Semiconductor Manufacturing

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Opportunities in the Solar Market for Crystalline and Thin Film Solar Cells
Opportunities in the Solar Market for Crystalline and Thin Film Solar Cells
US$2,495.00
Date of Publication: Feb 20, 2019
This report analyzes the market for both crystalline and thin film solar cells, equipment to make them, and polysilicon as a starting point. Marker shares of vendors in all these sectors are presented.
Wearable Electronics and Semiconductor Markets
Wearables - Electronics And Semiconductor Markets
US$2,495.00
Date of Publication: Feb 18, 2019

This report analyzes the wearable industry and markets for the two wearable camps described above. Forecasts are also presented for semiconductor content and markets for MEMs devices, sensors, CPUs and low-power MPUs, GPS, and connectivity chips.

Market Outlook for Nanomaterials for Electronics: Semiconductors, Solar, Displays, Sensors, RFID, Lighting
Nanomaterials for Solar Cells, Displays, Sensors, Lighting and RFID Market Analyses and Driving Forces
US$2,495.00
Date of Publication: Feb 4, 2019
Eventually, nanomaterials are likely to affect nearly every industry in every region in the world, including the least developed regions. In fact, there is considerable optimism that nanomaterials will be instrumental in addressing some of the developing world’s most pressing concerns. Forecasts are presented for nanomaterials for solar cells, displays, lighting, and RFIDs devices.
IC Cost and Price Model
2019 IC Cost and Price Model
US$2,400.00
Date of Publication: Jan 3, 2019

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.

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Chemicals And Materials For Sub-100nm IC Manufacturing
Chemicals And Materials For Sub-100nm IC Manufacturing
US$2,495.00
Date of Publication: Feb 1, 2019
This report addresses a number of important factors that will impact the consumption of chemicals and materials for manufacturing ICs with feature sizes <100nm: Technological issues and trends; Purity and particulate requirements; Chemical dispensing practices; Acid reprocessing; Strategic considerations for chemical users; Analysis and forecast of the worldwide chemical market; and trends in usage as devices features decrease. Market shares of vendors also presented
The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industries: Market Analysis And Processing Trends
The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industry: Market Analysis And Processing Trends
US$2,495.00
Date of Publication: Feb 4, 2019

This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.

300mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis
300/450mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis
US$2,495.00
Date of Publication: Feb 4, 2019
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.
Indium Tin Oxide (ITO) and Replacement Markets: Insight for End Users and Material and Equipment Suppliers
Indium Tin Oxide (ITO) and Replacement Markets: Insight for End Users and Material and Equipment Suppliers
US$2,495.00
Date of Publication: Feb 4, 2019
This report presents a market and technical forecast for ITO and replacements for LCD panels, plasma display panels (PDP), touch panels, e-paper, solar cells and organic electroluminescent (EL) panels.
Mainland China’s Semiconductor and Equipment Markets: A Complete Analysis of the Technical, Economic, and Political Issues
Mainland China’s Semiconductor and Equipment Markets: A Complete Analysis of the Technical, Economic, and Political Issues
US$2,495.00
Date of Publication: Feb 4, 2019

Mainland China represents a huge opportunity for semiconductor manufacturers and equipment and materials suppliers. Massive investments in China’s semiconductor industry is paying off as internal production is making inroads on demand. The emerging semiconductor market will exhibit growth far in excess of any other country. This report analyzes Mainland China’s semiconductor and equipment industries, examining the technical, economic, and political issues that are shaping this nascent industry.

The TFT-LCD Photomask Market
TFT-LCD Photomask Market
US$2,495.00
Date of Publication: Feb 4, 2019

The growth of the FPD market with the diffusion of digital home appliances is driving the large-format photomask market and prompting some companies to enter.  In order to remain competitive in such circumstances, companies have been strengthening their technological capabilities and creating higher value-added products, as well as provide products at reasonable cost and with a delivery time that satisfies customer demands. Driving the TFT-LCD photomask market are a generation-shift to bigger glass plates and a design-rule cycle of panel technology that changes every 12 months. In this report, the worldwide markets are analyzed and projected, and market shares of vendors presented.

