Microcontrollers (MCUs) used in Smart Cities, Smart Homes, Smart Industry, Smart Health, and Smart Transport (a subset of the Internet of Things (IoT)), represented just 10% of the overall MCU market in 2014. But in 2020, $10 billion in MCUs, representing 40% of the total market, will be used in these applications.
A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.
The Assembly and Test Cost and Price model covers wafer sorts, assembly of leadframe and organic substrates packages including EMIB, wafer level packaging and InFO and class test. The model is user customizable and we are continually adding new features.
The global market for thermal management products will grow from about $10.7 billion in 2015 to nearly $11.2 billion in 2016 and $14.7 billion by 2021, representing a compound annual growth rate (CAGR) of 5.6% between 2016 and 2021. The scope of this report is broad, covering several product areas. The individual materials, hardware, and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected through 2021. The application sections feature forecasts for the most important applications by product.
Potential electronics applications of graphene include ultrasmall transistors, superdense data storage, touchscreens and wearable electronics. In the energy field, potential applications include ultracapacitors to store and transmit electrical power as well as highly efficient solar cells. Some researchers argue that the greatest potential for graphene lay in its ability to conduct light as well as electricity. They believe that graphene can improve the efficiency of light-emitting diodes (LEDs) and aid in the production of next-generation devices like flexible touchscreens, photodetectors and ultrafast lasers.
This report provides an overview of the global markets for electronic chemicals and materials, covering the entire range of chemicals and materials that are used in the fabrication of ICs and PCBs. The global electronic chemicals and materials market was nearly $22.0 billion in 2014. The market is projected to grow at a compound annual growth rate (CAGR) of 5.9% from $22.9 billion in 2015 to $30.5 billion by 2020.
This report provides: An overview of the global market for thermal interface materials, which have experienced growing demand with the increased need for thermal management technologies. Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020. Identification of thermal interface materials (TIM) technologies and products with the greatest commercial potential in the near to mid-term, and of companies that are best positioned to meet this demand because of proprietary technologies, strategic alliances, or other advantages. The global market for thermal interface materials reached $715.9 million in 2014. This market is forecasted to grow at a compound annual growth rate (CAGR) of 7.4% to reach nearly $1.1 billion in 2020.
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