Semiconductor Manufacturing

US$1,300.00
Date of Publication: Nov 24, 2017
The IC Knowledge - 300mm watch database provides detailed coverage of all of the operating and announced 300mm fabs in the world. Details around location, products, key dates, investment and output versus year are all provided. There are also a number of graphs summarizing and analyzing output, capacity and cost out through 2025.

US$5,550.00
Date of Publication: Mar 13, 2017
The global market for sputtered films and sputtering targets should reach over $3.2 billion by 2021 from nearly $2.9 billion in 2016 at a compound annual growth rate (CAGR) of 2.2%, from 2016 to 2021. Details of the global market analysis are covered. For each major application group or industry sector (specifically electronics, optoelectronics, mechanical/chemical, energy, optical coatings and life sciences and others), this research provides information on production of sputtered films, consumption of sputtering targets and target revenues by material and region.

US$5,550.00
Date of Publication: Jan 23, 2017
The report addresses the global market for new electronic materials during the period from 2016 through 2026. The report quantifies new electronic materials produced for use in the production of electronic materials (transistors, semiconductors, displays, etc). The global market for advanced electronic materials totaled nearly $4.9 billion in 2016. This market should total $10.3 billion in 2021 and $24.1 billion by 2026 at a five-year compound annual growth rate (CAGR) of 18.5%, for the period of 2021-2026.

US$5,550.00
Date of Publication: Nov 23, 2016
The global market for atomic layer deposition and other ultrathin film fabrication processes was valued at $1.1 billion and $1.3 billion in 2014 and 2015, respectively. This market is expected to increase from $1.5 billion in 2016 to nearly $3.7 billion in 2021 at a compound annual growth rate (CAGR) of 19.1% for 2016-2021

US$5,550.00
Date of Publication: Mar 16, 2016

The global market for thermal management products will grow from about $10.7 billion in 2015 to nearly $11.2 billion in 2016 and $14.7 billion by 2021, representing a compound annual growth rate (CAGR) of 5.6% between 2016 and 2021. The scope of this report is broad, covering several product areas. The individual materials, hardware, and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected through 2021. The application sections feature forecasts for the most important applications by product.


US$5,550.00
Date of Publication: Sep 28, 2016
The global market for thin film materials reached nearly $9.9 billion and $9.8 billion in 2014 and 2015, respectively. The market is expected to reach nearly $11.3 billion by 2021 increasing at a compound annual growth rate (CAGR) of 3.0% from 2016 to 2021. This report provides an updated review of thin film technologies, including materials and production processes, and identifies current and emerging applications for these technologies. 

US$5,550.00
Date of Publication: Jul 20, 2016
This report provides: An overview of the global markets for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads; Analyses of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021. The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.

US$5,550.00
Date of Publication: Jun 20, 2016
This report provides an overview of the global markets for semiconductor metallization, a process which produces a thin-film metal layer that will serve as the required conductor pattern for the interconnection of the various components on the chip. The global semiconductor metallization and interconnects market totaled $912.8 million and $1.0 billion in 2014 and 2015 respectively. The market should total nearly $1.8 billion by 2020, growing at a compound annual growth rate (CAGR) of 11.4% from 2015 to 2020.

US$2,750.00
Date of Publication: Apr 19, 2016
This new report addresses the global cost of goods sold and industry wide operating profit for the worldwide capacitor industry by type, including ceramic, aluminum, tantalum and plastic film. The study addresses fixed and variable costs associated with the production of capacitors, with emphasis upon variable raw material costs, variable labor charges, variable overhead and manufacturing costs and the trend that is occurring with respect to both the cost of goods sold and the overall operating profit for capacitors over time.

US$2,750.00
Date of Publication: Feb 10, 2016

Potential electronics applications of graphene include ultrasmall transistors, superdense data storage, touchscreens and wearable electronics. In the energy field, potential applications include ultracapacitors to store and transmit electrical power as well as highly efficient solar cells. Some researchers argue that the greatest potential for graphene lay in its ability to conduct light as well as electricity. They believe that graphene can improve the efficiency of light-emitting diodes (LEDs) and aid in the production of next-generation devices like flexible touchscreens, photodetectors and ultrafast lasers.


US$1,500.00
Date of Publication: Jan 12, 2016
The report provides an in-depth analysis of the global semiconductor market on the basis of its segments. The market by segments is classified into integrated circuits, discrete semiconductors, optoelectronics and sensors. In addition, the report also covers a detailed analysis of the global semiconductor equipment market, which is further segmented into wafer processing, assembly & packaging, and testing equipment; and the global semiconductor materials market which has further segments, such as wafer fabrication and packaging.

US$5,550.00
Date of Publication: Jan 12, 2016

This report provides an overview of the global markets for electronic chemicals and materials, covering the entire range of chemicals and materials that are used in the fabrication of ICs and PCBs. The global electronic chemicals and materials market was nearly $22.0 billion in 2014. The market is projected to grow at a compound annual growth rate (CAGR) of 5.9% from $22.9 billion in 2015 to $30.5 billion by 2020.


US$2,000.00
Date of Publication: Jun 17, 2014
Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.

US$5,550.00
Date of Publication: Sep 23, 2015
Global markets and technologies for wafer-level packaging. The report provides analyses of global market trends, with data from 2013, 2014, and projections of CAGRs through 2019. Coverage of technologies including: Flip-Chip, 3-D WLP, Conventional CSP, Wafer Level CSP, Compliant WLP, Nano WLP, and others. Information on integration techniques including Fan-out WLP, Fan-in WLP, TSV, IPD.



US$4,279.00
Date of Publication: Mar 25, 2015
The High K / ALD Precursors report provides information on the applications and markets associated with front end and back end of line precursors used to produce high dielectric constant (K) dielectrics and atomic layer deposition dielectrics and metals. Market size, growth, and market share statistics are provided.

US$10,000.00
Date of Publication: Jul 27, 2015
The semiconductor industry is undergoing an unprecedented number of changes. The electronic systems end market drivers are changing from personal computers to smart phones and tablets. Major consolidation is taking place in the industry particularly in memory. More and more companies are going to Fab lite and fabless companies are rising in importance.  Optical lithography has entered the multi-patterning era and EUV is late. 450mm is on the horizon. Planar transistors are transitioning to 3D FinFETs and FDSOI. New materials are being introduced at an increased pace. DRAM and NAND are facing fundamental barriers to scaling with new solutions needed.