Technology, Equipment and Materials

US$160.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

US$4,950.00
Date of Publication: May 24, 2017
This report analyzes the worldwide markets for 3D Printing in US$ Thousand by the following types: 3D Printing Equipment, 3D Printing Services, and Others. The Global market is also analyzed by the following End-Use Segments: Automotive, Aerospace, Consumer Products, Medical, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World.

US$1,350.00
Date of Publication: May 10, 2017
Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties (thickness, layer count, heat dissipation, tolerances), miniaturization (line width and spacing, I/O pitch, via diameters, aspect ratios, via structure, etc.), materials (rigid, flexible, stretchable, metal core, reinforcement, thermal properties, loss characteristics, lead-free, halogen-free, surface finishes, etc.), special structures (embedding, optical channels, chip packages, etc.), printed electronics usage (types, processes, applications and use of 3D printing), traceability, compliance and technical challenges, and general trends.

US$4,995.00
Date of Publication: Mar 28, 2017
This report examines and projects the technology of equipment and materials involved in the fabrication of VLSI semiconductor devices, their likely developments, why and when their introduction or demise will take place, what problems and choices are facing users, and where the opportunities and pitfalls are.

US$4,950.00
Date of Publication: Mar 17, 2017
This report analyzes the worldwide markets for Surface Mount Technology (SMT) Equipment in US$ Thousands by the following Product Groups/Segments: Screen Print Equipment (Manual Screen Print Equipment, Semiautomatic Screen Print Equipment, & Automatic Screen Print Equipment), Placement Equipment Market (High-Speed Placement Equipment, Medium Speed Placement Equipment, & Low-Speed Placement Equipment), Soldering Equipment (Reflow Oven, & Wave Oven), Cleaning Equipment, Inspection Equipment (Optical Inspection Equipment, X-Ray Inspection Equipment, & Laser Inspection Equipment), and Repair and Rework Equipment (Manual Repair and Rework Equipment, & Semiautomatic Repair and Rework Equipment).  The report provides separate comprehensive analytics for the US, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

US$5,650.00
Date of Publication: Mar 15, 2017
The surface mount technology ecosystem comprises material and chip processing component manufacturers including Ohmite Manufacturing Co. LLC (U.S.), Applied Image, Inc. (U.S.), and KBC Electronics, Inc. (U.S.), manufacturing and assembly, module packaging. The players involved in the development of surface mount technology systems include Fuji Machine Manufacturing Co., Ltd.(Japan), Hitachi High-Technologies Corporation (Japan), Mycronic AB (Sweden), Nordson Corporation (U.S.), and Orbotech Ltd. (Israel) as well as associations such as the Surface Mount Technology Association.

US$160.00
Date of Publication: May 12, 2016
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This lates revision, IPC A-610F includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria.