Surface Mount Process Defects Photo Album

Surface Mount Process Defects Photo Album

Date of Publication: Aug 14, 2013
US$165.00
BW-PHA3

The defect and photo albums provide a collection of the most common process defects for use in inspection standards, posters, training manuals and technical articles. Each file is stored on the CD in a tiff file format. Just think of the process defects and they will be on the disks.

Surface Mount Process Defects Photo Album Listing


1. Tin/lead contamination
2. Resist failure
3. Resist crinkle
4. PCB delaminating
5. Uneven levelling
6. Uneven tin /lead
7. Plating failure
8. Legend contamination
9. Resist contamination
10. Chip Leaching
11. Poor solderability
12. Plastic cracking
13. Capacitor cracking
14. Poor solderability
15. Plastic softening
16. Capacitor cracking
17. QFP cracking
18. Poor coplanarity
19. Solder beading
20. Poor solderability
21. Crystallised joints
22. Cracked joint
23. Poor pad wetting
24. Component lift
25. No wetting
26. Joint failure
27. Joint voiding
28. Poor solderability
29. Solder beading
30. Solder beading
31. Solder wicking
32. Component lifting
33. Solder wicking
34. Solder wicking
35. Solder wicking
36. Solder short
37. Non reflow
38. Solder short
39. Solder short
40. PCB measelling
41. Component lifting
42. Solder beading
43. Open joints
44. Cracked joint
45. Non reflow
46. Component cracking
47. Open joint
48. Non reflow
49. Solder balling
50. Poor penetration
51. Solder balling
52. Solder skip
53. Bulbous joint
54. Poor wetting
55. Poor wetting
56. Solder short
57. Solder skip
58. Solder short
59. Solder balls
60. Solder shorts
61. Blow hole
62. Solder skip
63. Solder skip
64. Incomplete joint
65. Bulbous joints
66. Solder webbing
67. Adhesive contamination
68. Adhesive stringing
69. Adhesive contamination
70. Adhesive shorts
71. Excess adhesive
72. Skipped pads
73. Paste slump
74. Poor wash-off
75. Solder balling
76. Smudged print
77. Uneven print
78. Misaligned dispense
79. Smudged print
80. Misaligned print
81. Smudged print
82. Cracked component
83. Incorrect placement
84. Misplaced lead
85. Misplaced component
86. Excess flux
87. Dendrite growth
88. Corrosion
89. Dendrite growth
90. Corrosion
91. Joint damage
92. PCB burning
93. Poor wetting
94. Solder spikes
95. Flux residues
96. Joint cracking
97. Pad lifting
98. Solder voids
99. Solder voids
100.  BGA misplacement
101.  BGA cracking
102.  BGA cracking
103.  Poor washing
104.  Ball failure
105.  BGA cracking
106. Joint cracking
107.  Reflow joints assembly
108.  Wave solder joints assembly
109.  Fine pitch paste bleed
110.  Misaligned print
111. Incorrect stencil alignment
112.  Satisfactory print
113. Incomplete paste print
114.  Satisfactory print
115.  Misaligned print
116.  Poor paste washoff
117.  Smudged print
118.  Misaligned print
119. Dog-eared print
120.  Smudged print
121.  Misaligned print
122. Stencil squashed print
123. Stencil squashed print
124. Poor stencil paste release
125.  Misaligned print
126.  Smudged print
127.  Smudged print
128. Misaligned print
129.  Scooped print
130.  Scooped print
131.  Satisfactory print
132.  Minor misalignment
133.  Minor misalignment
134.  Smudged print
135.  Misaligned re-print
136. Misaligned/Smudged print
137. Poor paste release SOT23
138. Misaligned chip print
139. Poor paste release SOT 23
140. Void in paste print
141. Misaligned print SOT 23
142. Minor misaligned chip print
143. Paste lifted from SOT 23
144. Paste slump SOT 23
145. Adhesive contamination under chip termination
146. Excessive adhesive stencil printed on PCB
147.  Excessive adhesive on SOIC
148. Adhesive contamination on stand off pin
149. Solder short on SOIC
150. Adhesive contamination on chip pad
151. SOT 23
152. Adhesive failure on SOT23
153. Solder shorts on SOIC device
154. Microsection of solder short under chip component
