Smart Houses ICT, Marketing and Technical Analysis

PracTel, Date of Publication: Sep 12, 2013, 218 Pages
US$3,900.00
PT2876

This report is important to a wide population of researches, technical and sales staff involved in the developing of the Smart Houses. It is recommended for both service providers and vendors that are working with related technologies. The report also helps to understand issues associated with relationship between “green” Smart Houses ICT and other technologies.

This report continues the project on the Smart Grid development and evolution. In particular, it is detailing technological and marketing characteristics and applications for wireline and wireless ICT (Information and Communications Technologies) in the Smart Houses environments.

With each year, Smart Houses communications technologies are becoming more and more affordable and efficient on the industry-wide scale for multiple applications; though the concept was originated in the 80th of the last Century. The importance of Smart Houses proliferation is now tied up with the Smart Grid deployments, and Smart Houses communications networks will eventually be a part of a large country-wide project, such as centralized and intelligent automation system, which integrates utilities and consumers.

As per the report discussion, within the home, multiple technologies target the transport layer of the home-area network in order to carry out home automation. These include wireless technologies such as ZigBee, Z-wave, Bluetooth, and DECT and other; as well as wireline technologies such as power-line transport (e.g., HomePlug) and coax/wire-based (e.g., MoCA, HPNA) technologies. The fact that so many wireline and wireless technologies are targeting home automation indicates that this market is just scratching the surface in terms of potential, and there are no clear 'winners' as of yet.

Key Features:

- The report provides the analysis of wireless ICT (Z-wave, ZigBee/IEEE802.15.4, DECT, and Bluetooth); and wireline technologies (HomePlug, HomePNA, G.hn, MoCA); and respective markets.

- The emphasis is made on applications of these technologies for HANs (Home Area Networks) in the Smart Houses environment.

- The report also addresses the Smart Appliances initiatives, related technologies and markets and the role of Smart Meters in the evolving Smart Houses development.

- The U.S. market for ICT in Smart Houses (with a base of private houses reaching more than 100 million) is huge; it also has support of the government, which is involved in the Smart Grid project.


TABLE OF CONTENTS

1.0    Introduction
1.1 General
1.2 Scope
1.3 Research Methodology
1.4 Target Audience

2.0 General: Smart Houses
2.1 Levels
2.2 Components
2.3 Benefits

3.0 SH: Wireline ICT
3.1 PLC – HomePlug in Smart Houses
3.1.1 General
3.1.2 HomePlug Alliance
3.1.2.1 Goal
3.1.2.2 Timetable
3.1.3 HomePlug 1.0
3.1.4 HomePlug Command and Control
3.1.5 HomePlug AV
3.1.5.1 Major Features
3.1.5.2 Major Applications
3.1.5.3 HomePlug AV2
3.1.6 HomePlug GP
3.1.6.1 Applications
3.1.6.2 Specifics
3.1.6.3 Developments
3.1.6.4 ZigBee/HomePlug Smart Energy (SEP 2)
3.1.7 Advantages
3.1.8 Standard Organizations Work
3.1.8.1 IEEE
3.1.8.1.1 IEEE 1901
3.1.8.1.2 IEEE P1901.2
3.1.8.1.3 IEEE 1905.1-2013
3.1.8.2 TIA
3.1.8.3 ETSI
3.1.8.4 ITU
3.1.9 HomePlug – SH Market Segment
3.1.9.1 General
3.1.9.2 Estimation
3.1.9.3 Vendors
ActionTec
Ariane
Atheros – Qualcomm Atheros
Asoka
Broadcom
Cisco
Corinex
Devolo AG
GigaFast
Insteon
MStar
Netgear
Siemens
Sigma Design
Yitran
Zyxel
3.2 ITU G.hn - HomePNA
3.2.1 HomePNA Alliance
3.2.1.1 HomePNA: Major Characteristics
3.2.1.2 Major Benefits
3.2.2 ITU Activity
3.2.2.1 General
3.2.2.1.1 ITU Recommendation G.9960
3.2.2.1.2 ITU Recommendation G.9961
3.2.2.1.3 G.hn Details
3.2.2.2 HomeGrid Forum – ITU-T G.hn
3.2.2.3 Mixed Reaction
3.2.2.4 Acceptance
3.2.2.5 Documentation
3.2.3 Samples of Vendors
Marvell
Sigma Designs
NetSys
3.3 MOCA (Multimedia over Coax Alliance)
3.3.1 General
3.3.2 Partnerships
3.3.3 Details
3.3.3.1 MoCA 2.0
3.3.3.1.1 MOCA 2.0 Technical Highlights
3.3.3.1.2 Comparison
3.3.4 Samples of Vendors
Actioncable
Broadcom
CommScope
Entropic
Netgear

