Semiconductor Manufacturing

US$2,495.00
Date of Publication: Dec 12, 2017
At the time of the alleged 2010 embargo, Chinese firms accounted for 97 percent of rare-earth oxide production and a large fraction of the processing business that turns these into rare earth metals, alloys, and products like magnets. This near-monopoly was in a market with surging demand and intense political resonance in consuming countries. And the most dependent countries—primarily Japan and the United States, but also several European states—happened to be those over which China most wanted influence. Prices soared in the REE spot market in the wake of China’s 2010 export cuts, especially as downstream users—companies that incorporate REEs into other products—filled inventories to protect themselves from future disruptions. Downstream markets are already adjusting to the changing supply picture through normal market mechanisms. This report presents a forecast of REE for a variety of technologies: semiconductors, HDDs, FPDs, mobile devices, LEDs, and alternative energy

US$5,500.00
Date of Publication: Aug 18, 2017
This report addresses the global market for thermal management products for microchips during the forecast period through 2022. The global market for thermal management products should reach $6.3 billion by 2022 from $4.7 billion in 2017 at a compound annual growth rate (CAGR) of 6.0%, from 2017 to 2022.

US$1,300.00
Date of Publication: Nov 24, 2017
The IC Knowledge - 300mm watch database provides detailed coverage of all of the operating and announced 300mm fabs in the world. Details around location, products, key dates, investment and output versus year are all provided. There are also a number of graphs summarizing and analyzing output, capacity and cost out through 2025.

US$2,150.00
Date of Publication: Nov 24, 2017
The Discrete and Power Products Cost and Price Model - new revision has now been released with new processes and other enhancements. Easily calculate the cost and price of high power silicon ICs and discrete devices with only 5 required selections/entries. The model supports over 260 processes and over 70 package types. All of our models include twelve month of updates with reasonable email and phone support.

US$5,000.00
Date of Publication: Nov 24, 2017

The IC Knowledge - Strategic Cost Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade. Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron


US$1,900.00
Date of Publication: Nov 24, 2017
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test..

US$800.00
Date of Publication: Nov 8, 2017
The report finds the Taiwanese fabless IC industry's shipment value grew sequentially to about USD437 million in the second quarter of 2017. When it comes to the application of fabless ICs, nearly 38% of ICs are used in communications, followed by nearly 35% in consumer electronics.

US$800.00
Date of Publication: Nov 8, 2017
The report finds that the the Taiwanese semiconductor manufacturing industry comprising mainly of foundry, DRAM, flah memory, and IDM sectors grew sequentially but declined year-on-year in the second quarter of 2017. With the increasing share of high-end models and the considerable growth in memories made using advanced process technology, the industry's shipment value is projected to have reached USD11.3 billion in the third quarter of 2017 and peak in the last quarter to around USD14.2 billion.

US$2,495.00
Date of Publication: Oct 18, 2017
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

US$2,495.00
Date of Publication: Oct 18, 2017
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

US$2,495.00
Date of Publication: Oct 18, 2017

The commercial battle for next-generation power semiconductors is evolving. IGBTs, SiC and other technologies are geared for the niche-oriented markets at 1,700 volts and higher. But what is the best technology for the larger 600- and 1,200-volt markets? both super-junction MOSFETs and IGBTs are ramping up on 300mm wafers, making them less expensive than GaN and SiC. In comparison, SiC MOSFETs are ramping up on 100mm wafers, while GaN-on-silicon is running on 150mm substrates. This report analyzes and forecasts the traditional power semiconductor market as well as next generation devices.  Market shares of vendors by type are presented.


US$2,495.00
Date of Publication: Oct 18, 2017

Microcontrollers (MCUs) used in Smart Cities, Smart Homes, Smart Industry, Smart Health, and Smart Transport (a subset of the Internet of Things (IoT)), represented just 10% of the overall MCU market in 2014. But in 2020, $10 billion in MCUs, representing 40% of the total market, will be used in these applications.


