This report analyzes the worldwide markets for System-in-Package (SiP) Technology in US$ Million. The Global market is further analyzed by: Interconnection Technology - Wire Bonding, and Flip-Chip; and End-Use Sector - Consumer Electronics, Communications, Aerospace & Defense, Automotive, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.
Also, a six-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 51 companies including many key and niche players such as -
- Amkor Technology, Inc. (USA)
- ASE Group (Taiwan)
- ChipMOS Technologies Inc. (Taiwan)
- Fujitsu Limited (Japan)
- GS Nanotech (Russia)
- Insight SiP (France)
- Intel Corporation (USA)
- Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
- Kulicke & Soffa Pte Ltd. (Singapore)
- Nanium S.A. (Portugal)
- O.C.E. Technology Ltd. (Ireland)
- Powertech Technologies, Inc. (Taiwan)
- Renesas Electronics Corporation (Japan)
- Samsung Electronics Co., Ltd. (South Korea)
- ShunSin Technology (Zhongshan) Limited (China)
- Si2 Microsystems Private Limited (India)
- Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
- STATS ChipPAC Ltd. (Singapore)
- Unimicron Corporation (Taiwan)
System-in-Package (SiP) Technology - Global Strategic Business Report
TABLE OF CONTENTS
I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS
Study Reliability and Reporting Limitations I-1
Disclaimers I-2
Data Interpretation & Reporting Level I-2
Quantitative Techniques & Analytics I-3
Product Definitions and Scope of Study I-3
Interconnection Technology I-3
End-Use Sector I-3
II. EXECUTIVE SUMMARY
1. INDUSTRY OVERVIEW II-1
Small Form Factor, High Performance & Energy Efficiency Needs
of Electronics Industry Bolster Demand for System-in-Package
(SiP) Technology II-1
Growing Demand for Miniature and High Performance Electronic
Devices & Systems Drive SiP Market II-3
Developing Countries Offer Growth Prospects II-4
Flip Chip Type of Interconnection Technology Leads SiP
Technology Market II-4
Consumer Electronics Sector Fuels Revenue Growth in SiP Market II-5
Portable Electronic Devices Stir Demand for Flat Packaging II-5
2.5D IC Packaging Technology Dominates SiP Market II-5
Challenges Confronting the SiP Market II-6
2. MARKET TRENDS & GROWTH DRIVERS II-7
Importance of SiP Technology in Electronics II-7
Rising Demand for High Performance and Compact Consumer
Electronics Drive Growth II-7
List of Select SiP Solutions for Connected Devices II-9
Growing Demand for Smart, Energy Efficient Electronics
Provides Business Case for SiP II-9
Growing Sales of Smartphones Bode Well for SiP Market II-9
Table 1: World Smartphones Market (2015 & 2020): Annual Unit
Shipments in Thousands by Region/ Country (includes
corresponding Graph/Chart) II-10
Growing Demand for Tablet PCs - A Key Growth Driver II-11
Table 2: Global Tablet Shipments in ‘000 Units for 2016,
2018 & 2020 (includes corresponding Graph/Chart) II-11
Applications in Set Top Boxes Boosts Demand for SiP Technology II-11
Computing Devices - A Key Growth Driver II-11
IoT Opens New Growth Avenues for SiP II-12
Table 3: Rapid Growth of Internet of Things (IoT) Market to
Fuel Demand for Advanced System-in-Packaging (SiP) Technology -
IoT Installed Base in Billions for the Years 2016, 2018 &
2020 (includes corresponding Graph/Chart) II-13
TSVs for Die-to-Die/Die-to-Package Substrate Communication II-13
Advanced Nodes Demand Innovative Package Technologies II-13
PCB Considerations Vital for Using SiP in IoT Systems II-14
WLCSP for Compact Form Factors II-14
Trend Towards Smart Homes Offers Growth Opportunities II-14
Table 4: Growing Number of Smart Homes Catalyzes
Semiconductor Companies to Adopt Advanced SiP Technology:
Number of Smart Homes Worldwide (In 000 Households) by Select
Country for the Years 2015 & 2020 (includes corresponding
Graph/Chart) II-15
Miniaturization of Electronics - A Major Growth Driver for SiP II-15
Need for Compact and High Speed Performance Products Spurs
Market Growth II-16
Shift in Direction towards “More Than Moore’s Law” Benefits
the SiP Market II-16
SMBs Spur the Adoption of SiP II-17
Expanding Applications in Non- Battery Operated Systems Spur
Market Growth II-17
SoC Design Complexities Bring Focus onto SiP II-18
Combined SoC and SiP Technology Gains Increased Demand II-19
Need to Reduce Cost Per Function of ICs Boosts Market Demand II-19
Advanced SiP Packaging Transforming System-Level Integration
