Technology, Equipment and Materials

US$613.00
Date of Publication: Jul 17, 2017

IPC-6010-FAM, "Printed Board Performance Specifications" includes qualification and performance specification standards for all major types of printed boards.


US$420.00
Date of Publication: Jul 17, 2017

CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies. This is a family of IPC documents for coatings used in the printed board fabrication and assembly processes.


US$533.00
Date of Publication: Jul 17, 2017
7090-FAM, IPC 7090-FAM is a family of specifications for design and assembly process implementation for SMT components.

US$702.00
Date of Publication: Jul 17, 2017
"Base Materials Specifications for Printed Boards", BdMATFAM - is a family of specifications for board materials used in the fabrication process.

US$160.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

US$4,950.00
Date of Publication: May 24, 2017
This report analyzes the worldwide markets for 3D Printing in US$ Thousand by the following types: 3D Printing Equipment, 3D Printing Services, and Others. The Global market is also analyzed by the following End-Use Segments: Automotive, Aerospace, Consumer Products, Medical, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World.

US$1,350.00
Date of Publication: May 10, 2017
Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties (thickness, layer count, heat dissipation, tolerances), miniaturization (line width and spacing, I/O pitch, via diameters, aspect ratios, via structure, etc.), materials (rigid, flexible, stretchable, metal core, reinforcement, thermal properties, loss characteristics, lead-free, halogen-free, surface finishes, etc.), special structures (embedding, optical channels, chip packages, etc.), printed electronics usage (types, processes, applications and use of 3D printing), traceability, compliance and technical challenges, and general trends.