US$4,995.00
Date of Publication: Oct 18, 2017

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.


US$4,950.00
Date of Publication: Sep 21, 2017
This report analyzes the worldwide markets for Semiconductor Fabrication Material in US$ Million by the following Segments: Silicon Wafers, Photoresists & Adjuncts, Electronic Gases, CMP Material, and Others. The report provides separate comprehensive analytics for the US, Japan, Europe, China, South Korea, Taiwan, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$1,300.00
Date of Publication: Sep 4, 2017

The Graphene Report is a comprehensive analysis of the market and commercial opportunities for these remarkable materials. The graphene market continues to expand in 2017, with weekly announcements on new multi-million dollar investments, new products (especially in the Asia market) and innovative production processes.


US$2,495.00
Date of Publication: Jul 17, 2017
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.

US$2,495.00
Date of Publication: Jul 18, 2017
This report presents a market and technical forecast for ITO and replacements for LCD panels, plasma display panels (PDP), touch panels, e-paper, solar cells and organic electroluminescent (EL) panels.

US$2,495.00
Date of Publication: Jul 18, 2017
The use of nanoparticles is set to escalate and the market has the potential to increase dramatically over the next ten years as more uses for these materials are developed and commercialized. Eventually, nanomaterials are likely to affect nearly every industry in every region in the world, including the least developed regions. In fact, there is considerable optimism that nanomaterials will be instrumental in addressing some of the developing world’s most pressing concerns. This report presents a forecast of nanomaterials by type and by application.

US$5,695.00
Date of Publication: Jan 24, 2017
According to this new report, the total market for printed, flexible and organic electronics will grow from $29.28 billion in 2017 to $73.43 billion in 2027. The majority of that is OLEDs (organic but not printed) and conductive ink used for a wide range of applications. On the other hand, stretchable electronics, logic and memory, thin film sensors are much smaller segments but with huge growth potential as they emerge from R&D.

US$4,950.00
Date of Publication: Jun 5, 2017
This report analyzes the worldwide markets for System-in-Package (SiP) Technology in US$ Million. The Global market is further analyzed by: Interconnection Technology - Wire Bonding, and Flip-Chip; and End-Use Sector - Consumer Electronics, Communications, Aerospace & Defense, Automotive, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

US$4,995.00
Date of Publication: May 3, 2017
In a balanced appraisal, "Supercapacitor Materials 2017-2027" how, in many of the last 20 years they have improved their power density and energy density faster than lithium-ion batteries have done thanks to better hierarchical active electrodes and sometimes exohedral ones plus new electrolytes and so on. However, with its primary focus on the present and future, it shows how new pairings of active electrode and electrolyte materials are now key. Markets of billions of dollars remained elusive, however, due to high price caused by complex processing of basically low-cost materials and limited energy density even after all that improvement.

US$2,495.00
Date of Publication: Jul 18, 2017
Chemicals and materials are used in every processing step in the fabrication of silicon and gallium arsenide integrated circuits. Technological advances in Si and GaAs ICs have resulted in more stringent requirements in the purity and quality of processing chemicals and materials for cleaning, etching, and deposition. As linewidths decrease, the level and size of contaminants in both chemicals and the manufacturing cleanroom become increasingly important as it directly impacts device yield. This report addresses a number of important factors that will impact the consumption of chemicals and materials for manufacturing ICs with feature sizes <100nm: Technological issues and trends; Purity and particulate requirements; Chemical dispensing practices; Acid reprocessing; Strategic considerations for chemical users; Analysis and forecast of the worldwide chemical market; and trends in usage as devices features decrease. Market shares of vendors also presented.