CMP Technology: Competition, Products, Markets
CMP Technology: Competition, Products, Markets
US$2,495.00
Date of Publication: Feb 4, 2019
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.
The LED Revolution: Market Analysis And Insight On Reducing Manufacturing Costs
The LED Revolution: Market Analysis and Insight On Reducing Manufacturing Costs
US$2,495.00
Date of Publication: Feb 4, 2019
This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.
Sub-100nm Lithography: Market Analysis And Strategic Issues
Sub-100nm Lithography: Market Analysis And Strategic Issues
US$2,495.00
Date of Publication: Feb 4, 2019
The primary objective of this report is to review the current issues dealing with lithography as applied to the manufacture of VLSI devices.
Mask Making, Inspection, and Repair: Market Analysis and Strategic Issues
Mask Making, Inspection, and Repair: Market Analysis and Strategic Issues
US$2,495.00
Date of Publication: Feb 4, 2019
This report addresses the strategic issues impacting the mask making, inspection, and repair sectors of the semiconductor industry in the U.S. and the world. The mask market is segmented by geographic region. The mask equipment markets are analyzed and projected and market shares presented.
Metrology, Inspection, and Process Control in VLSI Manufacturing
Metrology, Inspection, and Process Control in VLSI Manufacturing
US$2,495.00
Date of Publication: Feb 4, 2019

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.

High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends
High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends
US$2,495.00
Date of Publication: Feb 4, 2019
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.
Semiconductor Factory Automation: Technology Issues and Market Forecasts
Semiconductor Factory Automation: Technology Issues and Market Forecasts
US$2,495.00
Date of Publication: Feb 4, 2019
This report addresses these technical issues, presenting an analysis of the semiconductor factory automation industry, the key players, and the driving forces directing semiconductor factory automation. Markets are segmented as: 1. Automated transfer tools (robots, elevators, platforms, etc.), 2. Carrier transport (monorail, AGV, AS/RS, etc.), 3. Manufacturing execution systems (MES) software.
3D TSV: Insight On Critical Issues And Market Analyses
3D TSV: Insight On Critical Issues And Market Analyses
US$2,495.00
Date of Publication: Feb 4, 2019
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.
Flip Chip/WLP Manufacturing and Market Analysis
Flip Chip/WLP Manufacturing and Market Analysis
US$2,495.00
Date of Publication: Feb 4, 2019
This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.
Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies
Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies
US$2,495.00
Date of Publication: Feb 4, 2019
In this report we identify and forecast areas of semiconductor-related technologies where a small or mid-sized company can compete. These high-tech applications segmented as those are fabricated on 300mm wafers and those built on non-300mm wafers. The small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.
Semiconductor Chemicals and Materials Supplier Market Strategies
Markets and Strategies for Chemical and Material Suppliers in Niche Markets
US$2,495.00
Date of Publication: Feb 4, 2019

In this report we identify and forecast areas of related technologies where a small or mid-sized chemical and material companies can compete: Solar, MEMS, LEDs, HDD, and WLP. As a result, the small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.

