Wafer Fabrication Costs Model and Equipment Requirements

Strategic Cost and Price Model

IC Knowledge, Date of Publication: Nov 27, 2018

The IC Knowledge - Strategic Cost and Price Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade.

Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron.

In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.

For each target company and process every 300mm fab they have is predefined so that if you juts pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.

Supported processes
The Model supports DRAM out to 12 nm, Foundry out beyond 3.5nm, NAND in 2D out to 15nm/16nm as well as 3D to 256 layers and 3D XPoint to 8 layers..

Supported wafer sizes
300mm and 450mm

Supported cost elements
Wafer cost and price. No packaging or test.

Who should buy this product
The IC Knowledge - Strategic Cost and Price Model - is in use at many IDMs, Consortia, Materials companies and OEMS forward projecting markets and costs as the industry implements the ITRS and 450mm,.

Latest revision

Revision 2018-03

  • Processes - Updated all FDSOI logic processes. Updated all 10nm and smaller logic processes. Updated all 3D NAND processes and added generic 192, 256, 384 and 512 layers processes. Added additional data rows to logic and 3D NAND sheets. Updated 3D NAND bit density. Split cobalt options into CVD and plated and create cobalt sub contact options.
  • NGL - Eliminated SAOP options. Added several LE spacer/cut options. Split NGL 1x metal layers into M0, M1 and M2/3 on logic sheet. Added cut last options for SADP and SAQP for fin and gate.
  • Equipment - Updated EUV throughput and footprint. Split OEE so that 3D NAND and 3D XPoint OEE is separate and lower than 2D NAND OEE.
  • Materials - NA
  • Model - Added a wafer cost section to the 'Main Selection' sheet.
  • Labor - NA
  • Yield - NA
  • Facilities - NA
  • Fabs - Updated Samsung Xian 1 capacity and Xian 2 dates. Updated Samsung Line 17-P2, added Pyeongtaek-P1 and P2 and updated Line 18. Updated Samsung S1-2 to include 28FDS and 18FDS. Updated Micron Fabs 10N-3D and 10X.

System Requirements

The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 or higher installed on their computer. There are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.

Model Cost and How to Buy
A single user license allows one user on one computer and is $5,000, an enterprise license allowing an unlimited number of users at a company is $14,000. The model is delivered by email within a few hours of our receiving an order. The model cost includes twelve months of updates plus twelve months of reasonable levels of phone and email support. A Web Ex training session is available on request. Renewal costs at the end of twelve months are discounted 1/3 off the current prices.

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Date of Publication:
Nov 27, 2018
File Format:
Excel File via E-mail