US$2,495.00
Date of Publication: Jul 18, 2017
Light-emitting diodes (LEDs) are on the verge of revolutionizing the lighting market. As a general illumination lighting source, LED products surpass many conventional lighting technologies (including incandescent and fluorescent light sources) in energy efficiency, lifetime, and versatility and rival them in color and light quality. Having already significantly penetrated several colored light applications, such as traffic signals and exit signs, white-light LED products have recently been commercialized. LEDs can be found in directional lamp fittings such as downlights, display, accent, under-cabinet lighting, as well as in area light fittings such as parking, roadway, and troffer lighting applications. This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.

US$2,495.00
Date of Publication: Jul 17, 2017

This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.


US$2,100.00
Date of Publication: Mar 30, 2017
China is the largest producer and exporter of silicon carbide in the world, with the capacity reaching 2.2 million tons, sweeping more than 80% of the global total. However, excessive capacity expansion and oversupply lead to the capacity utilization less than 50%. In 2015, the silicon carbide output in China totaled 1.02 million tons, with the capacity utilization rate of only 46.4%; in 2016, the total output was estimated to be about 1.05 million tons, with the capacity utilization rate of 47.7%.

US$2,495.00
Date of Publication: Jul 18, 2017

Mainland China represents a huge opportunity for semiconductor manufacturers and equipment and materials suppliers. Massive investments in China’s semiconductor industry is paying off as internal production is making inroads on demand. The emerging semiconductor market will exhibit growth far in excess of any other country. This report analyzes Mainland China’s semiconductor and equipment industries, examining the technical, economic, and political issues that are shaping this nascent industry.


US$2,495.00
Date of Publication: Jul 18, 2017

The growth of the FPD market with the diffusion of digital home appliances is driving the large-format photomask market and prompting some companies to enter.  In order to remain competitive in such circumstances, companies have been strengthening their technological capabilities and creating higher value-added products, as well as provide products at reasonable cost and with a delivery time that satisfies customer demands. Driving the TFT-LCD photomask market are a generation-shift to bigger glass plates and a design-rule cycle of panel technology that changes every 12 months. In this report, the worldwide markets are analyzed and projected, and market shares of vendors presented.


US$2,495.00
Date of Publication: Jul 18, 2017
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.

US$2,495.00
Date of Publication: Jul 18, 2017
The continued improvements in lithography have been the driving force that has upheld Moore's Law. Shorter wavelengths, better lenses, and adaptive optics have all contributed to this success story, which has allowed commercial chips to be fabricated with 14nm feature sizes. This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are. The worldwide lithography markets are analyzed and projected by type (EUV, DUV, and optical), and market shares by vendor for each type.

US$2,495.00
Date of Publication: Jul 18, 2017
This report addresses the strategic issues impacting the mask making, inspection, and repair sectors of the semiconductor industry in the U.S. and the world. The mask market is segmented by geographic region. The mask equipment markets are analyzed and projected and market shares presented.

US$2,495.00
Date of Publication: Jul 18, 2017
This report analyzes the market for MEMS by devices and systems. The equipment and materials to make them are analyzed and forecast.

US$2,495.00
Date of Publication: Jul 18, 2017

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.


US$2,495.00
Date of Publication: Jul 18, 2017
This report addresses these technical issues, presenting an analysis of the semiconductor factory automation industry, the key players, and the driving forces directing semiconductor factory automation. Markets are segmented as: 1. Automated transfer tools (robots, elevators, platforms, etc.), 2. Carrier transport (monorail, AGV, AS/RS, etc.), 3. Manufacturing execution systems (MES) software.

US$2,495.00
Date of Publication: Jul 18, 2017
This report analyzes the market for both crystalline and thin film solar cells, equipment to make them, and polysilicon as a starting point. Marker shares of vendors in all these sectors are presented.

US$2,495.00
Date of Publication: Jul 18, 2017
Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today. WLP offers lower cost, a smaller package, higher performance and added functionality compared to older methods. In the world of high-speed/high-performance IC and package design, flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computing. This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.