Landscape II-19
Wafer-Based Advanced SiP II-20
Laminate-based Advanced SiP II-21
SiP Technology to Impact Fan-In Packaging Platform II-21
Foundries Focus on Offering Turnkey Services with System-in-
Package II-22
Vendors Offer Advanced Capabilities for SiP Design II-22
3. TECHNOLOGY OVERVIEW II-24
System in Package (SiP): A Definition II-24
SiP Configurations, Features and Target Applications II-25
Development of SiP II-25
SiP Packaging II-26
Package-on-Package SiP II-26
Power Quad Flat No-Lead SiP II-26
Stacked Die SiP II-26
System-in-Package Land Grid Array II-26
SiP Benefits II-26
4. RECENT INDUSTRY ACTIVITY II-28
Amkor Announces Product Qualification for SWIFT™ Packaging II-28
3D Glass Solutions Collaborates with TE Connectivity II-28
Silicon Labs Introduces New Bluetooth SiP Module II-28
MediaTek Unveils SoCs for Fitness and Healthcare Devices II-28
Intel Launches Intel® Curie™ Module SiP II-28
Octavo Systems Launches OSD3358 SiP Device II-28
UTAC Collaborates with AT & S II-29
MediaTek Unveils New SiP Chipsets II-29
JCET Receives Order to Assemble SiP Modules for Apple II-29
5. FOCUS ON SELECT GLOBAL PLAYERS II-30
Amkor Technology, Inc. (USA) II-30
ASE Group (Taiwan) II-30
ChipMOS Technologies Inc. (Taiwan) II-30
Fujitsu Limited (Japan) II-31
GS Nanotech (Russia) II-31
Insight SiP (France) II-31
Intel Corporation (USA) II-32
Jiangsu Changjiang Electronics Technology Co. Ltd. (China) II-32
Kulicke & Soffa Pte Ltd. (Singapore) II-33
Nanium S.A. (Portugal) II-33
O.C.E. Technology Ltd. (Ireland) II-33
Powertech Technologies, Inc. (Taiwan) II-34
Renesas Electronics Corporation (Japan) II-34
Samsung Electronics Co., Ltd. (South Korea) II-34
ShunSin Technology (Zhongshan) Limited (China) II-35
Si2 Microsystems Private Limited (India) II-35
Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan) II-35
STATS ChipPAC Ltd. (Singapore) II-36
Unimicron Corporation (Taiwan) II-36
6. GLOBAL MARKET PERSPECTIVE II-37
Table 5: World Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Geographic Region - US,
Canada, Japan, Europe, Asia-Pacific (excluding Japan), and
Rest of World Markets Independently Analyzed with Annual
Revenue Figures in US$ Million for Years 2015 through 2022
(includes corresponding Graph/Chart) II-37
Table 6: World Historic Review for System-in-Package (SiP)
Technology by Geographic Region - US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan), and Rest of World Markets
Independently Analyzed with Annual Revenue Figures in US$
Million for Years 2009 through 2014 (includes corresponding
Graph/Chart) II-38
Table 7: World 14-Year Perspective for System-in-Package (SiP)
Technology by Geographic Region - Percentage Breakdown of
Revenues for US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan), and Rest of World Markets for Years 2009,
2017 and 2022 (includes corresponding Graph/Chart) II-39
Table 8: World Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by Interconnection
Technology - Wire Bonding and Flip-Chip Markets Independently
Analyzed with Annual Revenue Figures in US$ Million for Years
2015 through 2022 (includes corresponding Graph/Chart) II-40
Table 9: World Historic Review for System-in-Package (SiP)
Technology by Interconnection Technology - Wire Bonding and
Flip-Chip Markets Independently Analyzed with Annual Revenue
Figures in US$ Million for Years 2009 through 2014 (includes
corresponding Graph/Chart) II-41
Table 10: World 14-Year Perspective for System-in-Package
(SiP) Technology by Interconnection Technology - Percentage
Breakdown of Revenues for Wire Bonding and Flip-Chip Markets
for Years 2009, 2017 and 2022 (includes corresponding
Graph/Chart) II-42
Table 11: World Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology by End-Use Sector -
Consumer Electronics, Communications, Aerospace & Defense,
Automotive and Others Markets Independently Analyzed with
Annual Revenue Figures in US$ Million for Years 2015 through
2022 (includes corresponding Graph/Chart) II-43
Table 12: World Historic Review for System-in-Package (SiP)
Technology by End-Use Sector - Consumer Electronics,
Communications, Aerospace & Defense, Automotive and Others
Markets Independently Analyzed with Annual Revenue Figures in
US$ Million for Years 2009 through 2014 (includes
corresponding Graph/Chart) II-44
Table 13: World 14-Year Perspective for System-in-Package