155. Solder shorts on chip components
156. Poor wetting on SOT23 pad and pin combination
157. SOT23 with
158. Close up of pad in fig 156
159. Adhesive failure of chip component
160. Solder balls after reflow paste trial
161. Capacitor termination plating failure
162. SOT89 with lifted termination not wetting
163. Chip capacitor lifted on resist
164. Excessive solder balling on paste after reflow trial
165. Copper pad failure of PLCC pads
166. Satisfactory solder joints
167. Satisfactory joints on J leads
168. Joints after pull testing with voiding
169. Joint after pull testing on gull wing
170. Lifted LED during reflow
171. Solder balling on ceramic plate
172. LCCC joint failure due to thermal cycling
173. As above
174. Outgassing void in chip solder joint
175. Example of chip with solder short under part not visible
176. Adhesive failure loss of chip component
177. Solder shorts and poor wetting of board
178. SOT solder joints with one pad skip
179. Microsection with void in chip joint
180. Incomplete solder joint on lead with insulation
181. Board design with gassing holes
182. Chip and SOT solder short
183. QFP after wave soldering with solder thief
184. QFP with short after wave soldering
185.  Skipped joints on SOT23
186.  Solder drainage pads on QFP
187.  Solder ball on resist after wave soldering no flux ring
188.  Solder ball on resist after wave soldering with flux
189.  Solder ball on resist after wave soldering with flux
190.  MELF with adhesive
191.  MELF movement with adhesive
192.  MELF twist with adhesive
193.  Solder paste residues after reflow
194.  Solder skip on SOT23
195.  Voiding in joint after pull testing
196.  Example of SOIC with drainage pads
197.  QFP with drainage pads
198.  As above
199.  Adhesive attachment for SDSRS
200.  As above
201.  Adhesive attachment for SDSRS
202.  As above
203.  SOT89 with adhesive for SDSRS
204.  Push off test on SOT89
205.  Adhesive dots for SOT23
206.  Microsection of J lead joint
207.  Microsection of chip termination
208.  Microsection of gull wing end termination
209.  As above
210.  Gull wing in paste deposit
211.  Chip placement on pad surface
212.  Solder short on reflow test on ceramic tile
213.  Adhesive failure on chip part
214.  Residues present in through hole
215.  Adhesive component damage
216.  Minimum adhesive deposit
217.  Excessive adhesive peaking
218.  Chip component damage
219.  As above
220.  Component placement into paste
221.  Poor solder coverage on solder levelled board
222.  Poor solder coverage on copper pads
223.  Solder paste slump test on ceramic tile
224.  Mechanical damage to chip capacitor
225.  Poor solder coverage on solder levelled board
226.  Microsection through gull wing lead
227.  As above
228.  Microsection on heel of gull wing lead
229.  Gull wing tip microsection
230.  Solder joint failure on gold boards
231.  Solder shorts on flexible circuits and connectors
232.  Capacitor joint failure due to plating defects on lead
233.  Solder slivers on fine pitch leads due to mechanical testing
234.  Solder skip on small resistor termination
235.  SOT23 melting during hand soldering
236.  SOT23 with solder skip on copper pad
237.  Microsection of solder joint on gull wing lead
238.  Microsection of void in chip solder joint
239.  SOT89 with lifted lead
240.  Joint after pull off testing with lead plating failure
241.  Joint after pull off testing with lead plating failure
242.  Solder paste dispensing, misplaced
243.  Solder paste dispensing, misplaced
244.  SOT89 with plastic contamination on leads
245.  Solder paste dispensing, misplaced
246.  Solder paste dispensing, misplaced
247.  Joints after pull testing, satisfactory joints with small voids
248.  Solder skips on chip component
249.  Section under chip showing solder shorts in the adhesive
250.  Excessive paste dispensing
