IPC-SolMatFAM

SolMatFAM: Solder Materials Family

IPC, Date of Publication: Jul 17, 2017
US$515.00
IPC-SolMatFAM

This is a family of specifications on soldering materials and solderability testing used in the printed board assembly processes.

This kit includes the following collection of IPC standards:

J-STD-002 EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

J-STD-003 Solderability Tests for Printed Boards

J-STD-004 Requirements for Soldering Fluxes

J-STD-005 Requirements for Soldering Pastes

J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Date of Publication:
Jul 17, 2017
File Format:
Kit/Bundle, Print Copy