Semiconductor Manufacturing

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CMP Technology: Competition, Products, Markets
CMP Technology: Competition, Products, Markets
US$2,495.00
Date of Publication: Jun 1, 2016
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.
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Applied Materials: Competing for World Dominance
Applied Materials: Competing for World Dominance
US$2,495.00
Date of Publication: Jun 1, 2016
Applied Materials has achieved a dominant position in the semiconductor equipment market by focusing on a global presence, a broad and expanding product line, and exacting customer support -- a strategy initiated in the mid-80s. In the '90s, most of its competitors had recognized that to be competitive with Applied Materials, they too must duplicate these tactics. This report discusses the current strategies of Applied Materials as it competes for world dominance. Strategies of its principal competitors are also analyzed. Markets are analyzed and projected, and market shares for Applied Materials and its competitors are detailed.
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Thin Film Deposition: Trends, Key Issues, Market Analysis
Thin Film Deposition: Trends, Key Issues, Market Analysis
US$2,495.00
Date of Publication: Jun 1, 2016
This report compares some of the issues impacting users of different deposition tools, including: APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD, ALD. Market forecasts and market shares of vendors is presented.
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Convergence of Semiconductors and Smart Technology Market Analysis
Convergence of Semiconductors and Smart Technology - Market Analysis
US$2,495.00
Date of Publication: Jun 1, 2016

Microcontrollers (MCUs) used in Smart Cities, Smart Homes, Smart Industry, Smart Health, and Smart Transport (a subset of the Internet of Things (IoT)), represented just 10% of the overall MCU market in 2014. But in 2020, $10 billion in MCUs, representing 40% of the total market, will be used in these applications.

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Crystal & Oscillator Report & Analysis
CY2015-16 Crystal and Oscillator Report & Analysis
US$3,850.00
Date of Publication: May 25, 2016
Rising complexity and costs for developing and manufacturing IC devices has led to major consolidation of device makers and semiconductor equipment and material suppliers. In Semi Timing, like all semiconductors consolidation via MnA has changed the industry supply chain significantly and raises the stakes for those making the “silicon magic” that is enabling our digital world. The availability of digital devices, the ubiquitous tablets and smart phones, and the exciting possibilities of the Internet of Things (IoT) are forecast to increase growth in ICs again in 2015-16. C
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Capacitors Manufacturing Costs - 2016 Production of Capacitors
Capacitors: Costs To Produce: 2016
US$2,750.00
Date of Publication: Apr 19, 2016
This new report addresses the global cost of goods sold and industry wide operating profit for the worldwide capacitor industry by type, including ceramic, aluminum, tantalum and plastic film. The study addresses fixed and variable costs associated with the production of capacitors, with emphasis upon variable raw material costs, variable labor charges, variable overhead and manufacturing costs and the trend that is occurring with respect to both the cost of goods sold and the overall operating profit for capacitors over time.
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Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts
Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts
US$4,995.00
Date of Publication: Apr 14, 2016

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.

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