(SiP) Technology by End-Use Sector - Percentage Breakdown of
Revenues for Consumer Electronics, Communications, Aerospace &
Defense, Automotive and Others Markets for Years 2009, 2017
and 2022 (includes corresponding Graph/Chart) II-45
III. MARKET
1. THE UNITED STATES III-1
A.Market Analysis III-1
Outlook III-1
Strategic Corporate Developments III-1
Select Key Players III-1
B.Market Analytics III-3
Table 14: US Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology Market Analyzed with
Annual Revenue Figures in US$ Million for Years 2015 through
2022 (includes corresponding Graph/Chart) III-3
Table 15: US Historic Review for System-in-Package (SiP)
Technology Market Analyzed with Annual Revenue Figures in
US$ Million for Years 2009 through 2014 (includes
corresponding Graph/Chart) III-4
2. CANADA III-5
Market Analysis III-5
Table 16: Canadian Recent Past, Current & Future Analysis
for System-in-Package (SiP) Technology Market Analyzed with
Annual Revenue Figures in US$ Million for Years 2015 through
2022 (includes corresponding Graph/Chart) III-5
Table 17: Canadian Historic Review for System-in-Package
(SiP) Technology Market Analyzed with Annual Revenue Figures
in US$ Million for Years 2009 through 2014 (includes
corresponding Graph/Chart) III-6
3. JAPAN III-7
A.Market Analysis III-7
Outlook III-7
Select Key Players III-7
B.Market Analytics III-8
Table 18: Japanese Recent Past, Current & Future Analysis
for System-in-Package (SiP) Technology Market Analyzed with
Annual Revenue Figures in US$ Million for Years 2015 through
2022 (includes corresponding Graph/Chart) III-8
Table 19: Japanese Historic Review for System-in-Package
(SiP) Technology Market Analyzed with Annual Revenue Figures
in US$ Million for Years 2009 through 2014 (includes
corresponding Graph/Chart) III-9
4. EUROPE III-10
Market Analysis III-10
Table 20: European Recent Past, Current & Future Analysis
for System-in-Package (SiP) Technology by Geographic Region -
France, Germany, Italy, UK and Rest of Europe Markets
Independently Analyzed with Annual Revenue Figures in US$
Million for Years 2015 through 2022 (includes corresponding
Graph/Chart) III-10
Table 21: European Historic Review for System-in-Package
(SiP) Technology by Geographic Region - France, Germany,
Italy, UK and Rest of Europe Markets Independently Analyzed
with Annual Revenue Figures in US$ Million for Years 2009
through 2014 (includes corresponding Graph/Chart) III-11
Table 22: European 14-Year Perspective for System-in-Package
(SiP) Technology by Geographic Region - Percentage Breakdown
of Revenues for France, Germany, Italy, UK and Rest of
Europe Markets for Years 2009, 2017 and 2022 (includes
corresponding Graph/Chart) III-12
4a. FRANCE III-13
A.Market Analysis III-13
Outlook III-13
Insight SiP - A Key French Market Player III-13
B.Market Analytics III-14
Table 23: French Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology Market Analyzed with
Annual Revenue Figures in US$ Million for Years 2015 through
2022 (includes corresponding Graph/Chart) III-14
Table 24: French Historic Review for System-in-Package (SiP)
Technology Market Analyzed with Annual Revenue Figures in
US$ Million for Years 2009 through 2014 (includes
corresponding Graph/Chart) III-15
4b. GERMANY III-16
Market Analysis III-16
Table 25: German Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology Market Analyzed with
Annual Revenue Figures in US$ Million for Years 2015 through
2022 (includes corresponding Graph/Chart) III-16
Table 26: German Historic Review for System-in-Package (SiP)
Technology Market Analyzed with Annual Revenue Figures in
US$ Million for Years 2009 through 2014 (includes
corresponding Graph/Chart) III-17
4c. ITALY III-18
Market Analysis III-18
Table 27: Italian Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology Market Analyzed with
Annual Revenue Figures in US$ Million for Years 2015 through
2022 (includes corresponding Graph/Chart) III-18
Table 28: Italian Historic Review for System-in-Package
(SiP) Technology Market Analyzed with Annual Revenue Figures
in US$ Million for Years 2009 through 2014 (includes
corresponding Graph/Chart) III-19
4d. THE UNITED KINGDOM III-20
Market Analysis III-20
Table 29: UK Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology Market Analyzed with
Annual Revenue Figures in US$ Million for Years 2015 through