US$2,495.00
Date of Publication: Jul 18, 2017
In this report we identify and forecast areas of semiconductor-related technologies where a small or mid-sized company can compete. These high-tech applications segmented as those are fabricated on 300mm wafers and those built on non-300mm wafers. The small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience

US$2,495.00
Date of Publication: Jul 18, 2017

In this report we identify and forecast areas of related technologies where a small or mid-sized chemical and material companies can compete: Solar, MEMS, LEDs, HDD, and WLP. As a result, the small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.


US$2,495.00
Date of Publication: Jul 18, 2017
The future needs in plasma etching will be for ever tighter control of process variability, higher selectivity and less damage. This report addresses the strategic issues impacting both the user and supplier of plasma etching equipment to the semiconductor industry. Markets for dry etching and stripping are analyzed and projected. Dry etching systems are further segmented by application. Market shares of vendors in each sector are presented.

US$2,495.00
Date of Publication: Jul 18, 2017
Microphones continue to be one of the best success stories in MEMS, with mobile device manufacturers adding increasing numbers of these devices to their phones to support advanced features, such as voice command and noise suppression. Silicon microphones have the potential to be the next high-volume MEMS application. With their compact and lightweight structure as well as high integration capability, these products are already in vogue in high-end markets, especially for hearing aid use. Hoping to tap the huge potential of MEMS (Micro Electro Mechanical Systems microphones), companies are gearing up to master the technology. The report examines the market for microphones, speakers, and end-applications.

US$2,495.00
Date of Publication: Jul 18, 2017
This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for LCDs, equipment and materials is presented along with market share of vendors.

US$4,995.00
Date of Publication: Jul 18, 2017
This report examines and projects the technology of equipment and materials involved in the fabrication of VLSI semiconductor devices, their likely developments, why and when their introduction or demise will take place, what problems and choices are facing users, and where the opportunities and pitfalls are.

US$2,495.00
Date of Publication: Jul 18, 2017
This report compares some of the issues impacting users of different deposition tools, including: APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD, ALD. Market forecasts and market shares of vendors is presented.

US$2,495.00
Date of Publication: Jul 18, 2017
The use of nanoparticles is set to escalate and the market has the potential to increase dramatically over the next ten years as more uses for these materials are developed and commercialized. Eventually, nanomaterials are likely to affect nearly every industry in every region in the world, including the least developed regions. In fact, there is considerable optimism that nanomaterials will be instrumental in addressing some of the developing world’s most pressing concerns.

US$5,550.00
Date of Publication: Jul 17, 2017
Global markets for LED phosphor materials and technologies. Coverage of phosphor uses, specifically white LEDs, color changing LEDs, and phosphors used for Ultraviolet LED.

US$24,950.00
Date of Publication: Mar 24, 2017
This report profiles the top 29 Asian (Japan, Korea, Taiwan) Companies making semiconductor process equipment.  The report analyzes market shares for 29 equipment sectors, which includes Asian and Non-Asian manufacturers. Market forecasts are presented for all 29 equipment sectors. Asia-based semiconductor equipment makers will see their combined share of the global equipment sales shrink in 2016.

US$2,495.00
Date of Publication: Jul 18, 2017
The biggest enabler of the mobile data increase and the most important driver of the GaAs RF IC market is the handset segment. Much of the content of a handset is silicon-based, but power amplifiers (PAs) and switches in the front-end of the phone use GaAs devices. This report investigates the technology trends, applications, and market developments of GaAs ICs. U.S., Japanese, and European applications such as telecom, computers, defense, consumers, are reviewed. This report will provide the reader with an in-depth understanding of the technological and market factors determining the evolution of GaAs ICs.

US$5,550.00
Date of Publication: Mar 13, 2017
The global market for sputtered films and sputtering targets should reach over $3.2 billion by 2021 from nearly $2.9 billion in 2016 at a compound annual growth rate (CAGR) of 2.2%, from 2016 to 2021. Details of the global market analysis are covered. For each major application group or industry sector (specifically electronics, optoelectronics, mechanical/chemical, energy, optical coatings and life sciences and others), this research provides information on production of sputtered films, consumption of sputtering targets and target revenues by material and region.

