System-in-Package (SiP) Technology - Global Strategic Business Report

System-in-Package (SiP) Technology - Global Strategic Business Report

Global Industry Analysts, Date of Publication: Aug 21, 2012, 564 Pages
US$4,600.00
GIA-MCP7595

This report analyzes the worldwide markets for System-in-Package (SiP) Technology in Million Units. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2010 through 2018. Also, a six-year historic analysis is provided for these markets. The report profiles 47 companies including many key and niche players such as Amkor Technology, Atmel Corporation, ChipSiP Technology Co., Ltd., CyberTAN Technology Inc., Fujitsu Limited, Freescale Semiconductor Inc., Insight SiP, Orient Semiconductor Electronics Ltd., OriginGPS Ltd., Qualcomm Atheros, Inc., Renesas Electronics Corporation, Sequans Communications, STATS ChipPAC Ltd., Si2 Microsystems Ltd., SiPCUBE, Texas Instruments, and Wi2Wi, Inc. Market data and analytics are derived from primary and secondary research.

TABLE OF CONTENTS


I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS
Study Reliability and Reporting Limitations I-1
Disclaimers I-2
Data Interpretation & Reporting Level I-2
Quantitative Techniques & Analytics I-2
Product Definitions and Scope of Study I-3

II. Executive Summary

1. INDUSTRY OVERVIEW II-1
Semiconductor and IC Industry: A Rudimentary Overview II-1
SiP Technology: A Prelude II-1
Market Overview II-2
Shortfalls of SoC Throw the Spotlight on SiP II-2
Impact of the 2007-2009 Recession: In Retrospect II-3
Key Market Trends & Drivers II-4
SMBs Drive Adoption of the SiP Technology II-4
Expansion Towards Non- Battery Operated Applications Spur Growth II-4
Increasing Need for Compactness and High Speed Performance
Drives Growth II-5
Shift in Direction Towards “More Than Moore's Law” Benefits
the Market II-5
Adroit Combination SiP & SoC Technology II-6
Outlook II-6
Developing Regions to Lend Traction to Global Market II-6

2. TECHNOLOGY OVERVIEW II-7
System in Package (SiP): A Definition II-7
SiP Packaging II-7
Package-on-Package SiP II-7
Power Quad Flat No-Lead SiP II-7
Stacked Die SiP II-7
System-in-Package Land Grid Array II-8
Markets for SiP II-8
Development of SiP II-8
SiP Benefits II-8
Importance of SiP Technology in Electronics II-9

3. RECENT INDUSTRY ACTIVITY II-10
Avnet Memec Inks Distribution Agreement with apm Communications II-10
Qualcomm Acquires Atheros Communications II-10
Quik-Pak Signs Agreement with Ultra Communications II-10
Freescale Semiconductor Inks Licensing Agreement with Nepes II-10
ON Semiconductor Takes Over Sound Design Technologies II-11
Avnet Extends Partnership with Wi2Wi II-11
ChipSiP Technology Enters into Partnership with Zoran II-11

4. PRODUCT LAUNCHES/INTRODUCTIONS II-13
Qualcomm Atheros Launches AR4100P II-13
Qualcomm Atheros Introduces AR4100 SIP II-13
Silex Technology America Unveils SX-SDMGN Wireless Radio
Module and SX-SPGN System-in-Package II-14
Atheros Communications Introduces AR6233 Flexible Wi-Fi™ and
Bluetooth Solution II-14
AzureWave Unveils Range of 3G Products and Android Software
Development for Mobile Internet II-14
Avnet Electronics Marketing Americas Launches Endicott
Interconnect Technologies Products II-15
NXP Semiconductors Introduces Integrated CAN Transceiver
Microcontroller Solution II-15
Koninklijke Philips Electronics Develops SiP Platform for
Electronic-Micro Fluidic Devices II-15
Caiway Installs New VoIP Platform II-16
INSIDE Contactless Introduces SecuRead SiP NFC Solution II-16
Linear Technology Rolls Out LTM4609MP Buck-Boost DC/DC Regulator II-16
Smart Mixed-Signal Connectivity Launches High Speed
Interconnect USB4640 II-17
ON Semiconductor Unveils IPD2 Process Technology II-17
AT&S Introduces ECP Technology II-17
Renesas Electronics Launches System on Chips for Audio Visual
Devices II-17
Intel Introduces Atom Based CPU Series II-18
Wi2Wi Introduces Industrial Temperature Miniature GPS Module II-18
Wi2Wi Introduces W2CBW009Di WLAN-Bluetooth Module II-18
Atmel® Rolls out System in Package Device ATA 6614 II-19
Freescale Semiconductor Rolls out LL18UHV Technology II-19
Freescale Semiconductor Rolls out New Integrated Automobile
Technology II-20
Agilent Technologies Rolls out ADS 2011 II-20
Electro Scientific Industries Launches the 9900 System II-20
TSMC Launches AMS Reference Flow 1.0 and Reference Flow 11.0 II-21
ATP Electronics Introduces Internal USB SSD II-21
Renesas Technology America Introduces RX Flash of MCU Group II-22
Wi2Wi Unveils W2SW0001 System-in-Package II-22
Sequans Communications Introduces New SQN1280 WiMAX SIP II-22