4.0 Smart House: Wireless ICT
4.1 Z-Wave
4.1.2 Z-Wave Alliance
4.1.3 Benefits
4.1.4 Details
4.1.4.1 General
4.1.4.2 Characteristics
4.1.4.2.1 ITU G.9959 (2/2012)
4.1.4.3 ZigBee and Z-Wave
4.1.5 Advanced Energy Control Framework
4.1.5.1 SH: Z-wave and Smart Metering
4.1.6 Selected Vendors
Aeon Labs
Mi Casa Verde
Sigma Designs
There
4.1.7 Pricing
4.1.8 Market Estimate: Z-wave Products for Smart Houses
4.1.8.1 Model
4.1.8.2 Results
4.2 ZigBee
4.2.1 General
4.2.2 ZigBee Foundations: IEEE 802.15.4 Radio and Alliance Specifications
4.2.2.1 General
4.2.2.2 Objectives
4.2.2.3 Specifications
4.2.2.4 Feature Sets
4.2.2.5 Application Specifics - Profiles
4.2.2.5.1 Smart Energy Profile-ICT for Smart Grid
4.2.2.5.2 Enhancements – SEP 2.0
4.2.2.5.3 Features-Energy Service Portal
4.2.2.5.4 “Green” ZigBee
4.2.2.6 ZigBee IP
4.2.2.7 ZigBee: Major Technology Features
4.2.2.7.1 Device Types
4.2.2.7.2 Protocol Stack
4.2.2.7.2.1 Physical and MAC layers – IEEE802.15.4
4.2.2.7.2.2 Upper Layers
4.2.2.7.3 Security
4.2.2.7.4 Applications - General
4.2.2.7.4.1 Home
4.2.2.7.4.2 PC
4.2.2.7.4.3 Manufacturing
4.2.2.7.4.4 WSN-UGS and ZigBee
4.2.3 802.15.4 - ZigBee Radio
4.2.4 ZigBee Technology Benefits and Limitations
4.2.5 Market
4.2.5.1 Expectations
4.2.5.2 Segments
4.2.5.3 Forecast
4.2.5.4 Industry
Amber (RF Modules)
Atmel (Chipsets)
CEL (Modules)
Cirronet-RFM (Modules-Industrial Applications)
Digi (Radios, Routers, Energy Management)
Ember - Silicon Labs (Chipsets)
EnergyHub (Smart Home)
GreenPeak (WSN)
Freescale (Chipsets)
Libelium (Router)
Nuri Telecom (AMR Application)
NXP
Renesas Electronics (Platforms, AMR)
Silicon Laboratories (Chipsets, Modules)
Synapse (Modules, Protocols)
Telegesis (Integrator, Modules)
TI (Chipsets)
4.3 IEEE 802.15.1 (Bluetooth-BT)
4.3.1 BT Protocol Stack
4.3.1.1 Transport layer
4.3.1.1.1 Radio Layer
4.3.1.1.2 Baseband and Link Manager Layers
4.3.1.2 Middleware Layer
4.3.2 Profiles
4.3.2.1 ULP – BLE and BT Smart
4.3.3 Bluetooth Security
4.3.4 Highlights
4.3.4.1 The Standard:
4.3.4.2 The Technology:
4.3.5 Evolution
4.3.5.1 BT v2.1
4.3.5.2 BT v3.0
4.3.5.3 BT v4.0 and Up
4.3.6 Market Estimate
4.4 DECT
4.4.1 DECT – ETSI Standard
4.4.1.1 Popularity
4.4.1.2 Spectrum
4.4.1.3 Layered Structure and Major Characteristics
4.4.1.3.1 DECT in SH: Requirements
4.4.2 DECT ULE
4.4.2.1 General
4.4.2.2 Major Markets
4.4.2.3 Major Characteristics
4.4.2.3.1 Summary: ULE Advantages
4.4.2.3.2 Summary: Applications
4.4.3 DECT CAT-iq
4.4.3.1 General
4.4.3.2 Approval
4.4.3.3 Highlights
4.4.4 Market
4.4.5 Vendors Samples
Dialog Semiconductor
DSP Group
Lantiq
Mindspeed - DSP