251.  Paste dispensing on surface mount board
252.  Paste dispensing on surface mount board
253.  Excessive paste dispensing
254.  Excessive paste dispensing
255.  Excessive paste dispensing
256.  Example of QFP with paste and adhesive for SDSRS
257.  Example of QFP with paste and adhesive for SDSRS
258.  BGA paste pattern with adhesive for SDSRS
259.  Example of QFP with paste and adhesive for SDSRS
260.  BGA paste pattern with adhesive for SDSRS
261.  SOT89 for adhesive bond testing
262.  uBGA after SDSRS
263.  SOT89 after SDSRS with adhesive visible
264.  BGA after SDSRS with adhesive visible
265.  SOT89 after SDSRS with adhesive visible
266.  QFP after SDSRS with adhesive visible
267.  PLCC after SDSRS with adhesive visible
268.  PLCC after SDSRS with adhesive visible
269.  PLCC after SDSRS with adhesive visible
270.  PLCC after SDSRS with adhesive visible
271.  uBGA after push testing of adhesive bond
272.  uBGA with adhesive bond
273.  uBGA after push testing of adhesive bond
274.  QFP after SDSRS with adhesive visible
275.  uBGA with adhesive bond
276.  Surface of QFP after testing adhesive bond
277.  QFP after SDSRS with lead contaminated by adhesive
278.  PLCC after adhesive bond testing
279.  Adhesive prior to component placement
280.  PLCC after SDSRS with slight displacement
281.  Paste contamination by adhesive foot during dispense
282.  QFP after adhesive bond testing
283.  Paste print smeared by dispense foot
284.  PLCC after SDSRS
285.  As above
286.  Adhesive too close to paste print
287.  uBGA paste deposit smeared by dispense foot
288.  Paste contamination by dispense foot
289.  Resistor termination corrosion caused by sulphur
290.  Damage to chip capacitor caused by laser shown by microsection
291.  Damage to chip capacitor caused by laser shown by microsection
292.  Examples of components prior to microsectioning
293.  Resistor termination corrosion caused by sulphur
294.  Resistor termination corrosion caused by sulphur
295.  Capacitor termination corrosion caused by sulphur
296.  Damage to balls on uBGA
297.  uBGA mechanical damage to body
298.  Voids in Conformal coating around leads
299.   Capacitor termination corrosion caused by sulphur
300.  Resistor termination corrosion caused by sulphur
301.  Resistor termination corrosion caused by sulphur
302.  Adhesive bond for SDSRS
303.  Adhesive bond for SDSRS
304.  Adhesive bond for SDSRS
305.  Adhesive bond for SDSRS
306.  Adhesive contact area after push testing
307.  Adhesive contact area after push testing
308.  Surface corrosion on QFP due to flux
309.  Surface corrosion on QFP due to flux
310.   Surface corrosion due to flux
311.  Surface corrosion under Conformal coating
312.  Ridiculous use of defect markers
313.  Warped circuit board after soldering
314.  Tombstone of chip component
315.  Surface corrosion around via holes
316.  Solder shorts on fine pitch leads
317.  Cracking on chip capacitor causing over heating
318.  Cracking on chip capacitor causing over heating
319.  Solder paste stencil with modified apertures
320.  Microsection of QFP with cracking of plastic
321.  Microsection of QFP with cracking of plastic
322.  Poor copper surface preparation
323.  Cracking in plastic on the base of the QFP
324.  Cracking in plastic on the top of the QFP
325.  Solder flood on the top side of a board assembly
326.  Contamination from flux residues
327.  Residues from low residue cored wire
328.  Dendrite growth on the surface of the board
329.  Dendrite on surface of the board with back light
330. Verdigris corrosion on the surface of joints
331. Poor wetting on gold pads
332. Poor wetting and wicking of solder on gold pads
333. Poor wetting and wicking of solder on gold pads
334. Poor wetting and wicking of solder on gold pads
335. Poor wetting and wicking of solder on gold pads
