Semiconductor Manufacturing

Date of Publication: Nov 20, 2014
The Silicon Components Report focuses on silicon used for and with semiconductor and LED process equipment. Parts revenues by OEM tool set and regional...

Date of Publication: Sep 22, 2014
This study encompasses PVD technologies and materials in terms of application, properties and processes. This research analyzes the major types of PVD...

Date of Publication: Sep 2, 2015
Global Semiconductor Industry Leading Indicator and Forecasts are produced in real time to provide a consistent with the global economic climate view for...

Date of Publication: May 7, 2014
This report provides a detailed analysis of the fab and manufacturing implications of 3D floating gate and charge trap NAND concepts from Samsung, Toshiba, SK Hynix and Intel-Micron versus 16nm 2D NAND.  The analysis is based on a bottoms-up process flow analysis for each 3D NAND technology and 16nm 2D NAND.  

Date of Publication: Mar 18, 2014
This report delves into the market segments that supply photoresist and associated chemistries used for developing and stripping photoresist.  This...

Date of Publication: Feb 26, 2014
System-in-package (SiP) is a combination of integrated circuits (ICs) enclosed in a single package or module. Additionally, passive components are mounted on the same substrate. SiP is not just an IC package with multiple dies; it comprises fully functional systems or subsystems in an IC package format. SiP, while being a packaging technique, differs substantially from other packaging technologies. The latter largely involve minimal complex design considerations, whereas for SiP, an effective subsystem or system, the interconnection and integration are substantially more complex. SiP brings tangible gains in space reduction. While system-on-chip (SoC) achieves the same objective more effectively, SoC design is more complex and time consuming than SiP. SiP’s simplicity has opened a wide array of uses for it in less than a decade since its inception. However, SiP also faces significant challenges in being able to assure form yield maximization.

Date of Publication: Jan 20, 2014
The NAND flash industry is at a technology inflection point.  Planar floating gate NAND flash memory is facing fundamental scaling challenges with the...