Semiconductor Manufacturing

US$4,650.00
Date of Publication: Mar 18, 2014
Super Junction MOSFET Market by FAB Technology (Multiple-Epitaxy, Deep-Trench), Packaging Technology Material (Substrate, Transition Layer, Electrode),...

US$4,250.00
Date of Publication: Mar 31, 2014



US$1,300.00
Date of Publication: Mar 10, 2014
The IC Knowledge - 300mm and 450mm watch database provides detailed coverage of all of the operating and announced 300mm and 450mm fabs in the world. Details around location, products, key dates, investment and output versus year are all provided. There are also a number of graphs summarizing and analyzing output, capacity and cost.

US$1,600.00
Date of Publication: Mar 7, 2014
Thanks to good sales of smart handheld devices, the global semiconductor industry grew 3.3% year-on-year in 2013. And with the global economy showing signs...

US$4,650.00
Date of Publication: Mar 5, 2014
The Sapphire Technology Market by growth technology is further sub-divided as sapphire substrate process, production method, and growth methods for sapphire. The sapphire substrate process consists of processes such as slicing, lapping, polishing, and CMP. The sapphire market by production method is further divided based on the types of the available production methods such as Chemical Vapor Deposition (CVD), Liquid Phase and Thermal Exfoliation, Hybrid Vapor Phase Epitaxy (HVPE), and other. The most important segment that is the sapphire growth method defines the various technologies used for sapphire growth such as Kyropoulos method, Czocharlski Crystal Pulling method, Heat Exchanger method (HEM), Edge Defined Film Fed Growth method (EFG), and others.

US$6,650.00
Date of Publication: Feb 26, 2014
System-in-package (SiP) is a combination of integrated circuits (ICs) enclosed in a single package or module. Additionally, passive components are mounted on the same substrate. SiP is not just an IC package with multiple dies; it comprises fully functional systems or subsystems in an IC package format. SiP, while being a packaging technique, differs substantially from other packaging technologies. The latter largely involve minimal complex design considerations, whereas for SiP, an effective subsystem or system, the interconnection and integration are substantially more complex. SiP brings tangible gains in space reduction. While system-on-chip (SoC) achieves the same objective more effectively, SoC design is more complex and time consuming than SiP. SiP’s simplicity has opened a wide array of uses for it in less than a decade since its inception. However, SiP also faces significant challenges in being able to assure form yield maximization.

US$3,495.00
Date of Publication: Dec 3, 2014

Fine chemicals needed most widely for future disruptive electronics and electrics: morphologies, form factors, derivatives: reasons, trends, niche opportunities: de-risk your investment. The chemistry of the new electronics and electrics is key to its future, whether it is invisible, tightly rollable, biodegradable, edible, employing the memristor logic of the human brain or possessing any other previously- impossible capability in a manufactured device. De-risking that material development is vital yet the information on which to base that has been unavailable.