Semiconductor Technology and Markets

US$2,495.00
Date of Publication: Oct 18, 2017
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

US$2,495.00
Date of Publication: Oct 18, 2017

Microcontrollers (MCUs) used in Smart Cities, Smart Homes, Smart Industry, Smart Health, and Smart Transport (a subset of the Internet of Things (IoT)), represented just 10% of the overall MCU market in 2014. But in 2020, $10 billion in MCUs, representing 40% of the total market, will be used in these applications.


US$4,950.00
Date of Publication: Jun 5, 2017
This report analyzes the worldwide markets for System-in-Package (SiP) Technology in US$ Million. The Global market is further analyzed by: Interconnection Technology - Wire Bonding, and Flip-Chip; and End-Use Sector - Consumer Electronics, Communications, Aerospace & Defense, Automotive, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

US$2,495.00
Date of Publication: Jul 18, 2017
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.

US$2,495.00
Date of Publication: Jul 18, 2017
The continued improvements in lithography have been the driving force that has upheld Moore's Law. Shorter wavelengths, better lenses, and adaptive optics have all contributed to this success story, which has allowed commercial chips to be fabricated with 14nm feature sizes. This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are. The worldwide lithography markets are analyzed and projected by type (EUV, DUV, and optical), and market shares by vendor for each type.

US$2,495.00
Date of Publication: Jul 18, 2017
This report addresses the strategic issues impacting the mask making, inspection, and repair sectors of the semiconductor industry in the U.S. and the world. The mask market is segmented by geographic region. The mask equipment markets are analyzed and projected and market shares presented.

US$2,495.00
Date of Publication: Jul 18, 2017
Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today. WLP offers lower cost, a smaller package, higher performance and added functionality compared to older methods. In the world of high-speed/high-performance IC and package design, flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computing. This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.