Plasma Etching Market Analysis and Strategic Issues
Plasma Etching: Market Analysis and Strategic Issues
US$2,495.00
Date of Publication: Feb 4, 2019
The future needs in plasma etching will be for ever tighter control of process variability, higher selectivity and less damage. This report addresses the strategic issues impacting both the user and supplier of plasma etching equipment to the semiconductor industry. Markets for dry etching and stripping are analyzed and projected. Dry etching systems are further segmented by application. Market shares of vendors in each sector are presented.
Rare Earth Elements in High-Tech Industries: Market Analysis And Forecasts Amid China's Trade Embargo
Rare Earth Elements in High-Tech Industries: Market Analysis And Forecasts Amid China's Trade Embargo
US$2,495.00
Date of Publication: Feb 4, 2019
This report presents a forecast of REE for a variety of technologies: semiconductors, HDDs, FPDs, mobile devices, LEDs, and alternative energy.
Next-Generation Power Semiconductors: Markets Materials, Technologies
Next-Generation Power Semiconductors: Markets, Materials, Technologies
US$2,495.00
Date of Publication: Feb 4, 2019
This report analyzes and forecasts the traditional power semiconductor market as well as next generation devices. Market shares of vendors by type are presented.
Silicon Microphones and Speakers: Technology, Applications and Markets
Silicon Microphones and Speakers: Technology, Market Analysis, and End Applications
US$2,495.00
Date of Publication: Feb 4, 2019
The report examines the market for microphones, speakers, and end-applications.
LCD Market: Technology Directions and Market Analysis
LCD Market: Technology Directions and Market Analysis
US$2,495.00
Date of Publication: Feb 4, 2019
This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for LCDs, equipment and materials is presented along with market share of vendors.
Equipment and Materials for IC Manufacturing
The Global Market for Equipment and Materials for IC Manufacturing
US$4,995.00
Date of Publication: Feb 4, 2019
This report examines and projects the technology of equipment and materials involved in the fabrication of VLSI semiconductor devices, their likely developments, why and when their introduction or demise will take place, what problems and choices are facing users, and where the opportunities and pitfalls are.
Thin Film Deposition: Trends, Key Issues, Market Analysis
Thin Film Deposition: Trends, Key Issues, Market Analysis
US$2,495.00
Date of Publication: Feb 4, 2019
This report compares some of the issues impacting users of different deposition tools, including: APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD, ALD. Market forecasts and market shares of vendors is presented.
GaAs IC Markets
The GaAs IC Markets
US$2,495.00
Date of Publication: Feb 4, 2019
This report will provide the reader with an in-depth understanding of the technological and market factors determining the evolution of GaAs ICs.
Convergence of Semiconductors and Smart Technology Market Analysis
Convergence of Semiconductors and Smart Technology - Market Analysis
US$2,495.00
Date of Publication: Feb 4, 2019

Microcontrollers (MCUs) used in Smart Cities, Smart Homes, Smart Industry, Smart Health, and Smart Transport (a subset of the Internet of Things (IoT)), represented just 10% of the overall MCU market in 2014. But in 2020, $10 billion in MCUs, representing 40% of the total market, will be used in these applications.

Asian Semiconductor Equipment Suppliers: Markets, Market Shares, Market Forecasts
Asian Semiconductor Equipment Suppliers: Markets, Market Shares, Market Forecasts
US$2,495.00
Date of Publication: Feb 4, 2019
This report profiles the top Asian (Japan, Korea, Taiwan) Companies making semiconductor process equipment. The report analyzes market shares for 29 equipment sectors, which includes Asian and Non-Asian manufacturers. Market forecasts are presented for all 29 equipment sectors.
Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts
Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts
US$4,995.00
Date of Publication: Feb 4, 2019

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.

Packaging Cost and Price Model
Assembly and Test Cost and Price Model
US$1,400.00
Date of Publication: Sep 12, 2018

The Assembly and Test Cost and Price model covers wafer sorts, assembly of leadframe and organic substrates packages including EMIB, wafer level packaging and InFO and class test. The model is user customizable and we are continually adding new features.

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Discrete and Power Products Cost and Price Model
The IC Knowledge - Discrete and Power Products Cost and Price Model (2018)
US$2,300.00
Date of Publication: Nov 27, 2018
The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices.
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Wafer Fabrication Costs Model and Equipment Requirements
Strategic Cost and Price Model
US$5,500.00
Date of Publication: Nov 27, 2018

Strategic Cost and Price Model - a forward looking model that projects Logic processes out to 13.5nm, DRAM and 2D NAND out to 1z plus 3D NAND and 3D XPoint. The model covers the top 3 DRAM, Foundry,and NAND manufacturers and leading logic manufacturers by node and produces detailed process flows, equipment requirements, materials requirements and wafer cost projections. The model is fully pre populated but also customizable customizable for process, equipment and materials. The model is wafer cost only and does not include packaging or test.

