System-in-Package (SiP) Technology - Global Strategic Business Report

This report analyzes the worldwide markets for System-in-Package (SiP) Technology in US$ Million. The Global market is further analyzed by: Interconnection Technology - Wire Bonding, and Flip-Chip; and End-Use Sector - Consumer Electronics, Communications, Aerospace & Defense, Automotive, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

Also, a six-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 51 companies including many key and niche players such as -

• Amkor Technology, Inc. (USA)
• ASE Group (Taiwan)
• ChipMOS Technologies Inc. (Taiwan)
• Fujitsu Limited (Japan)
• GS Nanotech (Russia)
• Insight SiP (France)
• Intel Corporation (USA)
• Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
• Kulicke & Soffa Pte Ltd. (Singapore)
• Nanium S.A. (Portugal)
• O.C.E. Technology Ltd. (Ireland)
• Powertech Technologies, Inc. (Taiwan)
• Renesas Electronics Corporation (Japan)
• Samsung Electronics Co., Ltd. (South Korea)
• ShunSin Technology (Zhongshan) Limited (China)
• Si2 Microsystems Private Limited (India)
• Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
• STATS ChipPAC Ltd. (Singapore)
• Unimicron Corporation (Taiwan)

System-in-Package (SiP) Technology - Global Strategic Business Report
TABLE OF CONTENTS

 I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

      Study Reliability and Reporting Limitations                       I-1
      Disclaimers                                                       I-2
      Data Interpretation & Reporting Level                             I-2
       Quantitative Techniques & Analytics                              I-3
      Product Definitions and Scope of Study                            I-3
       Interconnection Technology                                       I-3
       End-Use Sector                                                   I-3


 II. EXECUTIVE SUMMARY

  1. INDUSTRY OVERVIEW                                                  II-1
      Small Form Factor, High Performance & Energy Efficiency Needs
       of Electronics Industry Bolster Demand for System-in-Package
        (SiP) Technology                                                II-1
      Growing Demand for Miniature and High Performance Electronic
       Devices & Systems Drive SiP Market                               II-3
       Developing Countries Offer Growth Prospects                      II-4
       Flip Chip Type of Interconnection Technology Leads SiP
        Technology Market                                               II-4
       Consumer Electronics Sector Fuels Revenue Growth in SiP Market   II-5
       Portable Electronic Devices Stir Demand for Flat Packaging       II-5
       2.5D IC Packaging Technology Dominates SiP Market                II-5
      Challenges Confronting the SiP Market                             II-6

  2. MARKET TRENDS & GROWTH DRIVERS                                     II-7
      Importance of SiP Technology in Electronics                       II-7
      Rising Demand for High Performance and Compact Consumer
       Electronics Drive Growth                                         II-7
       List of Select SiP Solutions for Connected Devices               II-9
       Growing Demand for Smart, Energy Efficient Electronics
        Provides Business Case for SiP                                  II-9
       Growing Sales of Smartphones Bode Well for SiP Market            II-9
        Table 1: World Smartphones Market (2015 & 2020): Annual Unit
        Shipments in Thousands by Region/ Country (includes
        corresponding Graph/Chart)                                      II-10
       Growing Demand for Tablet PCs - A Key Growth Driver              II-11
        Table 2: Global Tablet Shipments in ‘000 Units for 2016,
        2018 & 2020 (includes corresponding Graph/Chart)                II-11
       Applications in Set Top Boxes Boosts Demand for SiP Technology   II-11
      Computing Devices - A Key Growth Driver                           II-11
      IoT Opens New Growth Avenues for SiP                              II-12
       Table 3: Rapid Growth of Internet of Things (IoT) Market to
       Fuel Demand for Advanced System-in-Packaging (SiP) Technology - 
       IoT Installed Base in Billions for the Years 2016, 2018 &
       2020 (includes corresponding Graph/Chart)                        II-13
       TSVs for Die-to-Die/Die-to-Package Substrate Communication       II-13
       Advanced Nodes Demand Innovative Package Technologies            II-13
       PCB Considerations Vital for Using SiP in IoT Systems            II-14
       WLCSP for Compact Form Factors                                   II-14
      Trend Towards Smart Homes Offers Growth Opportunities             II-14
       Table 4: Growing Number of Smart Homes Catalyzes
       Semiconductor Companies to Adopt Advanced SiP Technology:
       Number of Smart Homes Worldwide (In 000 Households) by Select
       Country for the Years 2015 & 2020 (includes corresponding
       Graph/Chart)                                                     II-15
      Miniaturization of Electronics - A Major Growth Driver for SiP    II-15
      Need for Compact and High Speed Performance Products Spurs
       Market Growth                                                    II-16
      Shift in Direction towards “More Than Moore’s Law” Benefits
       the SiP Market                                                   II-16
      SMBs Spur the Adoption of SiP                                     II-17
      Expanding Applications in Non- Battery Operated Systems Spur
       Market Growth                                                    II-17
      SoC Design Complexities Bring Focus onto SiP                      II-18
      Combined SoC and SiP Technology Gains Increased Demand            II-19
      Need to Reduce Cost Per Function of ICs Boosts Market Demand      II-19
      Advanced SiP Packaging Transforming System-Level Integration
       Landscape                                                        II-19
       Wafer-Based Advanced SiP                                         II-20
       Laminate-based Advanced SiP                                      II-21
      SiP Technology to Impact Fan-In Packaging Platform                II-21
      Foundries Focus on Offering Turnkey Services with System-in-
       Package                                                          II-22
      Vendors Offer Advanced Capabilities for SiP Design                II-22

