Semiconductor Manufacturing

US$1,800.00
Date of Publication: Jan 29, 2016
China is the largest producer and exporter of silicon carbide in the world, with the capacity reaching 2.2 million tons, accounting for more than 80% of the global total. In 2014, the total silicon carbide output in China approximated 1.03 million tons, including 670,000 tons of black silicon carbide and 360,000 tons of green silicon carbide, with a very low capacity utilization rate. It is projected that the total output in 2015 would reach 1.2 million tons.

US$5,475.00
Date of Publication: Nov 16, 2015
This report provides the most comprehensive view of the topic, giving detailed ten year forecasts by device type. The market is analyzed by territory, printed vs non printed, rigid vs flexible, inorganic vs organic, cost of materials vs process cost and much more. Activities of over 1,000 leading companies are given, as is assessment of the winners and losers to come.

US$1,500.00
Date of Publication: Jan 12, 2016
The report provides an in-depth analysis of the global semiconductor market on the basis of its segments. The market by segments is classified into integrated circuits, discrete semiconductors, optoelectronics and sensors. In addition, the report also covers a detailed analysis of the global semiconductor equipment market, which is further segmented into wafer processing, assembly & packaging, and testing equipment; and the global semiconductor materials market which has further segments, such as wafer fabrication and packaging.

US$2,500.00
Date of Publication: Jan 5, 2016
This report provides an in-depth analysis of Taiwanese semiconductor industry in three areas: fabless IC design, wafer foundry and IC packaging and testing; provides a competitive analysis of semiconductor industry in Korea and Taiwan and examines their future outlook.

US$950.00
Date of Publication: Jan 7, 2016
This research review includes portions of several market research reports that were published in 2015, and are an efficient way for market professionals to keep up with the general market developments of 2015.

US$1,900.00
Date of Publication: Oct 28, 2015
The MEMS Cost and Price Model is designed to easily calculate the manufacturing cost and selling price of most MEMS products. The model supports up to two MEMS die and up to two IC die in the same package with packaging and test costs. The model forward forecasts out to 2020. 100mm to 200mm wafer sizes are supported. Wafer fabrication, test and packaging costs are all covered. The price includes twelve months of upgrades with phone and email support.

US$6,650.00
Date of Publication: May 16, 2016
The report provides ocused discussion of the thin film materials market for the six main sectors in which thin films are typically applied (specifically: electronics, optoelectronics, mechanical/chemical, energy,  optical coatings and life sciences and others).  In these optional sections, additional details by sector on current market conditions and key trends and developments are provided, in addition to market growth projections for each sector. It covers global industry structure, the report offers a list of the leading manufacturers of thin film materials, together with a description of their products.  The analysis includes a description of the geographical distribution of these suppliers and an evaluation of thin film material production versus consumption, always from a geographical standpoint.