US$5,550.00
Date of Publication: Jan 23, 2017
The report addresses the global market for new electronic materials during the period from 2016 through 2026. The report quantifies new electronic materials produced for use in the production of electronic materials (transistors, semiconductors, displays, etc). The global market for advanced electronic materials totaled nearly $4.9 billion in 2016. This market should total $10.3 billion in 2021 and $24.1 billion by 2026 at a five-year compound annual growth rate (CAGR) of 18.5%, for the period of 2021-2026.

US$5,550.00
Date of Publication: Nov 23, 2016
The global market for atomic layer deposition and other ultrathin film fabrication processes was valued at $1.1 billion and $1.3 billion in 2014 and 2015, respectively. This market is expected to increase from $1.5 billion in 2016 to nearly $3.7 billion in 2021 at a compound annual growth rate (CAGR) of 19.1% for 2016-2021

US$2,495.00
Date of Publication: Jan 7, 2017

This report analyzes the wearable industry and markets for the two wearable camps described above. Forecasts are also presented for semiconductor content and markets for MEMs devices, sensors, CPUs and low-power MPUs, GPS, and connectivity chips. Wearables are small electronic devices, often consisting of one or more sensors and having computational capability. They are embedded into items that attach to the body, such as a user’s head, feet, arms, wrists and waist. They can resemble a watch, eyeglasses, clothing, contact lenses, shoes or even jewelery. Wearables either capture data or present data. The types of data collected could be as simple as the number of steps taken in a day or as complex as ECG or brainwave measurements. For output, wearables can convey information to the user through a variety of means, from the blinking of an LED light to a complex display of data.


US$5,550.00
Date of Publication: Mar 16, 2016

The global market for thermal management products will grow from about $10.7 billion in 2015 to nearly $11.2 billion in 2016 and $14.7 billion by 2021, representing a compound annual growth rate (CAGR) of 5.6% between 2016 and 2021. The scope of this report is broad, covering several product areas. The individual materials, hardware, and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected through 2021. The application sections feature forecasts for the most important applications by product.


US$5,550.00
Date of Publication: Sep 28, 2016
The global market for thin film materials reached nearly $9.9 billion and $9.8 billion in 2014 and 2015, respectively. The market is expected to reach nearly $11.3 billion by 2021 increasing at a compound annual growth rate (CAGR) of 3.0% from 2016 to 2021. This report provides an updated review of thin film technologies, including materials and production processes, and identifies current and emerging applications for these technologies. 

US$4,950.00
Date of Publication: Sep 21, 2016
This report analyzes the worldwide markets for System-on-A-Chip in US$ Million by the following Types: Mixed Signal SoCs, and Others. The Global market is further analyzed by the following End-Use Segments: Computers, Communication Equipment, Consumer Appliances, Automotive Applications, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

US$4,950.00
Date of Publication: Aug 23, 2016
This report analyzes the worldwide markets for Industrial X-ray Inspection Systems in US$. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022. Also, a six-year historic analysis is provided for these markets

US$5,550.00
Date of Publication: Jul 20, 2016
This report provides: An overview of the global markets for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads; Analyses of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021. The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.

US$5,550.00
Date of Publication: Jun 20, 2016
This report provides an overview of the global markets for semiconductor metallization, a process which produces a thin-film metal layer that will serve as the required conductor pattern for the interconnection of the various components on the chip. The global semiconductor metallization and interconnects market totaled $912.8 million and $1.0 billion in 2014 and 2015 respectively. The market should total nearly $1.8 billion by 2020, growing at a compound annual growth rate (CAGR) of 11.4% from 2015 to 2020.