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The IC Knowledge - MEMS Cost Model
The IC Knowledge - MEMS Cost and Price Model
US$1,995.00
Date of Publication: Sep 12, 2018
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.
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Taiwanese Semiconductor Manufacturing Industry Report
Taiwanese Semiconductor Manufacturing Industry, 3Q 2018
US$800.00
Date of Publication: Sep 27, 2018
The report finds that the Taiwanese semiconductor manufacturing industry comprising mainly of foundry, DRAM, flash memory, and IDM sectors grew both year-on-year and sequentially in the second quarter of 2018.
Recap and Outlook for The Worldwide Wafer Foundry Industry in 2018
US$1,500.00
Date of Publication: Sep 10, 2018
The global wafer foundry industry is highly concentrated with the top-five players taking up about 76% of the total shipments. The increasing share of orders released by IDMs and the proliferation of emerging application ICs such as CPUs, GPUs, FPGAs, and ASICs have been major growth factors to drive the industry's growth over the years.
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Global and China Automated Optical Inspection (AOI) Industry Report, 2018-2022
Global and China Automated Optical Inspection (AOI) Industry Report, 2018-2022
US$3,200.00
Date of Publication: Aug 22, 2018
Miniaturization of electronic products conduces to components of all sorts being smaller and smaller and spurs the growing demand for automated inspection equipment. In the wake of a transfer of electronic components production capacity to China, the AOI equipment has been developing by leaps and bounds over the past several years.
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Semiconductor Industry Overview and Competitive Analysis Between Taiwan and Korea
Recap and Outlook for Global and Taiwanese IC Design Industries in 2018
US$1,600.00
Date of Publication: Nov 7, 2018
As demand for high-performance computing continues into 2018, the worldwide and Taiwanese IC design industries are expected to grow. This report reviews the performance of the worldwide and Taiwanese IC design industries in 2017 and examines their developments in 2018 and onwards.
Semiconductor Machinery Manufacturing: Global Markets to 2023
Semiconductor Machinery Manufacturing: Global Markets to 2023
US$5,500.00
Date of Publication: Nov 6, 2018
This research report categorizes the semiconductor machinery manufacturing by type. Product types include wafer processing equipment, assembly, packaging equipment, and other front-end equipment. The global market for semiconductor machinery manufacturing should grow from $57.8 billion in 2018 to $114.4 billion by 2023, with a compound annual growth rate (CAGR) of 14.6% from 2018 to 2023.
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Taiwanese Fabless IC Industry
The Taiwanese Fabless IC Industry, 3Q 2018
US$1,000.00
Date of Publication: Sep 25, 2018
The report finds that the Taiwanese fabless IC industry's shipment value witnessed double-digit growth on sequential and year-on-year basis in the second quarter of 2018. Shipment value of the industry has continued the growth momentum in the third quarter of 2018.
IPC-2291 Design Guideline for Printed Electronics
IPC-2291 Design Guideline for Printed Electronics
US$89.00
Date of Publication: Aug 1, 2013
This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products. The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow.
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Applied Materials: Competing for World Dominance
Applied Materials: Competing for World Dominance
US$2,495.00
Date of Publication: Feb 4, 2019
This report discusses the current strategies of Applied Materials as it competes for world dominance. Strategies of its principal competitors are also analyzed. Markets are analyzed and projected, and market shares for Applied Materials and its competitors are detailed.
Electronic Thermal Management - Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets
Thermal Management Technologies for Semiconductor Microchips
US$5,500.00
Date of Publication: Aug 18, 2017
This report addresses the global market for thermal management products for microchips during the forecast period through 2022. The global market for thermal management products should reach $6.3 billion by 2022 from $4.7 billion in 2017 at a compound annual growth rate (CAGR) of 6.0%, from 2017 to 2022.
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300mm and 450mm Fab Watch
The IC Knowledge - 300mm Watch Database
US$1,300.00
Date of Publication: Nov 24, 2017
The IC Knowledge - 300mm watch database provides detailed coverage of all of the operating and announced 300mm fabs in the world. Details around location, products, key dates, investment and output versus year are all provided. There are also a number of graphs summarizing and analyzing output, capacity and cost out through 2025.
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China Silicon Carbide Industry Report
China Silicon Carbide Industry Report, 2016-2020
US$2,100.00
Date of Publication: Mar 30, 2017
China is the largest producer and exporter of silicon carbide in the world, with the capacity reaching 2.2 million tons, sweeping more than 80% of the global total. However, excessive capacity expansion and oversupply lead to the capacity utilization less than 50%. In 2015, the silicon carbide output in China totaled 1.02 million tons, with the capacity utilization rate of only 46.4%; in 2016, the total output was estimated to be about 1.05 million tons, with the capacity utilization rate of 47.7%.
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Sputtering Targets and Sputtered Films: Technology and Markets
Sputtering Targets and Sputtered Films: Technology and Markets
US$5,550.00
Date of Publication: Mar 13, 2017
The global market for sputtered films and sputtering targets should reach over $3.2 billion by 2021 from nearly $2.9 billion in 2016 at a compound annual growth rate (CAGR) of 2.2%, from 2016 to 2021. Details of the global market analysis are covered. For each major application group or industry sector (specifically electronics, optoelectronics, mechanical/chemical, energy, optical coatings and life sciences and others), this research provides information on production of sputtered films, consumption of sputtering targets and target revenues by material and region.
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New Electronic Materials and Device Technologies: Global Markets
New Electronic Materials and Device Technologies: Global Markets
US$5,550.00
Date of Publication: Jan 23, 2017
The report addresses the global market for new electronic materials during the period from 2016 through 2026. The report quantifies new electronic materials produced for use in the production of electronic materials (transistors, semiconductors, displays, etc). The global market for advanced electronic materials totaled nearly $4.9 billion in 2016. This market should total $10.3 billion in 2021 and $24.1 billion by 2026 at a five-year compound annual growth rate (CAGR) of 18.5%, for the period of 2021-2026.
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Atomic Layer Deposition and other Ultrathin-Film Fabrication Processes
Atomic Layer Deposition and other Ultrathin-Film Fabrication Processes
US$5,550.00
Date of Publication: Nov 23, 2016
The global market for atomic layer deposition and other ultrathin film fabrication processes was valued at $1.1 billion and $1.3 billion in 2014 and 2015, respectively. This market is expected to increase from $1.5 billion in 2016 to nearly $3.7 billion in 2021 at a compound annual growth rate (CAGR) of 19.1% for 2016-2021
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Thermal Management Technoligies
The Market for Thermal Management Technologies
US$5,550.00
Date of Publication: Mar 16, 2016