  3. TECHNOLOGY OVERVIEW                                                II-24
      System in Package (SiP): A Definition                             II-24
       SiP Configurations, Features and Target Applications             II-25
      Development of SiP                                                II-25
      SiP Packaging                                                     II-26
       Package-on-Package SiP                                           II-26
       Power Quad Flat No-Lead SiP                                      II-26
       Stacked Die SiP                                                  II-26
       System-in-Package Land Grid Array                                II-26
      SiP Benefits                                                      II-26

  4. RECENT INDUSTRY ACTIVITY                                           II-28
      Amkor Announces Product Qualification for SWIFT™ Packaging        II-28
      3D Glass Solutions Collaborates with TE Connectivity              II-28
      Silicon Labs Introduces New Bluetooth SiP Module                  II-28
      MediaTek Unveils SoCs for Fitness and Healthcare Devices          II-28
      Intel Launches Intel® Curie™ Module SiP                           II-28
      Octavo Systems Launches OSD3358 SiP Device                        II-28
      UTAC Collaborates with AT & S                                     II-29
      MediaTek Unveils New SiP Chipsets                                 II-29
      JCET Receives Order to Assemble SiP Modules for Apple             II-29

  5. FOCUS ON SELECT GLOBAL PLAYERS                                     II-30
      Amkor Technology, Inc. (USA)                                      II-30
      ASE Group (Taiwan)                                                II-30
      ChipMOS Technologies Inc. (Taiwan)                                II-30
      Fujitsu Limited (Japan)                                           II-31
      GS Nanotech (Russia)                                              II-31
      Insight SiP (France)                                              II-31
      Intel Corporation (USA)                                           II-32
      Jiangsu Changjiang Electronics Technology Co. Ltd. (China)        II-32
      Kulicke & Soffa Pte Ltd. (Singapore)                              II-33
      Nanium S.A. (Portugal)                                            II-33
      O.C.E. Technology Ltd. (Ireland)                                  II-33
      Powertech Technologies, Inc. (Taiwan)                             II-34
      Renesas Electronics Corporation (Japan)                           II-34
      Samsung Electronics Co., Ltd. (South Korea)                       II-34
      ShunSin Technology (Zhongshan) Limited (China)                    II-35
      Si2 Microsystems Private Limited (India)                          II-35
      Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)         II-35
      STATS ChipPAC Ltd. (Singapore)                                    II-36
      Unimicron Corporation (Taiwan)                                    II-36

  6. GLOBAL MARKET PERSPECTIVE                                          II-37
      Table 5: World Recent Past, Current & Future Analysis for
      System-in-Package (SiP) Technology by Geographic Region - US,
      Canada, Japan, Europe, Asia-Pacific (excluding Japan), and
      Rest of World Markets Independently Analyzed with Annual
      Revenue Figures in US$ Million for Years 2015 through 2022
      (includes corresponding Graph/Chart)                              II-37

