Semiconductors and Integrated Circuits

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US$6,600.00
Date of Publication: Jul 31, 2015

The report is an in-depth study prepared by people who have a deep involvement with the electronic component industry. Each country report is written by locals who have detailed knowledge of the electronic component distribution industry. These reports analyse the market split into semiconductors, passives and electromechanical components and component assemblies. The 2015 report contains details of the overall European and International component distribution scene, with profiles of major pan-European groups: Acal, Arrow, Avnet, Electrocomponents, Future, Farnell, Mouser, MSC, Rutronik and TTI. The 1000 plus page Report, contains the following information for Austria, Benelux, Czech Republic, Denmark, Finland, France, Germany, Hungary, Iberia, Italy, Norway, Poland, Russia, Sweden, Switzerland and UK.


US$10,000.00
Date of Publication: Jul 27, 2015
The semiconductor industry is undergoing an unprecedented number of changes. The electronic systems end market drivers are changing from personal computers to smart phones and tablets. Major consolidation is taking place in the industry particularly in memory. More and more companies are going to Fab lite and fabless companies are rising in importance.  Optical lithography has entered the multi-patterning era and EUV is late. 450mm is on the horizon. Planar transistors are transitioning to 3D FinFETs and FDSOI. New materials are being introduced at an increased pace. DRAM and NAND are facing fundamental barriers to scaling with new solutions needed.

US$2,495.00
Date of Publication: Aug 1, 2015
The high price of oil in the past few years has been a catalyst for development in other alternative energy sources. Semiconductor technology surrounding the alternative energy markets includes advanced IGBT design, optoelectronics, advanced power conversion ICs, digital signal processing, MCUs, and advanced mixed signal and analog circuits. This report discussed the potential for these products to be the next killer green application.

US$4,950.00
Date of Publication: Jun 16, 2015
This report analyzes the worldwide markets for Electronic Components in US$ Million by the following Product Segments: Resistors (Semi-Fixed Variable, Carbon Variable, Other Variable, Carbon Film Fixed, Metal Film Fixed, Metal Oxide Film Fixed, Wire Wound Fixed, Network Resistors, Chip Resistors, & Other Fixed), Capacitors (Variable, Aluminum Electrolytic Fix, Tantalum Electrolytic Fixed, Ceramic Fixed, Organic Film Fixed, Metallized Organic Film & Other Fixed), Transformers (RFTS & IFTS, Audio Frequency, Power, High Frequency Power, High Voltage, Flyback, Deflection Yokes, & Other), Resonators, Connectors (PCB Connectors, Rectangular I/O Connectors, Circular Connectors, RF Coaxial Connectors, & Other Connectors), Relays (Electromechanical Relays (EMRs), & Solid State Relays (SSRs)), Switches (Toggle, Slide, Rotary, Keyboard, & Other Switches), and Printed Wiring Boards (Single Sided Rigid, Double Sided Rigid, Multilayer Rigid, & Flexible). The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World.

US$3,500.00
Date of Publication: Jun 21, 2015
2015 Consumer Semiconductor Market Analysis.  Updated Quarterly. The consumer market for semiconductors is expected to reach $61.1 billion in...

US$3,475.00
Date of Publication: Jun 21, 2015
2015 Digital Devices Market 2015. Updated Quarterly. The digital integrated circuit market consists of memory, processors and logic. These products by...

US$2,150.00
Date of Publication: Jun 21, 2015

 
The IC Knowledge - IC Cost and Price Model is the industry standard for cost and price modeling of low power silicon integrated circuits. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.