Semiconductor Technology and Markets

US$2,495.00
Date of Publication: Jun 1, 2016
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

US$2,495.00
Date of Publication: Jun 1, 2016
Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today. WLP offers lower cost, a smaller package, higher performance and added functionality compared to older methods. In the world of high-speed/high-performance IC and package design, flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computing. This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.

US$2,495.00
Date of Publication: Jun 1, 2016
The future needs in plasma etching will be for ever tighter control of process variability, higher selectivity and less damage. This report addresses the strategic issues impacting both the user and supplier of plasma etching equipment to the semiconductor industry. Markets for dry etching and stripping are analyzed and projected. Dry etching systems are further segmented by application. Market shares of vendors in each sector are presented.

US$2,495.00
Date of Publication: Jun 1, 2016
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.

US$2,495.00
Date of Publication: Jun 1, 2016

Microcontrollers (MCUs) used in Smart Cities, Smart Homes, Smart Industry, Smart Health, and Smart Transport (a subset of the Internet of Things (IoT)), represented just 10% of the overall MCU market in 2014. But in 2020, $10 billion in MCUs, representing 40% of the total market, will be used in these applications.


US$1,600.00
Date of Publication: Feb 25, 2016
Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises. With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in the development of packaging technology. This report provides an in-depth analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.

US$5,475.00
Date of Publication: Jul 22, 2015
Thermal Interface Materials Industry Status, Market Opportunities and Forecasts This report covers the ten types of materials available to improve heat...