Semiconductor Packaging & Testing Industry

Worldwide and Taiwanese Semiconductor Packaging & Testing Industry, 2015 and Beyond

MIC Taiwan, Date of Publication: Jun 17, 2014
US$2,000.00
MIC4520

Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.

LIST OF TOPICS

  • Overview of the major trends in the worldwide and Taiwanese IC packaging and testing industries, including major vendors' rankings by revenue in 2014 and market share by region from 2012 to 2015. Also provided are shipment value forecasts of the worldwide and Taiwanese IC packaging and testing industries from 2015 to 2017
  • Highlights of the industry's future development, touching on vendors' capacity expansion activities from 2013 to present, growing demand for SiP technology due to wearable devices and IoT, and development of high-end heterogeneous packaging technologies


TABLE OF CONTENTS

1. Trends in Worldwide and Taiwanese IC Packaging and Testing Industries
1.1 China's Market Share Sees Fastest Growth
1.2 Uncertain Market Growth for 2015
2. Future of Worldwide and Taiwanese IC Packaging and Testing Industries
2.1 Aggressive Expansion
2.2 SiP to Become Key Technology
2.3 Influence of IC Foundries' Development of High-end Heterogeneous Packaging Technologies
Conclusion
Industry's Optimism about the Future on the Wane
Enhancement in Technology and Production Capacity as Key to Stay Ahead
Appendix
Glossary of Terms
List of Companies

LIST OF FIGURES

Figure 1: Worldwide Top 10 IC Packaging and Testing Vendors by Revenue, 2014
Figure 2: Worldwide IC Packaging and Testing Market Share by Region, 2012 - 2015
Figure 3: Worldwide and Taiwanese IC Packaging and Testing Industry Shipment Value, 2014 - 2017
Figure 4: Evolution of End-User Devices and Packaging Technologies
Figure 5: Leading IC Foundries' High-end Heterogeneous Packaging Technologies

LIST OF TABLES

Table 1: Worldwide and Taiwanese IC Packaging and Testing Vendor's Capacity Expansion, 2013 - 2015

COMPANIES COVERED

Amkor Technology, ASE, ASE Embedded Electronics Inc., Chipbond Technology, ChipMOS, FCI, Greatek Electronic, JCET, J-Device, Micron, Nepes, OCZ, Panasonic, Promos, PTI, Renesas, Samsung, SK Hynix, SMIC, SPIL, STATS ChipPAC, TDK, Tianshui Huatian Technology, Toshiba, TSMC, UTAC, Wuxi Tongzhi Microelectronics, Xilinx.

 

Date of Publication:
Jun 17, 2014
File Format:
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