Semiconductor Manufacturing

US$2,300.00
Date of Publication: Apr 9, 2019
The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices.

US$1,400.00
Date of Publication: Jun 24, 2019

The Assembly and Test Cost and Price model covers wafer sorts, assembly of leadframe and organic substrates packages including EMIB, wafer level packaging and InFO and class test. The model is user customizable and we are continually adding new features.


US$2,400.00
Date of Publication: May 28, 2019

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.


US$1,995.00
Date of Publication: May 28, 2019
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.

US$2,495.00
Date of Publication: Jan 14, 2019

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.


US$800.00
Date of Publication: Sep 27, 2018
The report finds that the Taiwanese semiconductor manufacturing industry comprising mainly of foundry, DRAM, flash memory, and IDM sectors grew both year-on-year and sequentially in the second quarter of 2018.

US$1,500.00
Date of Publication: Sep 10, 2018
The global wafer foundry industry is highly concentrated with the top-five players taking up about 76% of the total shipments. The increasing share of orders released by IDMs and the proliferation of emerging application ICs such as CPUs, GPUs, FPGAs, and ASICs have been major growth factors to drive the industry's growth over the years.

US$3,200.00
Date of Publication: Aug 22, 2018
Miniaturization of electronic products conduces to components of all sorts being smaller and smaller and spurs the growing demand for automated inspection equipment. In the wake of a transfer of electronic components production capacity to China, the AOI equipment has been developing by leaps and bounds over the past several years.

US$1,600.00
Date of Publication: Nov 7, 2018
As demand for high-performance computing continues into 2018, the worldwide and Taiwanese IC design industries are expected to grow. This report reviews the performance of the worldwide and Taiwanese IC design industries in 2017 and examines their developments in 2018 and onwards.

US$5,500.00
Date of Publication: Nov 6, 2018
This research report categorizes the semiconductor machinery manufacturing by type. Product types include wafer processing equipment, assembly, packaging equipment, and other front-end equipment. The global market for semiconductor machinery manufacturing should grow from $57.8 billion in 2018 to $114.4 billion by 2023, with a compound annual growth rate (CAGR) of 14.6% from 2018 to 2023.

US$1,000.00
Date of Publication: Sep 25, 2018
The report finds that the Taiwanese fabless IC industry's shipment value witnessed double-digit growth on sequential and year-on-year basis in the second quarter of 2018. Shipment value of the industry has continued the growth momentum in the third quarter of 2018.

US$89.00
Date of Publication: Aug 1, 2013
This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products. The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow.

US$2,495.00
Date of Publication: Jul 5, 2019
This report discusses the current strategies of Applied Materials as it competes for world dominance. Strategies of its principal competitors are also analyzed. Markets are analyzed and projected, and market shares for Applied Materials and its competitors are detailed.

US$5,500.00
Date of Publication: Aug 18, 2017
This report addresses the global market for thermal management products for microchips during the forecast period through 2022. The global market for thermal management products should reach $6.3 billion by 2022 from $4.7 billion in 2017 at a compound annual growth rate (CAGR) of 6.0%, from 2017 to 2022.

US$1,300.00
Date of Publication: Nov 24, 2017
The IC Knowledge - 300mm watch database provides detailed coverage of all of the operating and announced 300mm fabs in the world. Details around location, products, key dates, investment and output versus year are all provided. There are also a number of graphs summarizing and analyzing output, capacity and cost out through 2025.

US$2,100.00
Date of Publication: Mar 30, 2017
China is the largest producer and exporter of silicon carbide in the world, with the capacity reaching 2.2 million tons, sweeping more than 80% of the global total. However, excessive capacity expansion and oversupply lead to the capacity utilization less than 50%. In 2015, the silicon carbide output in China totaled 1.02 million tons, with the capacity utilization rate of only 46.4%; in 2016, the total output was estimated to be about 1.05 million tons, with the capacity utilization rate of 47.7%.