Semiconductor Manufacturing

US$10,000.00
Date of Publication: Jul 27, 2015
The semiconductor industry is undergoing an unprecedented number of changes. The electronic systems end market drivers are changing from personal computers to smart phones and tablets. Major consolidation is taking place in the industry particularly in memory. More and more companies are going to Fab lite and fabless companies are rising in importance.  Optical lithography has entered the multi-patterning era and EUV is late. 450mm is on the horizon. Planar transistors are transitioning to 3D FinFETs and FDSOI. New materials are being introduced at an increased pace. DRAM and NAND are facing fundamental barriers to scaling with new solutions needed.

US$5,550.00
Date of Publication: Jul 24, 2015

This report provides: An overview of the global market for thermal interface materials, which have experienced growing demand with the increased need for thermal management technologies. Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020. Identification of thermal interface materials (TIM) technologies and products with the greatest commercial potential in the near to mid-term, and of companies that are best positioned to meet this demand because of proprietary technologies, strategic alliances, or other advantages.  The global market for thermal interface materials reached $715.9 million in 2014. This market is forecasted to grow at a compound annual growth rate (CAGR) of 7.4% to reach nearly $1.1 billion in 2020.


US$2,500.00
Date of Publication: Jul 24, 2015
New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also companies that specialize in silicon interposer layers.

US$2,300.00
Date of Publication: Jul 24, 2015
China Semiconductor Industry Report Covers: 1. Global Semiconductor Market and Industry; 2. China Semiconductor Market and Industry; 3. Eleven Chinese...

US$4,279.00
Date of Publication: Sep 2, 2014
Silicon wafer purchases represent the highest operating expense for many device manufacturers and as a result are a constant target for price reduction....

US$3,920.00
Date of Publication: Feb 3, 2015
Wafer Level Packaging (WLP) is one of the fastest, if not the fastest, growing segments of the semiconductor industry. This is driven by the mobile...

US$4,279.00
Date of Publication: Nov 20, 2014
This report provides business and technical information on sputter targets as used for semiconductor devices. Also included is information on supply chain...