5. FOCUS ON SELECT PLAYERS II-24
Amkor Technology (USA) II-24
Atmel Corporation (USA) II-24
ChipSiP Technology Co., Ltd. (Taiwan) II-24
CyberTAN Technology Inc. (Taiwan) II-24
Fujitsu Limited (Japan) II-25
Freescale Semiconductor Inc (USA) II-25
Insight SiP (France) II-25
Orient Semiconductor Electronics Ltd (Taiwan) II-26 OriginGPS
Ltd (Israel) II-26
Qualcomm Atheros, Inc. (USA) II-26
Renesas Electronics Corporation (Japan) II-26
Sequans Communications (France) II-27
STATS ChipPAC Ltd (Singapore) II-27
Si2 Microsystems Ltd (India) II-27
SiPCUBE (France) II-27
Texas Instruments (USA) II-28
Wi2Wi, Inc. (USA) II-28

6. GLOBAL MARKET PERSPECTIVE II-29
Table 1: World Recent Past, Current and Future Analysis for
System-in-Package Technology by Geographic Region/Country -
US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and
Rest of World Markets Independently Analyzed with Annual Sales
Figures in Million Units for Years 2010 through 2018 (includes
corresponding Graph/Chart) II-29

Table 2: World Historic Review for System-in-Package
Technology by Geographic Region - US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan), and Rest of World Markets
Independently Analyzed with Annual Sales Figures in Million
Units for Years 2004 through 2009 (includes corresponding
Graph/Chart) II-30

Table 3: World 15-Year Perspective for System-in- Package
Technology by Geographic Region/Country - Percentage Breakdown
of Unit Sales for US, Canada, Japan. Europe, Asia-Pacific
(excluding Japan), and Rest of World Markets for Years 2004,
2011, and 2018 (includes corresponding Graph/Chart) II-31

Table 4: World Recent Past, Current and Future Analysis for
System-in-Package Technology by End-Use Sector - Consumer
Electronics, Communications Industry and Others Independently
Analyzed with Annual Sales Figures in Million Units for Years
2010 through 2018 (includes corresponding Graph/Chart) II-32

Table 5: World Historic Review for System-in-Package
Technology by End-use Sector - Consumer Electronics,
Communications Industry and Others Independently Analyzed with
Annual Sales Figures in Million Units for Years 2004 through
2009 (includes corresponding Graph/Chart) II-33

Table 6: World 15-Year Perspective for System-in- Package
Technology by End-use Sector - Percentage Breakdown of Unit
Sales for Consumer Electronics, Communications Industry and
Others for Years 2004, 2011, and 2018 (includes corresponding
Graph/Chart) II-34

III. MARKET

1. THE UNITED STATES III-1
A.Market Analysis III-1
Outlook III-1
Recent Industry Activity III-1
Product Launches/Introductions III-2
Key Players III-9
B.Market Analytics III-11
Table 7: US Recent Past, Current and Future Analysis for
System-in-Package Analyzed with Annual Sales Figures in
Million Units for Years 2010 through 2018 (includes
corresponding Graph/Chart) III-11

Table 8: US Historic Review for System-in-Package
Independently Analyzed with Annual Sales Figures in Million
Units for Years 2004 through 2009 (includes corresponding
Graph/Chart) III-12

2. CANADA III-13
A.Market Analysis III-13
Outlook III-13
Strategic Corporate Development III-13
B.Market Analytics III-14
Table 9: Canadian Recent Past, Current and Future Analysis
for System-in-Package Analyzed with Annual Sales Figures in
Million Units for Years 2010 through 2018 (includes
corresponding Graph/Chart) III-14

Table 10: Canadian Historic Review for System-in-Package
Independently Analyzed with Annual Sales Figures in Million
Units for Years 2004 through 2009 (includes corresponding
Graph/Chart) III-15

3. JAPAN III-16
A.Market Analysis III-16
Outlook III-16
Key Players III-16
Product Launch/Introduction III-16
B.Market Analytics III-17
Table 11: Japanese Recent Past, Current and Future Analysis
for System-in-Package Analyzed with Annual Sales Figures in
Million Units for Years 2010 through 2018 (includes
corresponding Graph/Chart) III-17

Table 12: Japanese Historic Review for System-in-Package
Independently Analyzed with Annual Sales Figures in Million
Units for Years 2004 through 2009 (includes corresponding
Graph/Chart) III-18

4. EUROPE III-19
A.Market Analysis III-19
Outlook III-19
B.Market Analytics III-20
Table 13: European Recent Past, Current and Future Analysis
for System-in-Package by Country/Region - France, Germany,
Italy, UK, and Rest of Europe Independently Analyzed with
Annual Sales Figures in Million Units for Years 2010 through
2018 (includes corresponding Graph/Chart) III-20