5.0 Home Area Networks
5.1 General - Advantages
5.2 Choices
5.3 Industry Activity: Specifications
5.3.1 OpenHAN
5.3.2 U-SNAP
5.3.3 Wireless Standard
5.4 HAN Market
5.4.1 Drivers
5.4.2 Nodes
5.4.3 Geography
5.4.4 Technologies
5.4.5 Market Size
5.5 Major Players: Samples
Control4
Insteon
NXP
Sigma Designs
SyChip

6.0 Smart Appliances
6.1 Technologies
6.1.1 LG Thinq
6.1.1.1 Details
6.1.1.2 Plans
6.1.2 Whirlpool
6.1.3 GE - 'Nucleus energy manager' and Other
6.1.3.1 ZigBee Certified
6.1.3.2 Nucleus Energy Manager
6.1.3.3 Brillion
6.2 New Standards
6.3 Market

7.0 Smart Meters
7.1 Progress
7.2 Characteristics
7.2.1 Standards Development
7.2.1.1 SMMAA
7.3 Vendors Samples
Echelon
Itron
SmartSynch
7.4 Market Characteristics

8.0 Conclusions

List of Figures:

Figure 1: Simplified Block-diagram
Figure 2: HomePlug C&C
Figure 3: Advanced Features
Figure 4: TAM: Global HomePlug-Equipped Products Shipped (Mil. Units)
Figure 5: TAM: Global HomePlug-Equipped Products Shipped ($B)
Figure 6: HomePNA – Spectrum Allocation
Figure 7: TAM Estimate: U.S. Small SH Z-Wave IC ($M)
Figure 8: TAM Estimate: U.S. Large SH Z-Wave IC ($US Mil)
Figure 9: Profiles
Figure 10: ZigBee Protocol Stack
Figure 11: TAM: U.S. ZigBee Modules Sales ($B)
Figure 12: TAM: U.S. ZigBee Modules Sales (Mil. Units)
Figure 13: ZigBee Market Segmentation (2012)
Figure 14: ZigBee Market Segmentation (2017) - Projection
Figure 15 Bluetooth Protocol Stack
Figure 16: Piconets Illustration
Figure 17: BT ULP Layers
Figure 18: TAM: Global BT Modules Shipped (Bil. Units)
Figure 19: TAM: Global BT Modules Shipped ($B)
Figure 20: BT Market Geographical Segmentation
Figure 21: CAT-iq Development
Figure 22: TAM: Global DECT ULE Equipment Shipping (Mil. Units)
Figure 23: TAM: Global DECT ULE Equipment Shipping ($B)
Figure 24: TAM: Global DECT CAT-iq Gateways Shipping (Mil. Units)
Figure 25: TAM: Global DECT CAT-iq Gateways Shipping ($B)
Figure 26: Dynamic of HAN Size Growth as Percentage of Total Deployed
Figure 27: HAN Market Geography (Percentage from total market)
Figure 28: HAN Radio Technologies Shares (As a percentage of total market)
Figure 29: TAM: U.S. HAN Equipment Sales (Million Units)
Figure 30: TAM U.S. HAN Equipment Sales ($B)
Figure 31: TAM: Global Households Large Appliances ($B)
Figure 32: TAM: Global Households Large Smart Appliances ($B)
Figure 33: Smart Meters Development Stages
Figure 34: TAM: Global Smart Meter Shipping ($B)
Figure 35: TAM: Global Smart Meter Shipping (Mil. Units)
Table 1: HomePlug Major Milestones
Table 2: HomePlug C&C Characteristics
Table 3: HomePlug AV Characteristics
Table 4: HomePlug GP Features
Table 5: HomePlug GP – PHY Data
Table 6: HomePNA Development
Table 7: ITU and HomePNA
Table 8: Comparative Characteristics
Table 9: Z-Wave and ZigBee
Table 10: Z-wave Products Retail Pricing
Table 11: ZigBee Smart Energy Profile Feature Set
Table 12: ZigBee Parameters
Table 13: Bluetooth Profiles
Table 14: HAN IP-based (Percentage of total networks)

 

Date of Publication:
Sep 12, 2013
File Format:
PDF via E-mail
Number of Pages:
218 Pages
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