Wafer Fabrication Costs Model and Equipment Requirements

The Strategic Cost and Price Model

IC Knowledge, Date of Publication: Mar 21, 2018

The IC Knowledge - Strategic Cost and Price Model 2018 (latest revision) takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade.

Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron.

In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.

For each target company and process every 300mm fab they have is predefined so that if you juts pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.

Supported processes

The Model supports DRAM out to 12 nm, Foundry out beyond 3.5nm, NAND in 2D out to 15nm/16nm as well as 3D to 256 layers and 3D XPoint to 8 layers.

Supported wafer sizes
300mm and 450mm

Supported cost elements
Wafer cost and price. No packaging or test.

Who should buy this product

The IC Knowledge - Strategic Cost and Price Model - is in use at many IDMs, Consortia, Materials companies and OEMS forward projecting markets and costs as the industry implements the ITRS and 450mm,.

Latest revision

Revision 2018-00

  • Processes - Updated Samsung 10nm flow. Updated GLOBALFOUNDRIES 14nm and 7nm and smaller flows. Updated Micron 1x DRAM linewidth and introduction date. Updated work function metal processes. Updated 3D XPoint processes. Updated all 3D NAND process flows. Updated DRAM densities.
  • NGL - NA
  • Equipment - Updated exposure tool equipment costs. Updated EUV throughput. Added an investment summary by equipment type to the bottom of the 'EquipPurches' sheet. Updated Cu CMP tool usage. Increased OEE for 10nm and below foundry/logic.
  • Materials - Fixed an error in the reticle cost override dropdown. Fixed an error where changing the reticle costs from default wasn't updating the reticle costs in the material and wafer costs. Updated reticle costs. Updated slurry usage for Co CMP. Fixed an error where some logic reticle resolutions weren't defined.
  • Model - Changed selected sheets to a database view.
  • Labor - updated labor rates and usage. Changed number of direct labor to account for shorter work weeks in France.
  • Yield - NA
  • Facilities - Changed mask layers to masks for utilities calculations. Updated utility rates.
  • Fabs - Updated on-line date for TSMC fab 16. Added Samsung 14nm 2D NAND to line 12. Added TSMC Fab 18. Updated TSMC Fab 12, Fab 14 and Fab 15 dates and capacities.

The IC Knowledge - Strategic Cost Model - is in use at many large IDMs, Consortia, Materials companies, and OEMs forward projecting markets and costs as the industry implements the ITRS and 450mm.

System Requirements

The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 or higher installed on their computer. There are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.

Model Cost and How to Buy
A single user license allows one user on one computer and is $5,000, an enterprise license allowing an unlimited number of users at a company is $14,000. The model is delivered by email within a few hours of our receiving an order. The model cost includes twelve months of updates plus twelve months of reasonable levels of phone and email support. A Web Ex training session is available on request. Renewal costs at the end of twelve months are discounted 1/3 off the current prices.

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Date of Publication:
Mar 21, 2018
File Format:
Excel File via E-mail