Table 14: European Historic Review for System-in-Package by
Country/Region - France, Germany, Italy, UK, and Rest of
Europe Independently Analyzed with Annual Sales Figures in
Million Units for Years 2004 through 2009 (includes
corresponding Graph/Chart) III-21

Table 15: European 15-Year Perspective for System-in-Package
by Country/Region - Percentage Breakdown of Unit Sales for
France, Germany, Italy, UK, and Rest of Europe Markets for
Years 2004, 2011 and 2018 (includes corresponding
Graph/Chart) III-22

4a. FRANCE III-23
A.Market Analysis III-23
Outlook III-23
Product Launches/Introductions III-23
Key Players III-24
B.Market Analytics III-25
Table 16: French Recent Past, Current and Future Analysis
for System-in-Package Analyzed with Annual Sales Figures in
Million Units for Years 2010 through 2018 (includes
corresponding Graph/Chart) III-25

Table 17: French Historic Review for System-in-Package
Independently Analyzed with Annual Sales Figures in Million
Units for Years 2004 through 2009 (includes corresponding
Graph/Chart) III-26

4b. GERMANY III-27
A.Market Analysis III-27
Outlook III-27
Recent Industry Activity III-27
B.Market Analytics III-28
Table 18: German Recent Past, Current and Future Analysis
for System-in-Package Analyzed with Annual Sales Figures in
Million Units for Years 2010 through 2018 (includes
corresponding Graph/Chart) III-28

Table 19: German Historic Review for System-in-Package
Independently Analyzed with Annual Sales Figures in Million
Units for Years 2004 through 2009 (includes corresponding
Graph/Chart) III-29

4c. ITALY III-30
A.Market Analysis III-30
Outlook III-30
B.Market Analytics III-30
Table 20: Italian Recent Past, Current and Future Analysis
for System-in-Package Analyzed with Annual Sales Figures in
Million Units for Years 2010 through 2018 (includes
corresponding Graph/Chart) III-30

Table 21: Italian Historic Review for System-in-Package
Independently Analyzed with Annual Sales Figures in Million
Units for Years 2004 through 2009 (includes corresponding
Graph/Chart) III-31

4d. THE UNITED KINGDOM III-32
A.Market Analysis III-32
Outlook III-32
B.Market Analytics III-32
Table 22: UK Recent Past, Current and Future Analysis for
System-in-Package Analyzed with Annual Sales Figures in
Million Units for Years 2010 through 2018 (includes
corresponding Graph/Chart) III-32

Table 23: UK Historic Review for System-in- Package
Independently Analyzed with Annual Sales Figures in Million
Units for Years 2004 through 2009 (includes corresponding
Graph/Chart) III-33

4e. REST OF EUROPE III-34
A.Market Analysis III-34
Outlook III-34
Product Launches/Introductions III-34
Key Player III-35
B.Market Analytics III-36
Table 24: Rest of Europe Recent Past, Current and Future
Analysis for System-in-Package Analyzed with Annual Sales
Figures in Million Units for Years 2010 through 2018
(includes corresponding Graph/Chart) III-36

Table 25: Rest of Europe Historic Review for
System-in-Package Independently Analyzed with Annual Sales
Figures in Million Units for Years 2004 through 2009
(includes corresponding Graph/Chart) III-37

5. ASIA-PACIFIC III-38
A.Market Analysis III-38
Outlook III-38
Strategic Corporate Development III-38
Product Launches/Introductions III-38
Key Players III-40
B.Market Analytics III-41
Table 26: Asia-Pacific Recent Past, Current and Future
Analysis for System-in-Package Analyzed with Annual Sales
Figures in Million Units for Years 2010 through 2018
(includes corresponding Graph/Chart) III-41

Table 27: Asia-Pacific Historic Review for System-
in-Package Independently Analyzed with Annual Sales Figures
in Million Units for Years 2004 through 2009 (includes
corresponding Graph/Chart) III-42

6. REST OF WORLD III-43
A.Market Analysis III-43
Outlook III-43
B.Market Analytics III-43
Table 28: Rest of World Recent Past, Current and Future
Analysis for System-in-Package Analyzed with Annual Sales
Figures in Million Units for Years 2010 through 2018
(includes corresponding Graph/Chart) III-43

Table 29: Rest of World Historic Review for System-
in-Package Independently Analyzed with Annual Sales Figures
in Million Units for Years 2004 through 2009 (includes
corresponding Graph/Chart) III-44

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 47 (including Divisions/Subsidiaries - 50)

The United States (19)
Japan (4)
Europe (11)
- France (5)
- Germany (1)
- Spain (1)
- Rest of Europe (4)
Asia-Pacific (Excluding Japan) (15)
Middle-East (1)

 

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Date of Publication:
Aug 21, 2012
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