      Table 6: World Historic Review for System-in-Package (SiP)
      Technology by Geographic Region - US, Canada, Japan, Europe,
      Asia-Pacific (excluding Japan), and Rest of World Markets
      Independently Analyzed with Annual Revenue Figures in US$
      Million for Years 2009 through 2014 (includes corresponding
      Graph/Chart)                                                      II-38

      Table 7: World 14-Year Perspective for System-in-Package (SiP)
      Technology by Geographic Region - Percentage Breakdown of
      Revenues for US, Canada, Japan, Europe, Asia-Pacific
      (excluding Japan), and Rest of World Markets for Years 2009,
      2017 and 2022 (includes corresponding Graph/Chart)                II-39

      Table 8: World Recent Past, Current & Future Analysis for
      System-in-Package (SiP) Technology by Interconnection
      Technology - Wire Bonding and Flip-Chip Markets Independently
      Analyzed with Annual Revenue Figures in US$ Million for Years
      2015 through 2022 (includes corresponding Graph/Chart)            II-40

      Table 9: World Historic Review for System-in-Package (SiP)
      Technology by Interconnection Technology - Wire Bonding and
      Flip-Chip Markets Independently Analyzed with Annual Revenue
      Figures in US$ Million for Years 2009 through 2014 (includes
      corresponding Graph/Chart)                                        II-41

      Table 10: World 14-Year Perspective for System-in-Package
      (SiP) Technology by Interconnection Technology - Percentage
      Breakdown of Revenues for Wire Bonding and Flip-Chip Markets
      for Years 2009, 2017 and 2022 (includes corresponding
      Graph/Chart)                                                      II-42

      Table 11: World Recent Past, Current & Future Analysis for
      System-in-Package (SiP) Technology by End-Use Sector -
      Consumer Electronics, Communications, Aerospace & Defense,
      Automotive and Others Markets Independently Analyzed with
      Annual Revenue Figures in US$ Million for Years 2015 through
      2022 (includes corresponding Graph/Chart)                         II-43

      Table 12: World Historic Review for System-in-Package (SiP)
      Technology by End-Use Sector - Consumer Electronics,
      Communications, Aerospace & Defense, Automotive and Others
      Markets Independently Analyzed with Annual Revenue Figures in
      US$ Million for Years 2009 through 2014 (includes
      corresponding Graph/Chart)                                        II-44

      Table 13: World 14-Year Perspective for System-in-Package
      (SiP) Technology by End-Use Sector - Percentage Breakdown of
      Revenues for Consumer Electronics, Communications, Aerospace &
      Defense, Automotive and Others Markets for Years 2009, 2017
      and 2022 (includes corresponding Graph/Chart)                     II-45


 III. MARKET

  1. THE UNITED STATES                                                  III-1
      A.Market Analysis                                                 III-1
        Outlook                                                         III-1
        Strategic Corporate Developments                                III-1
        Select Key Players                                              III-1
      B.Market Analytics                                                III-3
        Table 14: US Recent Past, Current & Future Analysis for
        System-in-Package (SiP) Technology Market Analyzed with
        Annual Revenue Figures in US$ Million for Years 2015 through
        2022 (includes corresponding Graph/Chart)                       III-3

        Table 15: US Historic Review for System-in-Package (SiP)
        Technology Market Analyzed with Annual Revenue Figures in
        US$ Million for Years 2009 through 2014 (includes
        corresponding Graph/Chart)                                      III-4

  2. CANADA                                                             III-5
       Market Analysis                                                  III-5
        Table 16: Canadian Recent Past, Current & Future Analysis
        for System-in-Package (SiP) Technology Market Analyzed with
        Annual Revenue Figures in US$ Million for Years 2015 through
        2022 (includes corresponding Graph/Chart)                       III-5

        Table 17: Canadian Historic Review for System-in-Package
        (SiP) Technology Market Analyzed with Annual Revenue Figures
        in US$ Million for Years 2009 through 2014 (includes
        corresponding Graph/Chart)                                      III-6