336. Poor wetting and wicking of solder on gold pads
337. Solder balls under conformal coating
338. Lifting of LED chip
339. Lifting of chip due to solder ball under chip
340. Lifting of chip due to solder ball under chip
341. Shielding on surface mount boards
342. Shielding on surface mount boards
343. Shielding on surface mount boards
344. Shielding on surface mount boards
345. Shielding on surface mount boards
346. Stencil apertures poorly cleaned
347. Shielding on surface mount boards
348. Shielding on surface mount boards
349. Shielding on surface mount boards
350. Shielding paste deposits on surface mount boards
351. Solder paste deposits for uBGA
352. Solder paste deposits for uBGA and fine pitch
353. Stencil for shielding paste
354. Stencil for shielding paste
355. Shielding paste deposits on surface mount boards
356. Lifting of LED chip
357. Solder balls under conformal coating
358. Lifting of chip due to solder ball under chip
359. Lifting of LED chip
360. Satisfactory solder joint
361. Satisfactory solder joint
362. Satisfactory solder joint
363. Satisfactory solder joint
364. Satisfactory solder joint
365. Satisfactory solder joint
366. Satisfactory solder joint
367. Satisfactory solder joint
368. Satisfactory solder joint
369. Satisfactory solder joint
370. Satisfactory solder joint bare toe
371. Satisfactory solder joint bare toe
372. Lifting of LED chip
373. Mixed technology board
374. Mixed technology board
375. Solder balls under conformal coating
376. Poor paste wash off
377. Lifting of LED chip
378. Poor wetting on gold pads
379. Flux residue cracking
380. Solder balling non reflow due to wash off
381. Solder balling non reflow due to wash off
382. Delaminating of PCB
383. Delaminating of PCB
384. Satisfactory joint with residues
385. Satisfactory joint with residues
386. Delaminating of PCB
387. Delaminating of PCB
388. Solder balling non reflow due to wash off
389. Solder balling non reflow due to wash off
390. Solder balling non reflow due to wash off
391. Solder balling non reflow due to wash off
392. Solder balling non reflow due to wash off
393. Solder balls after wave soldering
394. Solder balling non reflow due to wash off
395. Solder balling non reflow due to wash off
396. Solder balling non reflow due to wash off
397. Solder balling non reflow due to wash off
398. Fine pitch solder paste print
399. Fine pitch solder paste print
400. Solder paste print misplaced
401. Solder paste print 0805
402. Solder paste residue in hole
403. Lifted component
404. Incomplete solder paste print
405. Incomplete paste print
406. As above
407. Misplace solder paste print
408. As above
409. Incomplete solder paste print
410. Solder paste print on SOIC
411. Incomplete paste print on 0805

421. Incomplete paste print on 0805
422. Incomplete paste prints
423. Misplaced component on paste deposit
424. Surface mount socket placement
425. Electrolytic termination misplacement
426. Satisfactory solder joints
427. Poor wetting on electrolytic termination
428. Misplaced capacitor
429. Satisfactory termination placement
430. Misplacement of gull wing terminations
431. As above
432. Poor wetting on termination
433. Solder paste scooping
434. Poor solder paste washoff
435. Poor solder paste washoff
436. X-ray of misplacement
437. X-ray of misplacement
438. X-ray of paste and component
439. X-ray of paste and component
440. Solder joints on 0402
441. Solder paste deposit with ears
442. Fibre contamination on PCB
443. Fibre contamination on PCB
444. Fibre contamination on pasted PCB
445. Fibre contamination on pasted PCB
446. Fibre contamination in joint
447. Fibre contamination on pasted PCB
448. Fibre contamination in joint
449. Fibre contamination in joint
450. Fibre contamination in joint

Date of Publication:
Aug 14, 2013
File Format:
Cd-ROM
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