The global market for thermal management products will grow from about $10.7 billion in 2015 to nearly $11.2 billion in 2016 and $14.7 billion by 2021, representing a compound annual growth rate (CAGR) of 5.6% between 2016 and 2021. The scope of this report is broad, covering several product areas. The individual materials, hardware, and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected through 2021. The application sections feature forecasts for the most important applications by product.

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Global Markets, Technologies and Materials for Thin and Ultrathin Films
Global Markets, Technologies and Materials for Thin and Ultrathin Films
US$5,550.00
Date of Publication: Sep 28, 2016
The global market for thin film materials reached nearly $9.9 billion and $9.8 billion in 2014 and 2015, respectively. The market is expected to reach nearly $11.3 billion by 2021 increasing at a compound annual growth rate (CAGR) of 3.0% from 2016 to 2021. This report provides an updated review of thin film technologies, including materials and production processes, and identifies current and emerging applications for these technologies. 
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Flip-Chip Technologies and Global Markets
Flip-Chip Technologies and Global Markets
US$5,550.00
Date of Publication: Jul 20, 2016
This report provides: An overview of the global markets for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads; Analyses of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021. The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.
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Semiconductor Metallization and Interconnects: Technologies and Global Markets
Semiconductor Metallization and Interconnects: Technologies and Global Markets
US$5,550.00
Date of Publication: Jun 20, 2016
This report provides an overview of the global markets for semiconductor metallization, a process which produces a thin-film metal layer that will serve as the required conductor pattern for the interconnection of the various components on the chip. The global semiconductor metallization and interconnects market totaled $912.8 million and $1.0 billion in 2014 and 2015 respectively. The market should total nearly $1.8 billion by 2020, growing at a compound annual growth rate (CAGR) of 11.4% from 2015 to 2020.
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Capacitors Manufacturing Costs - 2016 Production of Capacitors
Capacitors: Costs To Produce: 2016
US$2,750.00
Date of Publication: Apr 19, 2016
This new report addresses the global cost of goods sold and industry wide operating profit for the worldwide capacitor industry by type, including ceramic, aluminum, tantalum and plastic film. The study addresses fixed and variable costs associated with the production of capacitors, with emphasis upon variable raw material costs, variable labor charges, variable overhead and manufacturing costs and the trend that is occurring with respect to both the cost of goods sold and the overall operating profit for capacitors over time.
Global Trends in SiP Technology Development
Global Trends in SiP Technology Development
US$1,600.00
Date of Publication: Feb 25, 2016
Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises. With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in the development of packaging technology. This report provides an in-depth analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.
Graphene: Technologies, Applications, and Markets
Graphene: Technologies, Applications and Markets
US$5,550.00
Date of Publication: Feb 10, 2016

Potential electronics applications of graphene include ultrasmall transistors, superdense data storage, touchscreens and wearable electronics. In the energy field, potential applications include ultracapacitors to store and transmit electrical power as well as highly efficient solar cells. Some researchers argue that the greatest potential for graphene lay in its ability to conduct light as well as electricity. They believe that graphene can improve the efficiency of light-emitting diodes (LEDs) and aid in the production of next-generation devices like flexible touchscreens, photodetectors and ultrafast lasers.