  3. JAPAN                                                              III-7
      A.Market Analysis                                                 III-7
        Outlook                                                         III-7
        Select Key Players                                              III-7
      B.Market Analytics                                                III-8
        Table 18: Japanese Recent Past, Current & Future Analysis
        for System-in-Package (SiP) Technology Market Analyzed with
        Annual Revenue Figures in US$ Million for Years 2015 through
        2022 (includes corresponding Graph/Chart)                       III-8

        Table 19: Japanese Historic Review for System-in-Package
        (SiP) Technology Market Analyzed with Annual Revenue Figures
        in US$ Million for Years 2009 through 2014 (includes
        corresponding Graph/Chart)                                      III-9

  4. EUROPE                                                             III-10
       Market Analysis                                                  III-10
        Table 20: European Recent Past, Current & Future Analysis
        for System-in-Package (SiP) Technology by Geographic Region - 
        France, Germany, Italy, UK and Rest of Europe Markets
        Independently Analyzed with Annual Revenue Figures in US$
        Million for Years 2015 through 2022 (includes corresponding
        Graph/Chart)                                                    III-10

        Table 21: European Historic Review for System-in-Package
        (SiP) Technology by Geographic Region - France, Germany,
        Italy, UK and Rest of Europe Markets Independently Analyzed
        with Annual Revenue Figures in US$ Million for Years 2009
        through 2014 (includes corresponding Graph/Chart)               III-11

        Table 22: European 14-Year Perspective for System-in-Package
        (SiP) Technology by Geographic Region - Percentage Breakdown
        of Revenues for France, Germany, Italy, UK and Rest of
        Europe Markets for Years 2009, 2017 and 2022 (includes
        corresponding Graph/Chart)                                      III-12

  4a. FRANCE                                                            III-13
      A.Market Analysis                                                 III-13
        Outlook                                                         III-13
        Insight SiP - A Key French Market Player                        III-13
      B.Market Analytics                                                III-14
        Table 23: French Recent Past, Current & Future Analysis for
        System-in-Package (SiP) Technology Market Analyzed with
        Annual Revenue Figures in US$ Million for Years 2015 through
        2022 (includes corresponding Graph/Chart)                       III-14

        Table 24: French Historic Review for System-in-Package (SiP)
        Technology Market Analyzed with Annual Revenue Figures in
        US$ Million for Years 2009 through 2014 (includes
        corresponding Graph/Chart)                                      III-15

  4b. GERMANY                                                           III-16
       Market Analysis                                                  III-16
        Table 25: German Recent Past, Current & Future Analysis for
        System-in-Package (SiP) Technology Market Analyzed with
        Annual Revenue Figures in US$ Million for Years 2015 through
        2022 (includes corresponding Graph/Chart)                       III-16

        Table 26: German Historic Review for System-in-Package (SiP)
        Technology Market Analyzed with Annual Revenue Figures in
        US$ Million for Years 2009 through 2014 (includes
        corresponding Graph/Chart)                                      III-17

  4c. ITALY                                                             III-18
       Market Analysis                                                  III-18
        Table 27: Italian Recent Past, Current & Future Analysis for
        System-in-Package (SiP) Technology Market Analyzed with
        Annual Revenue Figures in US$ Million for Years 2015 through
        2022 (includes corresponding Graph/Chart)                       III-18

        Table 28: Italian Historic Review for System-in-Package
        (SiP) Technology Market Analyzed with Annual Revenue Figures
        in US$ Million for Years 2009 through 2014 (includes
        corresponding Graph/Chart)                                      III-19

  4d. THE UNITED KINGDOM                                                III-20
       Market Analysis                                                  III-20
        Table 29: UK Recent Past, Current & Future Analysis for
        System-in-Package (SiP) Technology Market Analyzed with
        Annual Revenue Figures in US$ Million for Years 2015 through
        2022 (includes corresponding Graph/Chart)                       III-20

        Table 30: UK Historic Review for System-in-Package (SiP)
        Technology Market Analyzed with Annual Revenue Figures in
        US$ Million for Years 2009 through 2014 (includes
        corresponding Graph/Chart)                                      III-21

