Semiconductor Technology and Markets

Date of Publication: Jan 29, 2015
Dramatic changes are underway in the computer, telecommunications and consumer electronics industries. There is a trend toward systems “convergence,” combining computer, telecommunications and consumer system functions all into one system. There is also a trend toward micro-miniaturization and microsystem technologies integrating digital, optical, radio frequency and microelectromechanical systems (MEMS) devices. Microsystem packaging is at the heart of all of these products, since it is this technology that provides the system integration in addition to controlling the size, performance, reliability and cost of the final microsystem.

Date of Publication: Sep 23, 2015
Global markets and technologies for wafer-level packaging. The report provides analyses of global market trends, with data from 2013, 2014, and projections of CAGRs through 2019. Coverage of technologies including: Flip-Chip, 3-D WLP, Conventional CSP, Wafer Level CSP, Compliant WLP, Nano WLP, and others. Information on integration techniques including Fan-out WLP, Fan-in WLP, TSV, IPD.

Date of Publication: Aug 18, 2015
Ultraviolet (UV) LEDs represents LED based UV light sources capable of producing ultraviolet radiation that can be used for various purposes, with curing representing the largest application. Superior attributes of UV-LED that are driving its widespread adoption include enabling thinner heat-sensitive substrates; low energy consuming lamps and curing; offering long lifetime/downtime benefits; easy on/off switching capability; savings in terms of operating costs as well as capital costs; consistent UV output; health and safety benefits; ozone free and hazardous materials free environmental benefits; compact and flexible design benefits; and minimal heat production. UV LED technology continues to exhibit strong growth driven by its steady penetration in the booming UV curing market supported by its superiority over legacy technologies such as mercury lamps. Robust demand for LED-powered UV curing in ink, adhesives and coating industries, in addition to newer applications such as disinfection and purification are primary growth drivers in the market. The growing regulatory pressure across the world on restricting products containing mercury is also expected to bode well for the UV LED technology.

Date of Publication: Jul 24, 2015

This report provides: An overview of the global market for thermal interface materials, which have experienced growing demand with the increased need for thermal management technologies. Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020. Identification of thermal interface materials (TIM) technologies and products with the greatest commercial potential in the near to mid-term, and of companies that are best positioned to meet this demand because of proprietary technologies, strategic alliances, or other advantages.  The global market for thermal interface materials reached $715.9 million in 2014. This market is forecasted to grow at a compound annual growth rate (CAGR) of 7.4% to reach nearly $1.1 billion in 2020.

Date of Publication: Jul 24, 2015
New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also companies that specialize in silicon interposer layers.

Date of Publication: Apr 27, 2015

Date of Publication: Feb 11, 2015
RF Components & Subsystems Technology Roadmap The 2015 Roadmap was developed by five Product Emulator Groups (PEGs) and 19 Technology Working...