2022 (includes corresponding Graph/Chart) III-20
Table 30: UK Historic Review for System-in-Package (SiP)
Technology Market Analyzed with Annual Revenue Figures in
US$ Million for Years 2009 through 2014 (includes
corresponding Graph/Chart) III-21
4e. REST OF EUROPE III-22
A.Market Analysis III-22
Outlook III-22
Strategic Corporate Developments III-22
Select Key Players III-22
B.Market Analytics III-24
Table 31: Rest of Europe Recent Past, Current & Future
Analysis for System-in-Package (SiP) Technology Market
Analyzed with Annual Revenue Figures in US$ Million for
Years 2015 through 2022 (includes corresponding Graph/Chart) III-24
Table 32: Rest of Europe Historic Review for
System-in-Package (SiP) Technology Market Analyzed with
Annual Revenue Figures in US$ Million for Years 2009 through
2014 (includes corresponding Graph/Chart) III-25
5. ASIA-PACIFIC III-26
Market Analysis III-26
Table 33: Asia-Pacific Recent Past, Current & Future
Analysis for System-in-Package (SiP) Technology by
Geographic Region - China and Rest of Asia-Pacific Markets
Independently Analyzed with Annual Revenue Figures in US$
Million for Years 2015 through 2022 (includes corresponding
Graph/Chart) III-26
Table 34: Asia-Pacific Historic Review for System-in-Package
(SiP) Technology by Geographic Region - China and Rest of
Asia-Pacific Markets Independently Analyzed with Annual
Revenue Figures in US$ Million for Years 2009 through 2014
(includes corresponding Graph/Chart) III-27
Table 35: Asia-Pacific 14-Year Perspective for
System-in-Package (SiP) Technology by Geographic Region -
Percentage Breakdown of Revenues for China and Rest of
Asia-Pacific Markets for Years 2009, 2017 and 2022 (includes
corresponding Graph/Chart) III-28
5a. CHINA III-29
A.Market Analysis III-29
Market Overview III-29
Corporate Development III-29
Select Key Players III-29
B.Market Analytics III-30
Table 36: Chinese Recent Past, Current & Future Analysis for
System-in-Package (SiP) Technology Market Analyzed with
Annual Revenue Figures in US$ Million for Years 2015 through
2022 (includes corresponding Graph/Chart) III-30
Table 37: Chinese Historic Review for System-in-Package
(SiP) Technology Market Analyzed with Annual Revenue Figures
in US$ Million for Years 2009 through 2014 (includes
corresponding Graph/Chart) III-31
5b. REST OF ASIA-PACIFIC III-32
A.Market Analysis III-32
Outlook III-32
Strategic Corporate Development III-32
Select Key Players III-32
B.Market Analytics III-36
Table 38: Rest of Asia-Pacific Recent Past, Current & Future
Analysis for System-in-Package (SiP) Technology Market
Analyzed with Annual Revenue Figures in US$ Million for
Years 2015 through 2022 (includes corresponding Graph/Chart) III-36
Table 39: Rest of Asia-Pacific Historic Review for
System-in-Package (SiP) Technology Market Analyzed with
Annual Revenue Figures in US$ Million for Years 2009 through
2014 (includes corresponding Graph/Chart) III-37
6. REST OF WORLD III-38
Market Analysis III-38
Table 40: Rest of World Recent Past, Current & Future
Analysis for System-in-Package (SiP) Technology Market
Analyzed with Annual Revenue Figures in US$ Million for
Years 2015 through 2022 (includes corresponding Graph/Chart) III-38
Table 41: Rest of World Historic Review for
System-in-Package (SiP) Technology Market Analyzed with
Annual Revenue Figures in US$ Million for Years 2009 through
2014 (includes corresponding Graph/Chart) III-39
IV. COMPETITIVE LANDSCAPE
Total Companies Profiled: 51 (including Divisions/Subsidiaries - 53)
The United States (16)
Japan (3)
Europe (8)
- France (4)
- Rest of Europe (4)
Asia-Pacific (Excluding Japan) (25)
Middle East (1)
Additional Information:
This report is offered in PDF format via e-mail. Once downloaded, the PDF can’t be copied to another computer. The user is permitted to print one full copy of the report. Extra copies or licenses may be purchased at 10% of the list price.
Date of Publication:
Mar 20, 2018
File Format:
PDF via E-mail
Number of Pages:
173 Pages
Contact Information
3551 St-Charles Blvd. Suite 558
Kirkland, Quebec
Canada H9H 3C4
Tel: +1 514 425 5596
Fax +1 514 425 4581
Site Information
Ordering Information
Connect With Us
Electronics.ca provides focused market intelligence to its users by categorizing all contents based on main areas of interest which currently influence the electronics industry.
