Semiconductors and Integrated Circuits

Date of Publication: Nov 21, 2016
This report analyzes the current status of the wearable market and the development of the IC industry for wearable electronics, leading wearable device vendors, and Taiwan's IC industry.

Date of Publication: Mar 16, 2016

The global market for thermal management products will grow from about $10.7 billion in 2015 to nearly $11.2 billion in 2016 and $14.7 billion by 2021, representing a compound annual growth rate (CAGR) of 5.6% between 2016 and 2021. The scope of this report is broad, covering several product areas. The individual materials, hardware, and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected through 2021. The application sections feature forecasts for the most important applications by product.

Date of Publication: Oct 14, 2016
This report analyzes the worldwide markets for Digital Power Management ICs in US$ Thousand by the following Application Types: Consumer Electronics, Data Communications, Computer Networks & Telecommunications, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

Date of Publication: Oct 5, 2016
The biggest enabler of the mobile data increase and the most important driver of the GaAs RF IC market is the handset segment. Much of the content of a handset is silicon-based, but power amplifiers (PAs) and switches in the front-end of the phone use GaAs devices. This report investigates the technology trends, applications, and market developments of GaAs ICs. U.S., Japanese, and European applications such as telecom, computers, defense, consumers, are reviewed. This report will provide the reader with an in-depth understanding of the technological and market factors determining the evolution of GaAs ICs.

Date of Publication: Sep 14, 2016

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The 2016 revision 00 adds 10nm processes and includes a number of other improvements and updates.

Date of Publication: Aug 15, 2016
This research report presents shipment value forecast and recent quarter review of the Taiwanese fabless IC industry. The report includes the analysis of fabless IC shipment value, product mix, and application mix. The content of this report is based on primary data obtained through interviews with Taiwanese fabless IC design houses and publicly available information such as corporate financial statements. 

Date of Publication: Jun 14, 2016
This IDC update and the accompanying Excel file provide the CY 1Q16 vendor share results and the forecasts for both the short-term (1Q16–4Q17) and the long-term (2016–2020) worldwide DRAM market. Companies Covered: Samsung, SK Holdings, Winbond Electronics Corporation, Powerchip Technology Corporation, Micron Technology, Inc., Nanya Technology Corporation.