  4e. REST OF EUROPE                                                    III-22
      A.Market Analysis                                                 III-22
        Outlook                                                         III-22
        Strategic Corporate Developments                                III-22
        Select Key Players                                              III-22
      B.Market Analytics                                                III-24
        Table 31: Rest of Europe Recent Past, Current & Future
        Analysis for System-in-Package (SiP) Technology Market
        Analyzed with Annual Revenue Figures in US$ Million for
        Years 2015 through 2022 (includes corresponding Graph/Chart)    III-24

        Table 32: Rest of Europe Historic Review for
        System-in-Package (SiP) Technology Market Analyzed with
        Annual Revenue Figures in US$ Million for Years 2009 through
        2014 (includes corresponding Graph/Chart)                       III-25

  5. ASIA-PACIFIC                                                       III-26
       Market Analysis                                                  III-26
        Table 33: Asia-Pacific Recent Past, Current & Future
        Analysis for System-in-Package (SiP) Technology by
        Geographic Region - China and Rest of Asia-Pacific Markets
        Independently Analyzed with Annual Revenue Figures in US$
        Million for Years 2015 through 2022 (includes corresponding
        Graph/Chart)                                                    III-26

        Table 34: Asia-Pacific Historic Review for System-in-Package
        (SiP) Technology by Geographic Region - China and Rest of
        Asia-Pacific Markets Independently Analyzed with Annual
        Revenue Figures in US$ Million for Years 2009 through 2014
        (includes corresponding Graph/Chart)                            III-27

        Table 35: Asia-Pacific 14-Year Perspective for
        System-in-Package (SiP) Technology by Geographic Region -
        Percentage Breakdown of Revenues for China and Rest of
        Asia-Pacific Markets for Years 2009, 2017 and 2022 (includes
        corresponding Graph/Chart)                                      III-28

  5a. CHINA                                                             III-29
      A.Market Analysis                                                 III-29
        Market Overview                                                 III-29
        Corporate Development                                           III-29
        Select Key Players                                              III-29
      B.Market Analytics                                                III-30
        Table 36: Chinese Recent Past, Current & Future Analysis for
        System-in-Package (SiP) Technology Market Analyzed with
        Annual Revenue Figures in US$ Million for Years 2015 through
        2022 (includes corresponding Graph/Chart)                       III-30

        Table 37: Chinese Historic Review for System-in-Package
        (SiP) Technology Market Analyzed with Annual Revenue Figures
        in US$ Million for Years 2009 through 2014 (includes
        corresponding Graph/Chart)                                      III-31

  5b. REST OF ASIA-PACIFIC                                              III-32
      A.Market Analysis                                                 III-32
        Outlook                                                         III-32
        Strategic Corporate Development                                 III-32
        Select Key Players                                              III-32
      B.Market Analytics                                                III-36
        Table 38: Rest of Asia-Pacific Recent Past, Current & Future
        Analysis for System-in-Package (SiP) Technology Market
        Analyzed with Annual Revenue Figures in US$ Million for
        Years 2015 through 2022 (includes corresponding Graph/Chart)    III-36

        Table 39: Rest of Asia-Pacific Historic Review for
        System-in-Package (SiP) Technology Market Analyzed with
        Annual Revenue Figures in US$ Million for Years 2009 through
        2014 (includes corresponding Graph/Chart)                       III-37

  6. REST OF WORLD                                                      III-38
       Market Analysis                                                  III-38
        Table 40: Rest of World Recent Past, Current & Future
        Analysis for System-in-Package (SiP) Technology Market
        Analyzed with Annual Revenue Figures in US$ Million for
        Years 2015 through 2022 (includes corresponding Graph/Chart)    III-38

        Table 41: Rest of World Historic Review for
        System-in-Package (SiP) Technology Market Analyzed with
        Annual Revenue Figures in US$ Million for Years 2009 through
        2014 (includes corresponding Graph/Chart)                       III-39


 IV. COMPETITIVE LANDSCAPE

     Total Companies Profiled: 51 (including Divisions/Subsidiaries - 53)

     The United States (16)
     Japan (3)
     Europe (8)
     - France (4)
     - Rest of Europe (4)
     Asia-Pacific (Excluding Japan) (25)
     Middle East (1)