report provides separate comprehensive analytics for the US, Japan, Europe, China, South Korea, Taiwan, and Rest of World.
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The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industries: Market Analysis And Processing Trends
The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industry: Market Analysis And Processing Trends
US$2,495.00
Date of Publication: Feb 7, 2018

This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.

300mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis
300/450mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis
US$2,495.00
Date of Publication: Feb 7, 2018
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.
Indium Tin Oxide (ITO) and Replacement Markets: Insight for End Users and Material and Equipment Suppliers
Indium Tin Oxide (ITO) and Replacement Markets: Insight for End Users and Material and Equipment Suppliers
US$2,495.00
Date of Publication: Feb 7, 2018
This report presents a market and technical forecast for ITO and replacements for LCD panels, plasma display panels (PDP), touch panels, e-paper, solar cells and organic electroluminescent (EL) panels.
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