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Semiconductors: Global Market Outlook to 2022
Global Semiconductor Market Outlook 2022
US$1,500.00
Date of Publication: Jan 12, 2016
The report provides an in-depth analysis of the global semiconductor market on the basis of its segments. The market by segments is classified into integrated circuits, discrete semiconductors, optoelectronics and sensors. In addition, the report also covers a detailed analysis of the global semiconductor equipment market, which is further segmented into wafer processing, assembly & packaging, and testing equipment; and the global semiconductor materials market which has further segments, such as wafer fabrication and packaging.
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Electronic Chemicals and Materials: The Global Market
Electronic Chemicals and Materials: The Global Market
US$5,550.00
Date of Publication: Jan 12, 2016

This report provides an overview of the global markets for electronic chemicals and materials, covering the entire range of chemicals and materials that are used in the fabrication of ICs and PCBs. The global electronic chemicals and materials market was nearly $22.0 billion in 2014. The market is projected to grow at a compound annual growth rate (CAGR) of 5.9% from $22.9 billion in 2015 to $30.5 billion by 2020.

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Semiconductor Packaging & Testing Industry
Worldwide and Taiwanese Semiconductor Packaging & Testing Industry, 2015 and Beyond
US$2,000.00
Date of Publication: Jun 17, 2014
Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.
Wafer-Level Packaging: WLP Technologies and Global Markets
Wafer-Level Packaging: Technologies and Global Markets
US$5,550.00
Date of Publication: Sep 23, 2015
Global markets and technologies for wafer-level packaging. The report provides analyses of global market trends, with data from 2013, 2014, and projections of CAGRs through 2019. Coverage of technologies including: Flip-Chip, 3-D WLP, Conventional CSP, Wafer Level CSP, Compliant WLP, Nano WLP, and others. Information on integration techniques including Fan-out WLP, Fan-in WLP, TSV, IPD.


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High k and ALD/CVD Metal Precursors - A Semiconductor Materials Report
ALD/CVD High K and Metal Precursors For the Semiconductor IC Market
US$4,279.00
Date of Publication: Mar 25, 2015
The High K / ALD Precursors report provides information on the applications and markets associated with front end and back end of line precursors used to produce high dielectric constant (K) dielectrics and atomic layer deposition dielectrics and metals. Market size, growth, and market share statistics are provided.
A Strategic Forecast of the Semiconductor Industry
A Strategic Forecast of the Semiconductor Industry
US$10,000.00
Date of Publication: Jul 27, 2015
The semiconductor industry is undergoing an unprecedented number of changes. The electronic systems end market drivers are changing from personal computers to smart phones and tablets. Major consolidation is taking place in the industry particularly in memory. More and more companies are going to Fab lite and fabless companies are rising in importance.  Optical lithography has entered the multi-patterning era and EUV is late. 450mm is on the horizon. Planar transistors are transitioning to 3D FinFETs and FDSOI. New materials are being introduced at an increased pace. DRAM and NAND are facing fundamental barriers to scaling with new solutions needed.
Thermal Interface Materials: Technologies, Applications and Global Markets
Thermal Interface Materials: Technologies, Applications and Global Markets
US$5,550.00
Date of Publication: Jul 24, 2015

This report provides: An overview of the global market for thermal interface materials, which have experienced growing demand with the increased need for thermal management technologies. Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020. Identification of thermal interface materials (TIM) technologies and products with the greatest commercial potential in the near to mid-term, and of companies that are best positioned to meet this demand because of proprietary technologies, strategic alliances, or other advantages.  The global market for thermal interface materials reached $715.9 million in 2014. This market is forecasted to grow at a compound annual growth rate (CAGR) of 7.4% to reach nearly $1.1 billion in 2020.

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