US$2,750.00
Date of Publication: Apr 19, 2016
This new report addresses the global cost of goods sold and industry wide operating profit for the worldwide capacitor industry by type, including ceramic, aluminum, tantalum and plastic film. The study addresses fixed and variable costs associated with the production of capacitors, with emphasis upon variable raw material costs, variable labor charges, variable overhead and manufacturing costs and the trend that is occurring with respect to both the cost of goods sold and the overall operating profit for capacitors over time.

US$4,950.00
Date of Publication: Mar 29, 2016
This report analyzes the worldwide markets for Semiconductor Automated Test Equipment (ATE) in terms of spending (US$) for the following Application Areas: Consumer Electronics, Telecom & IT, and Others. The global market for Semiconductor Automated Test Equipment (ATE) is projected to reach US$3.16 billion by 2022, driven by the "digitalize or die" challenge faced by industries and the ensuing significance of semiconductors. Surviving the digital disruption is the compelling new reality for industries across the globe. The Internet, Web 2.0, robotics, artificial intelligence, Internet of Things, and big data analytics are changing the flavor of modern industries. Digital transformation of industries and companies is inevitable in the emerging digital economy. The imminent mass adoption of digital technologies will amplify the commercial opportunity in semiconductor manufacturing as the computational muscle required to power the digital age will be provided by the semiconductor industry. Taiwan represents the largest and the fastest growing independent regional market worldwide with annual spending on semiconductor ATE waxing at a CAGR of 3.3% over the analysis period. Growth in the market is primarily led by huge electronics and semiconductor manufacturing industry established in the country over the years.

US$2,495.00
Date of Publication: Jul 18, 2017
Applied Materials has achieved a dominant position in the semiconductor equipment market by focusing on a global presence, a broad and expanding product line, and exacting customer support -- a strategy initiated in the mid-80s. In the '90s, most of its competitors had recognized that to be competitive with Applied Materials, they too must duplicate these tactics. This report discusses the current strategies of Applied Materials as it competes for world dominance. Strategies of its principal competitors are also analyzed. Markets are analyzed and projected, and market shares for Applied Materials and its competitors are detailed.

US$1,600.00
Date of Publication: Feb 25, 2016
Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises. With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in the development of packaging technology. This report provides an in-depth analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.

US$5,550.00
Date of Publication: Feb 10, 2016

Potential electronics applications of graphene include ultrasmall transistors, superdense data storage, touchscreens and wearable electronics. In the energy field, potential applications include ultracapacitors to store and transmit electrical power as well as highly efficient solar cells. Some researchers argue that the greatest potential for graphene lay in its ability to conduct light as well as electricity. They believe that graphene can improve the efficiency of light-emitting diodes (LEDs) and aid in the production of next-generation devices like flexible touchscreens, photodetectors and ultrafast lasers.


US$1,500.00
Date of Publication: Jan 12, 2016
The report provides an in-depth analysis of the global semiconductor market on the basis of its segments. The market by segments is classified into integrated circuits, discrete semiconductors, optoelectronics and sensors. In addition, the report also covers a detailed analysis of the global semiconductor equipment market, which is further segmented into wafer processing, assembly & packaging, and testing equipment; and the global semiconductor materials market which has further segments, such as wafer fabrication and packaging.

US$2,500.00
Date of Publication: Jan 5, 2016
This report provides an in-depth analysis of Taiwanese semiconductor industry in three areas: fabless IC design, wafer foundry and IC packaging and testing; provides a competitive analysis of semiconductor industry in Korea and Taiwan and examines their future outlook.

US$5,550.00
Date of Publication: Jan 12, 2016

This report provides an overview of the global markets for electronic chemicals and materials, covering the entire range of chemicals and materials that are used in the fabrication of ICs and PCBs. The global electronic chemicals and materials market was nearly $22.0 billion in 2014. The market is projected to grow at a compound annual growth rate (CAGR) of 5.9% from $22.9 billion in 2015 to $30.5 billion by 2020.