Semiconductor Technology and Markets

US$5,550.00
Date of Publication: Jun 20, 2019
The global market for thin-layer deposition technologies should grow from $32.1 billion in 2017 to $60.7 billion by 2022 at a compound annual growth rate (CAGR) of 13.6% for the period of 2017-2022.

US$2,495.00
Date of Publication: Feb 18, 2019

This report analyzes the wearable industry and markets for the two wearable camps described above. Forecasts are also presented for semiconductor content and markets for MEMs devices, sensors, CPUs and low-power MPUs, GPS, and connectivity chips.


US$2,495.00
Date of Publication: Feb 4, 2019
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.

US$2,495.00
Date of Publication: Feb 4, 2019
The primary objective of this report is to review the current issues dealing with lithography as applied to the manufacture of VLSI devices.

US$2,495.00
Date of Publication: Feb 4, 2019
This report addresses the strategic issues impacting the mask making, inspection, and repair sectors of the semiconductor industry in the U.S. and the world. The mask market is segmented by geographic region. The mask equipment markets are analyzed and projected and market shares presented.

US$2,495.00
Date of Publication: Feb 4, 2019
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

US$2,495.00
Date of Publication: Feb 4, 2019
This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.