Semiconductor Technology and Markets

US$6,650.00
Date of Publication: May 6, 2014
In recent years, the semiconductor industry has experienced a relatively positive and steady growth, primarily fueled by the demand for semiconductors,...

US$950.00
Date of Publication: Apr 1, 2014
GaAs finds extensive application in fiber optic drivers and receivers, infrared LEDs and LASERs, highly efficient solar cells, optical windows, and...

US$950.00
Date of Publication: Apr 1, 2014
IC substrates, also referred to as IC carriers, are extremely miniaturized circuits used as packaging for ICs, assembled into electronic devices such as...

US$4,650.00
Date of Publication: Mar 26, 2014
Semiconductor (Silicon) IP Market by Form Factor (Integrated Circuit IP, SOC IP), Design Architecture (Hard IP, Soft IP), Processor Type (Microprocessor,...

US$950.00
Date of Publication: Mar 25, 2014
The report projects that 3D Transistors is set to become the norm as a 3D transistor is an advanced transistor that is manufactured by using nano wires in...

US$4,650.00
Date of Publication: Mar 18, 2014
Super Junction MOSFET Market by FAB Technology (Multiple-Epitaxy, Deep-Trench), Packaging Technology Material (Substrate, Transition Layer, Electrode),...

US$6,650.00
Date of Publication: Feb 26, 2014
System-in-package (SiP) is a combination of integrated circuits (ICs) enclosed in a single package or module. Additionally, passive components are mounted on the same substrate. SiP is not just an IC package with multiple dies; it comprises fully functional systems or subsystems in an IC package format. SiP, while being a packaging technique, differs substantially from other packaging technologies. The latter largely involve minimal complex design considerations, whereas for SiP, an effective subsystem or system, the interconnection and integration are substantially more complex. SiP brings tangible gains in space reduction. While system-on-chip (SoC) achieves the same objective more effectively, SoC design is more complex and time consuming than SiP. SiP’s simplicity has opened a wide array of uses for it in less than a decade since its inception. However, SiP also faces significant challenges in being able to assure form yield maximization.