Semiconductor Manufacturing

Date of Publication: Sep 4, 2017

The Graphene Report is a comprehensive analysis of the market and commercial opportunities for these remarkable materials. The graphene market continues to expand in 2017, with weekly announcements on new multi-million dollar investments, new products (especially in the Asia market) and innovative production processes.

Date of Publication: Jul 17, 2017
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.

Date of Publication: Jul 18, 2017
This report presents a market and technical forecast for ITO and replacements for LCD panels, plasma display panels (PDP), touch panels, e-paper, solar cells and organic electroluminescent (EL) panels.

Date of Publication: Jul 18, 2017
The use of nanoparticles is set to escalate and the market has the potential to increase dramatically over the next ten years as more uses for these materials are developed and commercialized. Eventually, nanomaterials are likely to affect nearly every industry in every region in the world, including the least developed regions. In fact, there is considerable optimism that nanomaterials will be instrumental in addressing some of the developing world’s most pressing concerns. This report presents a forecast of nanomaterials by type and by application.

Date of Publication: Jan 24, 2017
According to this new report, the total market for printed, flexible and organic electronics will grow from $29.28 billion in 2017 to $73.43 billion in 2027. The majority of that is OLEDs (organic but not printed) and conductive ink used for a wide range of applications. On the other hand, stretchable electronics, logic and memory, thin film sensors are much smaller segments but with huge growth potential as they emerge from R&D.

Date of Publication: Jun 5, 2017
This report analyzes the worldwide markets for System-in-Package (SiP) Technology in US$ Million. The Global market is further analyzed by: Interconnection Technology - Wire Bonding, and Flip-Chip; and End-Use Sector - Consumer Electronics, Communications, Aerospace & Defense, Automotive, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

Date of Publication: May 3, 2017
In a balanced appraisal, "Supercapacitor Materials 2017-2027" how, in many of the last 20 years they have improved their power density and energy density faster than lithium-ion batteries have done thanks to better hierarchical active electrodes and sometimes exohedral ones plus new electrolytes and so on. However, with its primary focus on the present and future, it shows how new pairings of active electrode and electrolyte materials are now key. Markets of billions of dollars remained elusive, however, due to high price caused by complex processing of basically low-cost materials and limited energy density even after all that improvement.